公开(公告)号：US10462391B2

公开(公告)日：2019-10-29

申请号：US15210056

申请日：2016-07-14

Applicant: KLA-Tencor Corporation

Inventor： Yung-Ho Alex Chuang ,  David L. Brown ,  Devis Contarato ,  John Fielden ,  Daniel I. Kavaldjiev ,  Guoheng Zhao ,  Jehn-Huar Chern ,  Guowu Zheng ,  Donald W. Pettibone ,  Stephen Biellak

IPC: H04N5/335 ,  G01N21/95 ,  G06T7/00 ,  H04N5/225 ,  H04N5/347 ,  H04N5/378 ,  H04N5/3745 ,  H04N5/376 ,  G01N21/956

Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.

公开(公告)号：US08786850B2

公开(公告)日：2014-07-22

申请号：US13662626

申请日：2012-10-29

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George Kren

IPC: G01N21/00 ,  G01N21/88 ,  G01B11/00

CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。

公开(公告)号：US20140118730A1

公开(公告)日：2014-05-01

申请号：US14062832

申请日：2013-10-24

Applicant: KLA-Tencor Corporation

Inventor： Daniel Ivanov Kavaldjiev ,  Stephen Biellak ,  Guoheng Zhao ,  Mehdi Vaez-Iravani

IPC: G01N21/95 ,  H01L27/144

CPC classification number: G01N21/9501 ,  H01L27/1446

Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.

Abstract translation: 介绍了提高高灵敏度检测系统动态范围的方法和系统。 高灵敏度检测系统的动态范围通过将从晶片检查区域的每个像素收集的光的一部分引导到以盖革模式操作的雪崩光电二极管（APD）阵列并且引导从每个 晶片检查区域的像素朝向具有较大范围的另一个光电检测器阵列。 以Geiger模式操作的APD阵列对于检查产生极低光子数的表面是有用的，而其他光电探测器可用于检查产生更大数量的散射光子的较大缺陷。 在一些实施例中，检测到的光场在两个不同的检测器之间被分开。 在一些其他实施例中，单个检测器包括以盖革模式操作的APD和具有较大范围的其它光电探测器。

公开(公告)号：US10923526B2

公开(公告)日：2021-02-16

申请号：US16355265

申请日：2019-03-15

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chem ,  Stephen Biellak

IPC: H01L27/148 ,  H01L27/146 ,  H04B3/32 ,  H04N5/357 ,  G06F1/10 ,  H03L7/081 ,  H04N5/376

Abstract: First and second images of a semiconductor die or portion thereof are generated. Generating each image includes performing a respective instance of time-domain integration (TDI) along a plurality of pixel columns in an imaging sensor, while illuminating the imaging sensor with light scattered from the semiconductor die or portion thereof. The plurality of pixel columns comprises pairs of pixel columns in which the pixel columns are separated by respective channel stops. While performing a first instance of TDI to generate the first image, a first bias is applied to electrically conductive contacts of the channel stops. While performing a second instance of TDI to generate the second image, a second bias is applied to the electrically conductive contacts of the channel stops. Defects in the semiconductor die or portion thereof are identified using the first and second images.

公开(公告)号：US10903258B2

公开(公告)日：2021-01-26

申请号：US16153495

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/146 ,  H01L27/148

Abstract: A back-illuminated image sensor includes a first pixel, a second pixel, and a channel stop situated between the first pixel and the second pixel to isolate the first pixel from the second pixel. The channel stop includes a LOCOS structure and a region of doped silicon beneath the LOCOS structure. The back-illuminated image sensor also includes a first electrically conductive contact that extends through the LOCOS structure and forms an ohmic contact with the region of doped silicon. The first electrically conductive contact may be grounded, negatively biased, or positively biased, depending on the application.

公开(公告)号：US20190109163A1

公开(公告)日：2019-04-11

申请号：US16153495

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/146 ,  H01L27/148

Abstract: A back-illuminated image sensor includes a first pixel, a second pixel, and a channel stop situated between the first pixel and the second pixel to isolate the first pixel from the second pixel. The channel stop includes a LOCOS structure and a region of doped silicon beneath the LOCOS structure. The back-illuminated image sensor also includes a first electrically conductive contact that extends through the LOCOS structure and forms an ohmic contact with the region of doped silicon. The first electrically conductive contact may be grounded, negatively biased, or positively biased, depending on the application.

公开(公告)号：US09915622B2

公开(公告)日：2018-03-13

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

公开(公告)号：US09666419B2

公开(公告)日：2017-05-30

申请号：US13957890

申请日：2013-08-02

Applicant: KLA-Tencor Corporation

Inventor： Ximan Jiang ,  Qing Li ,  Stephen Biellak

IPC: H01J40/16 ,  H01J31/50

CPC classification number: H01J40/16 ,  H01J31/50

Abstract: The disclosure is directed to image intensifier tube designs for field curvature aberration correction and ion damage reduction. In some embodiments, electrodes defining an acceleration path from a photocathode to a scintillating screen are configured to provide higher acceleration for off-axis electrons along at least a portion of the acceleration path. Off-axis electrons and on-axis electrons are accordingly focused on the scintillating screen with substantial uniformity to prevent or reduce field curvature aberration. In some embodiments, the electrodes are configured to generate a repulsive electric field near the scintillating screen to prevent secondary electrons emitted or deflected by the scintillating screen from flowing towards the photocathode and forming damaging ions.

公开(公告)号：US20160334516A1

公开(公告)日：2016-11-17

申请号：US14946563

申请日：2015-11-19

Applicant: KLA-Tencor Corporation

Inventor： Ximan Jiang ,  Anatoly Romanovsky ,  Christian Wolters ,  Stephen Biellak

IPC: G01T1/208 ,  G01T1/24

CPC classification number: G01T1/24 ,  G01N21/9501

Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.

Abstract translation: 具有辐射诱导的假计数减轻的检查系统包括被配置为照亮样本的照明源，检测器组件，包括被配置为检测来自样品的照明的照明传感器，以及被配置为检测粒子辐射的一个或多个辐射传感器，以及控制电路 通信地耦合到检测器。 控制电路被配置为执行以下步骤：基于从辐射传感器接收的一个或多个辐射信号来确定一组辐射检测事件，基于从照明传感器接收的照明信号确定一组成像事件，将该组 的辐射检测事件发生到所述一组成像事件以产生一组重合事件，其中所述一致事件包括同时成像和辐射检测事件，并且从所述一组成像事件中排除所述一致事件组合以产生一组 发现缺陷点。

公开(公告)号：US09355440B1

公开(公告)日：2016-05-31

申请号：US13649080

申请日：2012-10-10

Applicant: KLA-Tencor Corporation

Inventor： Haiguang Chen ,  Michael D. Kirk ,  Stephen Biellak ,  Jaydeep Sinha

IPC: G06T7/00 ,  G01N21/88

CPC classification number: G06T7/0012 ,  G01N21/8851 ,  G01N21/95623 ,  G01N2021/8887 ,  G06K9/4633 ,  G06K2209/19 ,  G06T7/0004 ,  G06T7/60 ,  G06T2207/20056 ,  G06T2207/20061 ,  G06T2207/30148

Abstract: Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.

Abstract translation: 提供了用于检测相对噪声检查数据中选定缺陷的方法和系统。 一种方法包括将空间滤波器算法应用于跨越衬底上的区域获取的数据，以确定检查数据的第一部分与检查数据的第二部分相比具有较高选择类型的缺陷概率。 所选择的缺陷类型包括非点缺陷。 通过组合对应于基板上基本上相同的位置的两个或更多个原始检查数据来生成检查数据。 该方法还包括生成示出检查数据的第一部分的二维映射。 该方法还包括搜索具有近似匹配所选类型的缺陷的空间特征的空间特征的事件的二维地图，并且确定该事件是否对应于具有所选类型的缺陷。