公开(公告)号：US20250146961A1

公开(公告)日：2025-05-08

申请号：US18430350

申请日：2024-02-01

Applicant: KLA Corporation

Inventor： Daniel James Haxton ,  Christopher Liman ,  InKyo Kim ,  Boxue Chen ,  Hyowon Park ,  Thaddeus Gerard Dziura ,  Nakyoon Kim ,  Houssam Chouaib ,  Anderson Chou ,  Dimitry Sanko

IPC: G01N23/20 ,  G01N21/95

Abstract: Methods and systems for determining random variation in one or more structures on a specimen are provided. One method includes determining characteristic(s) of output generated by an output acquisition subsystem for structure(s) formed on a specimen and simulating the characteristic(s) of the output with initial parameter values for the structure(s). The method also includes determining parameter values of the structure(s) formed on the specimen as the initial parameter values that resulted in the simulated characteristic(s) that best match the determined characteristic(s). The determined parameter values are responsive to random variation in parameter(s) of the structure(s) on the specimen.

公开(公告)号：US20250146893A1

公开(公告)日：2025-05-08

申请号：US18936993

申请日：2024-11-04

Applicant: KLA CORPORATION

Inventor： Houssam Chouaib ,  Zhengquan Tan ,  Shova Subedi ,  Shankar Krishnan ,  David Y. Wang ,  Oleg Shulepov ,  Kevin Peterlinz ,  Natalia Malkova ,  Dawei Hu ,  Carlos Ygartua ,  Isvar Cordova ,  Eric Cheek ,  Roman Sappey ,  Anderson Chou

IPC: G01L1/24 ,  G01B11/06 ,  G01B11/24

Abstract: A workpiece is measured using multiple-pass spectroscopic ellipsometry and multi-wavelength Raman spectroscopy, which may be performed in the same system. These measurements are combined to form combined measured data. A stress measurement of the workpiece is determined using the combined measured data. The stress measurement can be determined using a model or a machine learning algorithm.

公开(公告)号：US20250123225A1

公开(公告)日：2025-04-17

申请号：US18613874

申请日：2024-03-22

Applicant: KLA Corporation

Inventor： Houssam Chouaib ,  Zhengquan Tan ,  HaoMiao Chang ,  Valeria Dimastrodonato ,  Anderson Chou ,  Boxue Chen

IPC: G01N23/2251

Abstract: An inspection system may receive first measurement data of training samples after a first process step with an in-line measurement sub-system, where the first process step is prior to fabrication of a test feature on the one or more training samples; and receive second measurement data of the test feature after a second process step, where the second process step is after fabrication of the test feature. An inspection system may determine delta metrics associated with the first and second measurement data for the test feature. An inspection system may generate a measurement model for determining metrology measurements of the test feature based on at least one of the second measurement data or the delta metrics. An inspection system may determine values of the metrology measurements for additional instances of the test feature based on at least one of the second measurement data or the delta metrics.

公开(公告)号：US20250012734A1

公开(公告)日：2025-01-09

申请号：US18743118

申请日：2024-06-14

Applicant: KLA Corporation

Inventor： Zhengquan Tan ,  Houssam Chouaib ,  Anderson Chou

IPC: G01N21/95 ,  G01N21/88 ,  H01L21/66

Abstract: Methods and systems for performing multiple pass optical measurements of semiconductor structures are presented herein. A measurement beam is incident on the surface of a semiconductor wafer more than once. In some embodiments, the measurement beam is incident multiple times at the same measurement site on the semiconductor wafer in an optical path between the illumination source and the detector. In some other embodiments, the measurement beam is incident at different measurement sites on the semiconductor wafer in an optical path between the illumination source and the detector. In these embodiments, an instance of the same nominal structure under measurement is fabricated at each different measurement site. In a further aspect, an optical modulation element is disposed in the measurement path. In another further aspect, multiple pass measurements using different combinations of optical modulation targets are combined in a multi-target measurement to further enhance measurement sensitivity and break correlations.