公开(公告)号：US20180226304A1

公开(公告)日：2018-08-09

申请号：US15622629

申请日：2017-06-14

Applicant: KLA-Tencor Corporation

Inventor： Dengpeng Chen ,  Andrew Zeng

IPC: H01L21/66 ,  G01B9/02 ,  G01B21/30 ,  G01B21/08 ,  H01L21/67

CPC classification number: H01L22/12 ,  G01B9/02007 ,  G01B9/02021 ,  G01B11/06 ,  G01B11/306 ,  G01B21/08 ,  G01B2290/70 ,  H01L21/67253

Abstract: The system includes a dual interferometer sub-system configured to measure flatness across a substrate. The system includes a mass sensor configured to measure the mass of the substrate. The system includes a controller communicatively coupled to the dual interferometer sub-system and the mass sensor. The controller includes one or more processors. The one or more processor are configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to determine a thickness distribution of at least one of the substrate or a film deposited on the substrate as a function of position across the substrate based on one or more flatness measurements from the dual interferometer sub-system and one or more mass measurements from the mass sensor.

公开(公告)号：US20180195855A1

公开(公告)日：2018-07-12

申请号：US15649259

申请日：2017-07-13

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Andrew Zeng

IPC: G01B11/06 ,  G01B11/24 ,  G01N21/95 ,  G01N21/956 ,  G01N21/84

Abstract: A system includes one or more wafer geometry measurement tools configured to obtain geometry measurements from a wafer. The system also includes one or more processors in communication with the one or more wafer geometry measurement tools. The one or more processors are configured to apply a correction model to correct the geometry measurements obtained by the one or more wafer geometry measurement tools. The correction model is configured to correct measurement errors caused by a transparent film positioned on the wafer.

公开(公告)号：US20150192404A1

公开(公告)日：2015-07-09

申请号：US14661718

申请日：2015-03-18

Applicant: KLA-Tencor Corporation

Inventor： Shouhong Tang ,  Andrew Zeng ,  Chunhai Wang ,  Yaroslov Dudin ,  Steve Yifeng Cui ,  Jei-Fei Zheng ,  Yi Zhang

IPC: G01B9/02 ,  G01B11/24 ,  G01B11/02

CPC classification number: G01B9/02072 ,  G01B3/30 ,  G01B9/02021 ,  G01B9/02027 ,  G01B11/06 ,  G01B11/2441 ,  G01B21/042 ,  G01B2210/44 ,  G01B2210/48

Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a first distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the first distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.

Abstract translation: 公开了一种用于校准干涉仪系统的校准晶片和方法。 校准方法包括：基于两个相对强度的帧确定校准晶片中限定的孔的位置; 比较孔的位置与使用外部测量装置测量的位置; 至少部分地基于比较结果调整第一光学倍率或第二光学倍率; 基于孔的位置的比较，为第一和第二强度帧中的每一个定义第一失真图; 通过对所述第一和第二强度帧中的每一个通过映射拟合所述第一失真图来生成扩展失真图; 以及利用所述第一和第二强度帧中的每一个的所述扩展失真图来减少随后测量过程中的注册误差或光学失真中的至少一个。

公开(公告)号：US10236222B2

公开(公告)日：2019-03-19

申请号：US15622629

申请日：2017-06-14

Applicant: KLA-Tencor Corporation

Inventor： Dengpeng Chen ,  Andrew Zeng

IPC: H01L29/40 ,  H01L21/44 ,  H01L21/66 ,  H01L21/67 ,  G01B21/08

Abstract: The system includes a dual interferometer sub-system configured to measure flatness across a substrate. The system includes a mass sensor configured to measure the mass of the substrate. The system includes a controller communicatively coupled to the dual interferometer sub-system and the mass sensor. The controller includes one or more processors. The one or more processors are configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to determine a thickness distribution of at least one of the substrate or a film deposited on the substrate as a function of position across the substrate based on one or more flatness measurements from the dual interferometer sub-system and one or more mass measurements from the mass sensor.

公开(公告)号：US10571248B2

公开(公告)日：2020-02-25

申请号：US15649259

申请日：2017-07-13

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Andrew Zeng

IPC: G01B11/06 ,  G01B11/24 ,  G01N21/84 ,  G01N21/956 ,  G01N21/95

Abstract: A system includes one or more wafer geometry measurement tools configured to obtain geometry measurements from a wafer. The system also includes one or more processors in communication with the one or more wafer geometry measurement tools. The one or more processors are configured to apply a correction model to correct the geometry measurements obtained by the one or more wafer geometry measurement tools. The correction model is configured to correct measurement errors caused by a transparent film positioned on the wafer.