Embodiments of the present invention generally relate to methods for inspecting wafers. After a brick is sliced into a plurality of bare wafers, a two-dimensional (2D) photoluminescence (PL) image of each wafer is taken, the PL images of the wafers in sequential order (i.e., the sequence of the wafers as they are sliced from the brick) are then combined to construct a three-dimensional (3D) model of the brick that highlights similar regions in the brick.