发明授权
- 专利标题: Fin field effect transistor fabrication and devices having inverted T-shaped gate
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申请号: US16264955申请日: 2019-02-01
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公开(公告)号: US10784365B2公开(公告)日: 2020-09-22
- 发明人: Veeraraghavan S. Basker , Zuoguang Liu , Tenko Yamashita , Chun-Chen Yeh
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/417 ; H01L29/423 ; H01L29/49 ; H01L29/78 ; H01L29/40 ; H01L21/311 ; H01L21/62 ; H01L21/3213 ; H01L21/8234 ; H01L21/3065 ; H01L21/265 ; H01L21/02 ; H01L29/08 ; H01L27/088
摘要:
A method of forming a fin field effect transistor (finFET), including forming a temporary gate structure having a sacrificial gate layer and a dummy gate layer on the sacrificial gate layer, forming a gate spacer layer on each sidewall of the temporary gate structure, forming a source/drain spacer layer on the outward-facing sidewall of each gate spacer layer, removing the dummy gate layer to expose the sacrificial gate layer, removing the sacrificial gate layer to form a plurality of recessed cavities, and forming a gate structure, where the gate structure occupies at least a portion of the plurality of recessed cavities.
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