公开(公告)号：US12093014B2

公开(公告)日：2024-09-17

申请号：US17580705

申请日：2022-01-21

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Wei-Cheng Kuo ,  Chien-Ming Chen ,  Xin-Yi Wu

IPC: G05B19/401 ,  G01B21/04

CPC classification number: G05B19/401 ,  G01B21/042

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

公开(公告)号：US12253541B2

公开(公告)日：2025-03-18

申请号：US18050500

申请日：2022-10-28

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Xin-Yi Wu ,  I-Ching Tsai ,  Chin-Yi Ouyang

IPC: G01R1/04 ,  G01R31/28

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

公开(公告)号：US11169178B2

公开(公告)日：2021-11-09

申请号：US17023445

申请日：2020-09-17

Applicant: Chroma Ate Inc.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Bo-An Su ,  Yu-Hsuen Wang

IPC: G01R1/04

Abstract: The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.

公开(公告)号：US11901213B2

公开(公告)日：2024-02-13

申请号：US17521952

申请日：2021-11-09

Applicant: Chroma Ate Inc.

Inventor： Chien-Ming Chen ,  Chin-Yi Ouyang

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6838 ,  H01L21/673 ,  H01L21/67144 ,  H01L21/67259 ,  H01L21/67775

Abstract: The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

公开(公告)号：US20230023844A1

公开(公告)日：2023-01-26

申请号：US17580705

申请日：2022-01-21

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Wei-Cheng Kuo ,  Chien-Ming Chen ,  Xin-Yi Wu

IPC: G05B19/401 ,  G01B21/04

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

公开(公告)号：US12180018B2

公开(公告)日：2024-12-31

申请号：US17822816

申请日：2022-08-29

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen

IPC: B65G47/90 ,  G01N3/04 ,  G01R31/28 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683 ,  H05K13/04

Abstract: The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

公开(公告)号：US20200081060A1

公开(公告)日：2020-03-12

申请号：US16559701

申请日：2019-09-04

Applicant: Chroma Ate Inc.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Meng-Kung Lu

IPC: G01R31/28 ,  G01R1/04

Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

公开(公告)号：US20150066414A1

公开(公告)日：2015-03-05

申请号：US14261427

申请日：2014-04-25

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Liang-Yu Hsu

IPC: G01R31/28

CPC classification number: G01R31/2894 ,  G01R31/287

Abstract: An automatic retest method for a system-level IC test equipment and the IC test equipment is disclosed, wherein the IC test equipment includes multiple testing units, a loading/unloading unit, and a processing unit; each testing unit is capable of testing an IC individually and has a pass rate. When the testing unit finishes a test operation, it will send test report of the IC to the processing unit. The processing unit will determine whether the IC has reached a pass threshold of the testing unit. The processing unit will issue a command, according to a predetermined rule, to transfer the IC that failed to reach the pass threshold to one of the testing units conforming to the predetermined rule to conduct a retest operation. Finally, the processing unit will confirm whether the IC that failed to reach the pass threshold has reached the pass threshold in the retest operation.

Abstract translation: 公开了一种用于系统级IC测试设备和IC测试设备的自动再测试方法，其中IC测试设备包括多个测试单元，加载/卸载单元和处理单元; 每个测试单元都能够单独测试IC并具有合格率。 当测试单元完成测试操作时，它将向处理单元发送IC的测试报告。 处理单元将确定IC是否已达到测试单元的通过阈值。 处理单元将根据预定规则发出命令，将未达到通过阈值的IC传送到符合预定规则的测试单元之一，以进行重新测试操作。 最后，处理单元将确认在重新测试操作中未达到通过阈值的IC是否达到通过阈值。

公开(公告)号：US12196806B2

公开(公告)日：2025-01-14

申请号：US18054197

申请日：2022-11-10

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Xin-Yi Wu ,  Chin-Yi Ouyang

IPC: G01R31/28 ,  G01R1/44 ,  G01R35/00

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

公开(公告)号：US11932498B2

公开(公告)日：2024-03-19

申请号：US17931148

申请日：2022-09-12

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Chin-Yuan Kuo ,  Chang-Jyun He ,  Yung-Fan Chu

IPC: G01R31/28 ,  B65G47/90 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  H01L21/673 ,  H05K13/04

CPC classification number: B65G47/905 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  G01R31/2867 ,  G01R31/2874 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67333 ,  H05K13/0408 ,  G01N2203/0044 ,  G01N2203/0411

Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.