- 专利标题: Area selective carbon-based film deposition
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申请号: US17722648申请日: 2022-04-18
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公开(公告)号: US11972940B2公开(公告)日: 2024-04-30
- 发明人: Xinke Wang , Bhaskar Jyoti Bhuyan , Zeqing Shen , Susmit Singha Roy , Abhijit Basu Mallick , Jiecong Tang , John Sudijono , Mark Saly
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Servilla Whitney LLC
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; C23C16/04 ; C23C16/26 ; C23C16/56
摘要:
Methods of selectively depositing a carbon-containing layer are described. Exemplary processing methods may include flowing a first precursor over a substrate comprising a metal surface and a non-metal surface to form a first portion of an initial carbon-containing film on the metal surface. The methods may include removing a first precursor effluent from the substrate. A second precursor may then be flowed over the substrate to react with the first portion of the initial carbon-containing layer. The methods may include removing a second precursor effluent from the substrate. The methods may include pre-treating the metal surface of the substrate to form a metal oxide surface on the metal surface.
公开/授权文献
- US20230335391A1 Area Selective Carbon-Based Film Deposition 公开/授权日:2023-10-19
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