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    Electronic device with electromagnetic shielding structures
    1.
    发明授权
    Electronic device with electromagnetic shielding structures 有权
    具有电磁屏蔽结构的电子设备

    公开(公告)号：US09520645B2

    公开(公告)日：2016-12-13

    申请号：US14262574

    申请日：2014-04-25

    Applicant: Apple Inc.

    Inventor： Derek J. Walters ,  Michael Eng ,  Brian S. Tryon ,  Connor R. Duke ,  Kieran Poulain ,  Nicholas J. Kunst ,  Shaohai Chen ,  Shaoqing Xiang ,  Sung Woo Yoo ,  Chun Cheng Teo ,  Paul Nangeroni ,  Eric Steven Jol

    IPC: H01Q19/09 ,  H01Q1/52 ,  H01Q1/24 ,  H04B15/00

    CPC classification number: H01Q1/526 ,  H01Q1/243 ,  H04B15/00

    Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

    Abstract translation: 无线电子设备可以设置有诸如电气和结构部件的部件。 在射频信号的传输期间，无线电子设备的天线和无线通信电路可产生相关联的时变磁场。 一个或多个部件可以用防磁屏蔽结构覆盖，该结构通过防止磁致振动来保护部件免受时变磁场的影响。 磁性屏蔽结构可以包括导电基底层，例如黄铜层。 可以将耐磁层电镀到导电基底层上。 耐磁层可以由非晶镍 - 磷合金形成。 可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。

    Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures
    3.
    发明申请
    Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures 有权
    使用弹性阻尼和阻尼结构的印刷电路板降噪电子设备

    公开(公告)号：US20150070864A1

    公开(公告)日：2015-03-12

    申请号：US14020059

    申请日：2013-09-06

    Applicant: Apple Inc.

    Inventor： Amanda R. Rainer ,  Connor R. Duke ,  James W. Bilanski ,  Jeffrey M. Thoma ,  Michael Eng ,  Mingzhe Li ,  Sung Woo Yoo ,  Miguel Alejandro Lara-Pena ,  Weng Choy Foo ,  Kieran Poulain

    IPC: H01L23/29 ,  H01L25/065 ,  H05K1/03 ,  H01L21/56

    CPC classification number: H05K1/0393 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73204 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10977 ,  H05K2201/2045 ,  H05K2203/0126 ,  H05K2203/304

    Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

    Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。

    Electronic Device With Electromagnetic Shielding Structures
    6.
    发明申请
    Electronic Device With Electromagnetic Shielding Structures 有权
    具有电磁屏蔽结构的电子装置

    公开(公告)号：US20150070236A1

    公开(公告)日：2015-03-12

    申请号：US14262574

    申请日：2014-04-25

    Applicant: Apple Inc.

    Inventor： Derek J. Walters ,  Michael Eng ,  Brian S. Tryon ,  Connor R. Duke ,  Kieran Poulain ,  Nicholas J. Kunst ,  Shaohai Chen ,  Shaoqing Xiang ,  Sung Woo Yoo ,  Chun Cheng Teo ,  Paul Nangeroni ,  Eric Steven Jol

    IPC: H05K9/00 ,  H01Q1/52

    CPC classification number: H01Q1/526 ,  H01Q1/243 ,  H04B15/00

    Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

    Abstract translation: 无线电子设备可以设置有诸如电气和结构部件的部件。 在射频信号的传输期间，无线电子设备的天线和无线通信电路可产生相关联的时变磁场。 一个或多个部件可以用防磁屏蔽结构覆盖，该结构通过防止磁致振动来保护部件免受时变磁场的影响。 磁性屏蔽结构可以包括导电基底层，例如黄铜层。 可以将耐磁层电镀到导电基底层上。 耐磁层可以由非晶镍 - 磷合金形成。 可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。

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