公开(公告)号：US09658283B2

公开(公告)日：2017-05-23

申请号：US14669783

申请日：2015-03-26

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Jui-Che Chou ,  Meng-Kung Lu ,  Chin-Yi Ou Yang

IPC: G01R31/28 ,  H05K7/20

CPC classification number: G01R31/2877 ,  G01R31/2874 ,  H05K7/20136 ,  H05K7/20254

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

公开(公告)号：US20240192268A1

公开(公告)日：2024-06-13

申请号：US18511638

申请日：2023-11-16

Applicant: CHROMA ATE INC.

Inventor： Yu-Wei Chuang ,  Xin-Yi Wu ,  Jui-Che Chou

IPC: G01R31/28 ,  G05D23/20 ,  H01L21/66

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G05D23/20 ,  H01L22/12

Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.