- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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申请号: US18455643申请日: 2023-08-25
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公开(公告)号: US20230402511A1公开(公告)日: 2023-12-14
- 发明人: Motoyoshi KUBOUCHI , Takashi YOSHIMURA , Yuki SAWA , Shogo YAMAGUCHI
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kanagawa
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP 21150249 2021.09.15
- 主分类号: H01L29/32
- IPC分类号: H01L29/32 ; H01L29/739 ; H01L29/06 ; H01L21/265 ; H01L21/322 ; H01L29/861 ; H01L29/66
摘要:
Provided is a semiconductor device including a drift region, a buffer region which is provided in a back surface side of a semiconductor substrate relative to the drift region and has a first peak of a doping concentration, and a first lattice defect region which is provided in a front surface side of the semiconductor substrate relative to the first peak in a depth direction of the semiconductor substrate, in which the buffer region has a hydrogen peak which is provided in the front surface side of the semiconductor substrate relative to the first lattice defect region, and an integrated concentration obtained by integrating the doping concentration in a direction from an upper end of the drift region to the hydrogen peak in the depth direction of the semiconductor substrate is equal to or larger than a critical integrated concentration.
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