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公开(公告)号:US11688618B2
公开(公告)日:2023-06-27
申请号:US17118277
申请日:2020-12-10
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger , Markus J. Stopper
IPC: H01L21/677 , G01N21/95 , B65G47/26 , B65G47/52
CPC classification number: H01L21/67736 , B65G47/268 , B65G47/52 , G01N21/9501 , H01L21/6773 , H01L21/67706
Abstract: A method and apparatus for loading substrates in an inspection station is disclosed herein. In one embodiment a loading module is disclosed that includes a loading station for two or more substrate cassettes, a first lane comprising a first conveyor that is substantially aligned with one of the two or more substrate cassettes and a conveyor system, a second lane comprising a second conveyor that is substantially aligned with another of the two or more substrate cassettes and positioned in a spaced-apart relation relative to the first lane, and a lateral transfer module positioned between the first lane and the second lane that is adapted to move substrates from the second lane to the first lane.
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公开(公告)号:US09754365B2
公开(公告)日:2017-09-05
申请号:US14609455
申请日:2015-01-30
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger , Markus J. Stopper
CPC classification number: G06T7/001 , G06T17/00 , G06T17/10 , G06T19/20 , G06T2207/10052 , G06T2207/30148 , G06T2219/2012
Abstract: Embodiments of the present invention generally relate to methods for inspecting wafers. After a brick is sliced into a plurality of bare wafers, a two-dimensional (2D) photoluminescence (PL) image of each wafer is taken, the PL images of the wafers in sequential order (i.e., the sequence of the wafers as they are sliced from the brick) are then combined to construct a three-dimensional (3D) model of the brick that highlights similar regions in the brick.
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公开(公告)号:US12007334B2
公开(公告)日:2024-06-11
申请号:US17510185
申请日:2021-10-25
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger
CPC classification number: G01N21/9009 , G01N35/04 , G01N2035/0406 , G01N2035/0415 , G01N2201/0484 , G01N2201/0636
Abstract: Methods and apparatus of inspection tools for inspecting impurities in vials are provided herein. In some embodiments, an inspection tool for inspecting impurities in vials includes: a table for inspecting a plurality of vials; one or more carts configured to move about the table to place the one or more carts in an inspection position, wherein each of the one or more carts includes a vial holder configured to hold a plurality of vials, and wherein each vial holder is configured to spin the plurality of vials on their own respective axes; and a camera configured to take images of the plurality of vials when the plurality of vials are disposed in the inspection position.
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公开(公告)号:US12128446B1
公开(公告)日:2024-10-29
申请号:US18217333
申请日:2023-06-30
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger , Markus J. Stopper
CPC classification number: B07B13/003 , B25J11/0095 , B25J15/0616
Abstract: Disclosed herein are a substrate sorter, an inspection and sorting system having the substrate sorter, and a method for the inspection and sorting system. The substrate sorter includes an annular gripper comprising a rotator and a plurality of vacuum applicators concyclically disposed around an axis, a carrier operable to move a substrate towards the rotator and into a loading region below the rotator, and an actuator coupled with the annular gripper and operable to rotate the rotator about the axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators hold the substrate against the rotator.
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公开(公告)号:US12046498B2
公开(公告)日:2024-07-23
申请号:US18196721
申请日:2023-05-12
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger , Markus J. Stopper
IPC: H01L21/677 , B65G47/26 , B65G47/52 , G01N21/95
CPC classification number: H01L21/67736 , B65G47/268 , B65G47/52 , G01N21/9501 , H01L21/67706 , H01L21/6773
Abstract: A method and apparatus for loading substrates in an inspection station is disclosed herein. In one embodiment a loading module is disclosed that includes a loading station for two or more substrate cassettes, a first lane comprising a first conveyor that is substantially aligned with one of the two or more substrate cassettes and a conveyor system, a second lane comprising a second conveyor that is substantially aligned with another of the two or more substrate cassettes and positioned in a spaced-apart relation relative to the first lane, and a lateral transfer module positioned between the first lane and the second lane that is adapted to move substrates from the second lane to the first lane.
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公开(公告)号:US11733178B2
公开(公告)日:2023-08-22
申请号:US17162792
申请日:2021-01-29
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger
IPC: G01N21/95 , G01N21/88 , G06T7/00 , G01N21/956
CPC classification number: G01N21/9508 , G01N21/8851 , G06T7/001 , G01N2021/95615 , G06T2207/30108
Abstract: Embodiments of the present disclosure are directed to a system and method for the inspection of products, such as tablets, pills, capsules, caplets, softgels, and other discreet units of consumption that may be ingested by a user. In embodiments, a plurality of cameras are used to capture images of the surface of the product. The images are aggregated to a single file and the imaged product features are analyzed for compliance to a product standard.
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公开(公告)号:US10937683B1
公开(公告)日:2021-03-02
申请号:US16712969
申请日:2019-12-12
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger , Markus J. Stopper
IPC: H01L21/687 , H01L21/67 , H01L21/66 , H01L21/677
Abstract: Embodiments disclosed herein generally relate to a conveyor inspection system and a method of sorting a substrate. The conveyor inspection system includes a moveable conveyor and a rapid conveyor. The moveable conveyor is configured to transfer undesired substrates to the rapid conveyor. The method includes determining that the substrate is undesirable for entry into a modular inspection unit, transferring the substrate to a rapid conveyor in response to determining that the substrate is undesirable for entry into the modular inspection unit, and transporting the substrate on the rapid conveyor. The conveyor inspection system and method remove substrates from the test system upon first entering the test system, which reduces time wasted in analyzing undesired substrates that would be discarded.
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公开(公告)号:US10777436B2
公开(公告)日:2020-09-15
申请号:US15307323
申请日:2016-04-05
Applicant: Applied Materials, Inc.
Inventor: Markus J. Stopper , Asaf Schlezinger
IPC: H01L21/67 , H01L21/677 , H01L21/683 , B07C5/10 , B07C5/342 , B07C5/344 , G01B11/00 , G01N21/64 , G01N21/95 , G01N21/84 , H01L21/66
Abstract: Embodiments of the present disclosure generally relate to expandable substrate inspection systems. The inspection system includes multiple metrology units adapted to inspect, detect, or measure one or more characteristics of a substrate, including thickness, resistivity, saw marks, geometry, stains, chips, micro cracks, and crystal fraction. The inspection systems may be utilized to identify defects on substrates and estimate cell efficiency prior to processing a substrate. Substrates may be transferred through the inspection system and/or between metrology units on a track or conveyor, and then sorted via at least one gripper coupled with the high speed rotatory sorting apparatus into respective bins based upon the inspection data. The rotary sorting apparatus maintains a sorting capability of at least 5,400 substrates per hour. Each bin may optionally have a gas support cushion for supporting the substrate as it falls from the rotary sorting apparatus into the respective bin.
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公开(公告)号:US12135296B2
公开(公告)日:2024-11-05
申请号:US17661299
申请日:2022-04-29
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger
Abstract: Embodiments described herein provide for a defect detection system and method suitable for detecting defects on an edge of a wafer. The method includes placing at least two wafers sequentially on a conveyor. Images of at least the edges of each wafer placed on the conveyor are captured and sent to a controller. A defect detection software combines the images to show the edges of the wafers in a virtual stack. The virtual stack allows for a pattern of defects to be identified. The pattern of defects in close proximity will allow for identification of the defects in the edges of the wafers.
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公开(公告)号:US11945660B2
公开(公告)日:2024-04-02
申请号:US17396933
申请日:2021-08-09
Applicant: Applied Materials, Inc.
Inventor: Asaf Schlezinger , Markus J. Stopper
CPC classification number: B65G47/71 , B07C5/363 , B65G21/2036 , B65G2201/022 , B65G2207/18
Abstract: Embodiments of the present disclosure generally relate an apparatus for inspecting and sorting a plurality of substrates. The apparatus includes a sorting unit, a first conveyor lane disposed within the sorting unit in a first direction and a first plane, and at least a second conveyor lane disposed within the sorting unit, the second conveyor lane positioned in a second direction at an angle of greater than about 45 degrees relative to the first direction, wherein the second conveyor lane is positioned in a second plane that is different than the first plane.
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