MASSIVE MEASUREMENT SAMPLING USING MULTIPLE CHUCKS AND OPTICAL COLUMNS

    公开(公告)号:US20250138435A1

    公开(公告)日:2025-05-01

    申请号:US18383612

    申请日:2023-10-25

    Abstract: A measurement system may include two or more sets of optical sub-systems to simultaneously generate measurement data on two or more samples, a coarse translation stage providing motion along a plane, two or more fine translation stages disposed on the coarse translation stage arranged in a common pattern as the two or more sets of optical sub-systems, where each of the fine translation stages provides motion along the plane and is arranged to position one of the two or more samples under one of the two or more sets of optical sub-systems. The system may further include a controller to independently direct each of the fine translation stages and the associated one of the optical sub-systems to generate measurement data for the respective samples, and generate one or more measurements for the samples based on the associated measurement data.

    SELF-CALIBRATING OVERLAY METROLOGY

    公开(公告)号:US20220357673A1

    公开(公告)日:2022-11-10

    申请号:US17488010

    申请日:2021-09-28

    Abstract: A self-calibrating overlay metrology system may receive device overlay data from device targets on a sample, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data from sets of assist targets on the sample including device-scale features, where a particular set of assist targets includes one or more target pairs formed with two overlay targets having programmed overlay offsets of a selected value with opposite signs along a particular measurement direction. The system may further determine self-calibrating assist overlay measurements for the sets of assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.

    SELF-CALIBRATED OVERLAY METROLOGY USING A SKEW TRAINING SAMPLE

    公开(公告)号:US20220412734A1

    公开(公告)日:2022-12-29

    申请号:US17473742

    申请日:2021-09-13

    Abstract: An overlay metrology system may receive overlay data for in-die overlay targets within various fields on a skew training sample from one or more overlay metrology tools, wherein the in-die overlay targets within the fields have a range programmed overlay offsets, wherein the fields are fabricated with a range of programmed skew offsets. The system may further generate asymmetric target signals for the in-die overlay targets using an asymmetric function providing a value of zero when physical overlay is zero and a sign indicative of a direction of physical overlay. The system may further generate corrected overlay offsets for the in-die overlay targets on the asymmetric target signals, generate self-calibrated overlay offsets for the in-die overlay targets based on the programmed overlay offsets and the corrected overlay offsets, generate a trained overlay recipe, and generate overlay measurements for in-die overlay targets on additional samples using the trained overlay recipe.

    PARALLEL SCANNING OVERLAY METROLOGY WITH OPTICAL META-SURFACES

    公开(公告)号:US20240337606A1

    公开(公告)日:2024-10-10

    申请号:US18624444

    申请日:2024-04-02

    CPC classification number: G01N21/9501

    Abstract: A device may one or more optical elements configured to direct illumination to a sample and collect sample light from the sample in response to the illumination, where at least one of the one or more optical elements include one or more metasurfaces configured to manipulate at least one of the illumination or sample light using sub-wavelength features, where the sub-wavelength features are smaller than at least some wavelengths in at least one of the illumination or the sample light being manipulated, and where the one or more optical elements provide optical power for at least one of focusing the illumination on the sample or collecting the sample light from the sample.

    Self-calibrating overlay metrology

    公开(公告)号:US11604420B2

    公开(公告)日:2023-03-14

    申请号:US17488010

    申请日:2021-09-28

    Abstract: A self-calibrating overlay metrology system may receive device overlay data from device targets on a sample, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data from sets of assist targets on the sample including device-scale features, where a particular set of assist targets includes one or more target pairs formed with two overlay targets having programmed overlay offsets of a selected value with opposite signs along a particular measurement direction. The system may further determine self-calibrating assist overlay measurements for the sets of assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.

    Self-calibrated overlay metrology using a skew training sample

    公开(公告)号:US11604063B2

    公开(公告)日:2023-03-14

    申请号:US17473742

    申请日:2021-09-13

    Abstract: An overlay metrology system may receive overlay data for in-die overlay targets within various fields on a skew training sample from one or more overlay metrology tools, wherein the in-die overlay targets within the fields have a range programmed overlay offsets, wherein the fields are fabricated with a range of programmed skew offsets. The system may further generate asymmetric target signals for the in-die overlay targets using an asymmetric function providing a value of zero when physical overlay is zero and a sign indicative of a direction of physical overlay. The system may further generate corrected overlay offsets for the in-die overlay targets on the asymmetric target signals, generate self-calibrated overlay offsets for the in-die overlay targets based on the programmed overlay offsets and the corrected overlay offsets, generate a trained overlay recipe, and generate overlay measurements for in-die overlay targets on additional samples using the trained overlay recipe.

    MASSIVE OVERLAY METROLOGY SAMPLING WITH MULTIPLE MEASUREMENT COLUMNS

    公开(公告)号:US20240027919A1

    公开(公告)日:2024-01-25

    申请号:US18376703

    申请日:2023-10-04

    CPC classification number: G03F7/70633 G03F9/7084 H01J37/3045

    Abstract: A multi-column metrology tool may include two or more measurement columns distributed along a column direction, where the two or more measurement columns simultaneously probe two or more measurement regions on a sample including metrology targets. A measurement column may include an illumination sub-system to direct illumination to the sample, a collection sub-system including a collection lens to collect measurement signals from the sample and direct it to one or more detectors, and a column-positioning sub-system to adjust a position of the collection lens. A measurement region of a measurement column may be defined by a field of view of the collection lens and a range of the positioning system in the lateral plane. The tool may further include a sample-positioning sub-system to scan the sample along a scan path different than the column direction to position metrology targets within the measurement regions of the measurement columns for measurements.

    Self-calibrating overlay metrology
    10.
    发明授权

    公开(公告)号:US11880142B2

    公开(公告)日:2024-01-23

    申请号:US18118420

    申请日:2023-03-07

    CPC classification number: G03F7/70633 G03F7/70516 G03F7/70775

    Abstract: A self-calibrating overlay metrology system may receive device overlay data for a device targets on a sample from an overlay metrology tool, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data for one or more assist targets on the sample including device-scale features from the overlay metrology tool, where at least one of the one or more assist targets has a programmed overlay offset of a selected value along a particular measurement direction, determine self-calibrating assist overlay measurements for the one or more assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.

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