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公开(公告)号：CN103178037B
公开(公告)日：2016-03-23
申请号：CN201210429510.1
申请日：2012-10-31
Applicant: 富士通株式会社
IPC: H01L23/488 , H01L23/498 , H05K1/11
CPC classification number: H01L24/16 , H01L23/49811 , H01L23/49838 , H01L23/49866 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05023 , H01L2224/05147 , H01L2224/05564 , H01L2224/05568 , H01L2224/05639 , H01L2224/13023 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/16505 , H01L2924/00014 , H05K3/3436 , H01L2924/01047 , H01L2924/00012 , H01L2924/01029 , H01L2924/0105 , H01L2224/05552
Abstract: 本发明提供电子部件和电子装置。所述电子部件的连接端子的表面上覆盖有由AgSn合金制成的保护层。电子部件焊接到电路板的连接端子。
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公开(公告)号：CN102615446A
公开(公告)日：2012-08-01
申请号：CN201110460651.5
申请日：2011-12-31
Applicant: 富士通株式会社
IPC: B23K35/26 , H05K3/34 , H01L23/488
CPC classification number: H05K3/3463 , B23K35/0244 , B23K35/262 , B23K35/264 , B23K2101/36 , B23K2101/40 , C22C12/00 , C22C13/00 , C22C30/04 , C22C30/06 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16506 , H01L2224/81065 , H01L2224/81097 , H01L2224/81192 , H01L2224/81211 , H01L2224/81805 , H01L2224/81815 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , Y10T428/12708 , H01L2924/01083 , H01L2924/0105 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
Abstract: 本发明提供一种焊料、焊接方法和半导体器件，所述焊料包括Sn(锡)、Bi(铋)和Zn(锌)，其中所述焊料具有0.01wt％至0.1wt％的Zn含量。
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公开(公告)号：CN102615446B
公开(公告)日：2014-09-03
申请号：CN201110460651.5
申请日：2011-12-31
Applicant: 富士通株式会社
IPC: B23K35/26 , H05K3/34 , H01L23/488
CPC classification number: H05K3/3463 , B23K35/0244 , B23K35/262 , B23K35/264 , B23K2101/36 , B23K2101/40 , C22C12/00 , C22C13/00 , C22C30/04 , C22C30/06 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16506 , H01L2224/81065 , H01L2224/81097 , H01L2224/81192 , H01L2224/81211 , H01L2224/81805 , H01L2224/81815 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , Y10T428/12708 , H01L2924/01083 , H01L2924/0105 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
Abstract: 本发明提供一种焊料、焊接方法和半导体器件，所述焊料包含：Sn（锡）；45wt%至65wt%的Bi（铋）；0.01wt%至0.1wt%的Zn（锌），和0.3wt%至0.8wt%的Sb（锑）。
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公开(公告)号：CN103178037A
公开(公告)日：2013-06-26
申请号：CN201210429510.1
申请日：2012-10-31
Applicant: 富士通株式会社
IPC: H01L23/488 , H01L23/498 , H05K1/11
CPC classification number: H01L24/16 , H01L23/49811 , H01L23/49838 , H01L23/49866 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05023 , H01L2224/05147 , H01L2224/05564 , H01L2224/05568 , H01L2224/05639 , H01L2224/13023 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/16505 , H01L2924/00014 , H05K3/3436 , H01L2924/01047 , H01L2924/00012 , H01L2924/01029 , H01L2924/0105 , H01L2224/05552
Abstract: 本发明提供电子部件和电子装置。所述电子部件的连接端子的表面上覆盖有由AgSn合金制成的保护层。电子部件焊接到电路板的连接端子。
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