DRIVING BACKPLANE, DISPLAY PANEL AND DISPLAY APPARATUS

    公开(公告)号:US20220131044A1

    公开(公告)日:2022-04-28

    申请号:US17407919

    申请日:2021-08-20

    摘要: A driving backplane, a display panel and a display apparatus are provided. The driving backplane includes: a base substrate, and a plurality of connection electrode groups and a plurality of correction structures disposed on the base substrate, each of the connection electrode groups includes: a first connection electrode and a second connection electrode the first connection electrode and the second connection electrode are arranged on a same layer; a first gap is formed between the first connection electrode and the second connection electrode, and a first group of opposite edges includes: an edge, close to the first gap, of the first connection electrode; and an edge, close to the first gap, of the second connection electrode; a second group of opposite edges includes: an edge, far away from the first gap, of the first connection electrode; and an edge, far away from the first gap, of the second connection electrode.

    DRIVE BACKPLANE AND PREPARATION METHOD THEREOF, DISPLAY PANEL, AND DISPLAY DEVICE

    公开(公告)号:US20220115572A1

    公开(公告)日:2022-04-14

    申请号:US17280387

    申请日:2020-01-22

    IPC分类号: H01L33/62 H01L33/00

    摘要: The present application discloses a drive backplane and a preparation method thereof, a display panel, and a display device. The drive backplane includes a flexible substrate provided with a first via hole; a first passivation layer located on a side of the flexible substrate and provided with a second via hole, an orthographic projection of the second via hole being at least partially overlapped with an orthographic projection of the first via hole; a thin film transistor located on a side, facing away from the flexible substrate, of the first passivation layer; and an electrical connecting structure, including a signal trace and a connecting terminal.

    DRIVING SUBSTRATE, METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE

    公开(公告)号:US20210359184A1

    公开(公告)日:2021-11-18

    申请号:US17265806

    申请日:2020-05-13

    IPC分类号: H01L33/62 G09G3/00 G09G3/32

    摘要: The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.

    DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20210305283A1

    公开(公告)日:2021-09-30

    申请号:US17265228

    申请日:2020-05-19

    摘要: A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

    BACKLIGHT ASSEMBLY, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20210223631A1

    公开(公告)日:2021-07-22

    申请号:US16958564

    申请日:2019-12-11

    IPC分类号: G02F1/1335 G02F1/13357

    摘要: A backlight assembly, a manufacturing method thereof, and a display device are provided. The backlight assembly includes: a substrate, an anode trace and a cathode trace of an LED on the substrate, a planarization layer on a layer where the anode trace and the cathode trace of the LED are located, and an anode connection pad and a cathode connection pad on the planarization layer. The anode trace of the LED is coupled to the anode connection pad through a first via hole penetrating through the planarization layer, and the cathode trace of the LED is coupled to the cathode connection pad through a second via hole penetrating through the planarization layer. An exhaust channel is further arranged on the planarization layer to discharge gas accumulated in the planarization layer.

    DRIVING BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY PANEL

    公开(公告)号:US20210125549A1

    公开(公告)日:2021-04-29

    申请号:US17081834

    申请日:2020-10-27

    发明人: Ke WANG Zhanfeng CAO

    IPC分类号: G09G3/32 H01L33/38 H01L33/00

    摘要: A driving backplane includes a base, electroplating electrodes and driving electrodes. The base has first through holes in a sub-pixel region. The electroplating electrodes are disposed in the sub-pixel region, and at least a portion of each electroplating electrode is disposed within a respective one of the first through holes. The driving electrodes are disposed in the sub-pixel region and on a first side of the base, and each driving electrode is connected to a respective one of the electroplating electrodes.