公开(公告)号：US5294459A

公开(公告)日：1994-03-15

申请号：US935943

申请日：1992-08-27

Applicant: Patrick T. Hogan ,  Bernard J. McHugh ,  James J. Turner ,  Takaji Shimada ,  Tsuyoshi Nishimura ,  Bradley N. Stoops

Inventor： Patrick T. Hogan ,  Bernard J. McHugh ,  James J. Turner ,  Takaji Shimada ,  Tsuyoshi Nishimura ,  Bradley N. Stoops

IPC: B05B1/28 ,  B05B1/30 ,  B05B7/08 ,  B05B9/01 ,  B05D1/02 ,  H05K3/00

CPC classification number: H05K3/0091 ,  B05B7/0815 ,  B05B7/162 ,  B05B9/002 ,  B05B9/01 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/081 ,  H05K2203/1366 ,  H05K2203/1509

Abstract: Apparatus and methods for spray coating selected areas of a circuit board with an insulative coating material without coating regions of the circuit board to be left uncoated. A liquid spray device emits the coating material and an air assist attachment connected to the liquid spray device directs jets of air into impinging relation with the coating material emitted therefrom to transform the coating material into an atomized, shaped spray pattern for coating the selected areas. The air assist attachment can be disabled so that the spray device transforms the coating material into a non-atomized, shaped spray pattern for coating selected areas without coating regions of the circuit board to be left uncoated.

Abstract translation: 用绝缘涂层材料喷涂电路板的选定区域而不涂覆电路板的未涂覆区域的装置和方法。 液体喷射装置发射涂覆材料，并且连接到液体喷射装置的空气辅助附件引导空气射流与从其喷出的涂层材料的撞击关系，以将涂层材料转变成雾化的成形喷雾图案，以涂覆所选择的区域。 空气辅助附件可以被禁用，使得喷涂装置将涂料转化成非雾化的成形喷雾图案，用于涂覆所选择的区域，而不涂覆电路板的未被涂覆的区域。

公开(公告)号：US08919273B1

公开(公告)日：2014-12-30

申请号：US13442361

申请日：2012-04-09

Applicant: Michael Hoffman ,  Bradley N. Stoops

Inventor： Michael Hoffman ,  Bradley N. Stoops

IPC: B63G8/00

CPC classification number: B63B13/00

Abstract: A valve is disclosed. The valve can be mounted through a wall, for example in the hull wall of a submersible vehicle. The internal components of the valve can be readily removed, serviced and/or replaced without removing the valve body from the wall. A filling assembly is also disclosed, which mates with the valve to deliver a fluid from one side of the wall, through the valve and into a storage tank or other apparatus disposed on the opposite side of the wall. The filling assembly actuates the valve to open a fluid pathway therethrough in order to deliver fluid to a storage tank or other apparatus connected to the valve's exit port.

Abstract translation: 公开了一种阀。 阀可以通过墙壁安装，例如在潜水车辆的船体壁上。 阀的内部部件可以容易地移除，维修和/或更换，而不从阀壁上移除阀体。 还公开了一种填充组件，其与阀配合以从壁的一侧输送流体通过阀并进入设置在壁的相对侧上的储存箱或其他装置中。 填充组件致动阀以打开其中的流体通道，以将流体输送到连接到阀的出口的储存罐或其他装置。

公开(公告)号：US5615828A

公开(公告)日：1997-04-01

申请号：US397395

申请日：1995-03-02

Applicant: Bradley N. Stoops

Inventor： Bradley N. Stoops

IPC: B23K1/20 ,  B23K3/08 ,  B23K37/00

CPC classification number: B23K1/203 ,  B23K3/082 ,  B23K2201/40

Abstract: A dispensing apparatus for applying a pulsed thin stream of flux to a surface such as a printed circuit board. The stream of flux is pulsed at a high rate to apply a thin layer of flux on the surface. The dispensing head consists of multiple orifices for applying the flux to the board. The streams of flux are angularly disposed and a pan is positioned for capturing flux which passes by the board. The board is conveyed by the dispensing head. Controls are incorporated for board sensing and identification, application width selection, precise pressure control, fluid flow monitoring and system safety conditions.

Abstract translation: 一种分配装置，用于将脉冲的稀薄流量流施加到诸如印刷电路板的表面。 磁通流以高速脉冲，以在表面上施加薄层的助焊剂。 分配头由用于将焊剂施加到板的多个孔组成。 焊剂流成角度地布置，并且锅定位成用于捕获通过板的通量。 板由分配头传送。 控制装置用于电路板感测和识别，应用宽度选择，精确的压力控制，流体流量监测和系统安全条件。

公开(公告)号：US06913182B2

公开(公告)日：2005-07-05

申请号：US10342861

申请日：2003-01-15

Applicant: Bradley N. Stoops

Inventor： Bradley N. Stoops

IPC: B23K1/00 ,  B23K1/08 ,  B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  B23K20/08 ,  B23K5/00

CPC classification number: B23K1/203 ,  B23K1/0016 ,  B23K1/085 ,  B23K3/0653 ,  B23K3/082 ,  B23K2101/42

Abstract: Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based upon pulse rate, fluid pressure, air pressure and traverse speed. The apparatus consists of a precise orifice with a surrounding air passage for atomizing and focusing the flux at a discrete location on the surface. Controls are incorporated for selecting, controlling and monitoring the flux deposition amount and location, for coordinating with the transport motion system, for integrating with the adjacent air flow and for selecting the atomized or non-atomized method of application.

Abstract translation: 将雾化的脉冲流通量施加到诸如印刷电路板的表面的装置和方法。 基于脉率，流体压力，空气压力和横移速度，通量在选定的位置和选定的厚度上离散地施加。 该设备包括具有周围空气通道的精确孔口，用于在焊接表面上的离散位置处使焊剂雾化和聚焦。 控制装置用于选择，控制和监测助熔剂沉积量和位置，用于与运输运动系统协调，用于与相邻空气流整合并用于选择雾化或非雾化方法。

公开(公告)号：US5328085A

公开(公告)日：1994-07-12

申请号：US931786

申请日：1992-08-18

Applicant: Bradley N. Stoops ,  Melaney S. Stoops

Inventor： Bradley N. Stoops ,  Melaney S. Stoops

IPC: B23K1/20 ,  B23K3/08 ,  B23K37/00

CPC classification number: B23K3/082 ,  B23K1/203 ,  B23K2201/40

Abstract: A dispensing apparatus for applying a thin stream of flux to a surface of a printed circuit board. The dispensing head travels at a high rate of speed relative to the board during the dispensing of flux to apply thin layers of flux thereto. Preferably, the dispensing head moves transversely to the work path of a conveyor that transports the board through a flux station, at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board and, if desired, make multiple passes over the surface to coat selected regions twice. Either the board is incrementally advanced through the flux station or the dispensing head is incrementally advanced relative to the board so that flux is applied when the board is stationary.

Abstract translation: 一种用于将薄的助焊剂流施加到印刷电路板的表面的分配装置。 在分配焊剂期间，分配头以相对于板的高速度行进，以向其施加薄层的助焊剂。 优选地，分配头横向移动到输送机的工作路径，该输送机以约20至90英寸/秒的速率运输板通过通量站。 分配助焊剂的提示物相对于板成角度地设置，并且如果需要，在表面上进行多次通过以涂覆所选择的区域两次。 板通过通量站逐步推进，或者分配头相对于板递增地前进，使得当板静止时施加通量。