Abstract:
A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.
Abstract:
A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.
Abstract:
A lighting device controlling chip, an apparatus, a system and an addressing method thereof are provided. The lighting device has a trigger terminal for receiving a first setting voltage, an output terminal for outputting a second setting voltage and a signal receiving interface for receiving a data packet having a plurality of serially transmitted data slots. The lighting device controlling chip may automatically set an address thereof according to a voltage level of the first setting voltage and a counting signal corresponding to the number of the received data slots.
Abstract:
A driving circuit of a light emitting diode (LED) and a ghost phenomenon elimination circuit thereof are disclosed. The ghost phenomenon elimination circuit which includes a ghost phenomenon elimination unit and a counter unit may determine a black insertion period according to a gray scale clock signal, and output an enable signal to the ghost phenomenon elimination unit during the black insertion period. The ghost phenomenon elimination unit may pull up the voltage levels at current driving terminals of the driving circuit so as to prevent the ghost phenomenon from occurring.
Abstract:
A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
Abstract:
A driving circuit of a light emitting diode (LED) and a ghost phenomenon elimination circuit thereof are disclosed. The ghost phenomenon elimination circuit which includes a ghost phenomenon elimination unit and a counter unit may determine a black insertion period according to a gray scale clock signal, and output an enable signal to the ghost phenomenon elimination unit during the black insertion period. The ghost phenomenon elimination unit may pull up the voltage levels at current driving terminals of the driving circuit so as to prevent the ghost phenomenon from occurring.
Abstract:
A driving circuit of a light emitting diode (LED) is provided, including a driving unit, a current pre-charging unit and a feedback selecting unit. The driving unit outputs a driving power to drive the LEDs and outputs at least a first feedback signal according to the current conducted by the LEDs. The current pre-charging unit is coupled to an output of the driving unit to provide a current path to the driving unit and generates a second feedback signal according to a current conducted by the current pre-charging unit. The feedback selecting unit selects and outputs one of first feedback signals or the second feedback signal according to an enable signal, and the driving unit adjusts the driving power according to an output of the feedback selecting unit so as to maintain a current driving capability of the driving circuit to provide a sufficient current to drive the LEDs.
Abstract:
An active touch panel voltage compensation circuit, which is to improve voltage distribution in the border of an electrode layer of a touch panel, comprises: a power supply unit provides an initial voltage to a plurality of voltage-applying points of the electrode layer. A differential amplifier unit sets a calibration level. The differential amplifier unit is coupled to a plurality of detection points to obtain a plurality of detected voltages, and compares the detected voltages with the calibration level to obtain a plurality of deviation values. A processing unit works out the compensation voltages for the voltage-applying points according to the deviation values, generates a plurality of gain-modulation signals according to the compensation voltages and sends the gain-modulation signals to the power supply unit. The power supply unit regulates the initial voltage to the plurality of compensation voltages so that the detected voltages can reach the calibration level.
Abstract:
Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
Abstract:
A driving apparatus for driving at least one first light emitting diode unit and a second light emitting diode unit includes a data transmitting unit and a driving unit. The data transmitting unit is used for receiving and storing driving data. The driving data includes first data corresponding to a first driving signal and second data corresponding to a second driving signal. The driving unit divides the first driving signal into a plurality of first sub-driving signals and the second driving signal into a plurality of second sub-driving signals, and then alternately outputs the first sub-driving signals and the second sub-driving signals to alternately drive the first light emitting diode unit and the second light emitting diode unit.