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发明授权
CN101546738B 一种改进的半导体元件与热管散热器基板的压装定位结构 有权

一种改进的半导体元件与热管散热器基板的压装定位结构
摘要：
本发明公开了一种改进的半导体元件与热管散热器基板的压装定位结构，包括热管散热器基板、位于基板之间的半导体元件、固定在基板上的对外导电连接板、将基板与半导体元件紧固的弹性压装组件；所述弹性压装组件通过其上的支撑部件固定在整流装置上；所述热管散热器基板位于弹性压装组件中的紧固螺杆之间形成的区域内；热管散热器基板上设有定位部件与半导体元件的中心孔相配合，对外导电连接板上至少设有一个紧固螺杆过孔。这种结构可以大大减少热管散热器基板的尺寸，从而可以采用导热性能极佳的铜，不会产生螺杆与基板之间的静摩擦力，能保证压力完全传递到接触面，从而显著地降低接触热阻。
摘要（英）：

The present invention discloses a modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate, wherein it consists of heat pipe radiator base plate, semiconductor element, external conducting connection plate fixed onto the base plate, and elastic press mounting module that fastens base plate and semiconductor element; the elastic press mounting module is fixed onto the rectifying device through the support component on it; the heat pipe radiator base plate is located in the space formed by the fastening screws in the elastic press mountingcomponent; on the heat pipe radiator base plate, a positioning component is provided to match the center hole of the semiconductor element, and on the external conducting connection plate, there is at least one through hole for fastening screw. This structure may significantly reduce the dimensions of the heat pipe radiator base plate. Thereby copper with great thermal conductivity may be adopted, no static friction will be generated between the screw and the base plate, and pressure can be completely transferred to the contact surface, thus remarkably reducing thermal contact resistance.

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