公开(公告)号：US12232548B2

公开(公告)日：2025-02-25

申请号：US16898956

申请日：2020-06-11

Applicant: LOOMIA Technologies, Inc.

Inventor： Madison Thea Maxey ,  Ezgi Ucar ,  Ginette Lu

IPC: A41D13/005 ,  A41D1/00 ,  A41D1/04 ,  A41D1/22 ,  A41H43/04 ,  H05B1/02 ,  H05B3/34 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/06 ,  H05K3/30 ,  H05K1/09 ,  H05K3/12 ,  H05K3/28

Abstract: One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second mask—mirrored image of the first mask—to a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.

公开(公告)号：US12227672B2

公开(公告)日：2025-02-18

申请号：US17561007

申请日：2021-12-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Gyun Kwon ,  Eung Seok Lee ,  So Hyeon Hong ,  Byung Rok Ahn

IPC: H05K3/30 ,  C09D5/24 ,  C09D7/20 ,  C09D7/40 ,  C09D7/45 ,  C09D129/04 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30 ,  H01G4/248

Abstract: A method for manufacturing a multilayer ceramic capacitor including an operation of preparing a ceramic green sheet; an operation of forming a conductive paste on the ceramic green sheet; an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed; an operation of sintering the ceramic laminate; and an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.

公开(公告)号：US12206150B2

公开(公告)日：2025-01-21

申请号：US18600218

申请日：2024-03-08

Applicant: Vubiq Networks, Inc.

Inventor： Michael Gregory Pettus ,  Gabriel Corbett

IPC: H01P1/213 ,  H05K1/02 ,  H05K3/30 ,  H01P5/107 ,  H04B1/40

Abstract: A surface mount constructed millimeter wave transceiver device and methods of making a surface mount constructed millimeter wave transceiver device are disclosed. The transceiver device includes a printed circuit board having a first waveguide port and a second waveguide port. A diplexer is surface mounted to a first side of the printed circuit board, the diplexer comprising a low frequency waveguide port and a high frequency waveguide port each coupled to an antenna port. A transmitter and a receiver are surface mounted to a second side of the printed circuit board, located opposite the first side of the printed circuit board, wherein the transmitter and the receiver comprise a transmitter waveguide port and a receiver waveguide port, respectively, that are configured to be aligned to the first waveguide port and the second waveguide port of the printed circuit board, respectively.

公开(公告)号：US20250024603A1

公开(公告)日：2025-01-16

申请号：US18349297

申请日：2023-07-10

Applicant: PLUME DESIGN, INC.

Inventor： Ming-Tsung SU ,  Chun-Wen WANG

IPC: H05K1/11 ,  H05K3/30

Abstract: Wireless communication devices may include a printed circuit board and a conductive pin structure. The printed circuit board may include a neutral power input and a live power input positioned at a first distance from each other. The conductive pin structure may include a neutral pin and a live pin positioned at a second, different distance from each other. A first sheet metal connector may electrically connect the neutral pin to the neutral power input and a second sheet metal connector may electrically connect the live pin to the live power input. Various other related devices, components, systems, and methods are also disclosed.

公开(公告)号：US20250016918A1

公开(公告)日：2025-01-09

申请号：US18751647

申请日：2024-06-24

Applicant: Infineon Technologies AG

Inventor： Martin Richard NIEßNER ,  Walter HARTNER ,  Gerhard HAUBNER

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/30

Abstract: A printed circuit board for mounting at least one semiconductor chip device includes a metal structure provided in a first area of the printed circuit board for soldering the semiconductor chip device onto the metal structure. The printed circuit board includes a main surface, a layer stack including a first layer extending parallel to the main surface and a second layer extending parallel to the main surface. The first layer includes a first material having a first coefficient of thermal expansion in a lateral direction and the second layer includes a second material having a second coefficient of thermal expansion in the lateral direction such that the printed circuit board is forced by the layer stack into a curved shape at least in the first area of the printed circuit board.

公开(公告)号：US12167542B2

公开(公告)日：2024-12-10

申请号：US17521563

申请日：2021-11-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu Nakagawasai ,  Motoi Yamagata

IPC: H05K3/30 ,  H01L21/67 ,  G01K1/14

Abstract: There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.

公开(公告)号：US20240397633A1

公开(公告)日：2024-11-28

申请号：US18472181

申请日：2023-09-21

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： YU-HSIANG LIU ,  LI-CHUN HUNG

IPC: H05K3/34 ,  H01L23/00 ,  H01L23/498 ,  H05K3/30

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a first solder mask layer, a convex structure, a sensing chip, and an engaging layer. The first solder mask layer is disposed on the substrate. The convex structure is disposed on the first solder mask layer. The convex structure has a first stepped surface, and the first stepped surface is higher than an upper surface of the first solder mask layer. The sensing chip is disposed above the substrate. The engaging layer is adhered between the substrate and the sensing chip and covers the convex structure, such that the convex structure and the sensing chip are not in contact with each other.

公开(公告)号：US12149811B2

公开(公告)日：2024-11-19

申请号：US18307539

申请日：2023-04-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Ho Chung ,  Sung Il Lee

IPC: H04N23/55 ,  G02B7/00 ,  G02B7/08 ,  G02B7/09 ,  G02B27/64 ,  H04N23/54 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34

Abstract: A camera module of an embodiment may comprise: a first holder in which a filter is mounted; a lens barrel that is provided to be vertically movable in a first direction with respect to the first holder; a lens operating device that comprises a terminal and moves the lens barrel in the first direction; a first circuit board that is disposed under the first holder and on which an image sensor is mounted; a soldering portion for electrically connecting the terminal of the lens operating device to the first circuit board; and a coupling reinforcement portion that is disposed to face the soldering portion and couples the lens operating device and the first circuit board.

公开(公告)号：US20240380320A1

公开(公告)日：2024-11-14

申请号：US18779946

申请日：2024-07-22

Applicant: WOLFSPEED, INC.

Inventor： Mrinal K. DAS ,  Adam BARKLEY ,  Henry LIN ,  Marcelo SCHUPBACH

IPC: H02M3/155 ,  H01L23/373 ,  H01L25/07 ,  H01L29/16 ,  H02M1/00 ,  H02M1/08 ,  H02M1/34 ,  H02M1/44 ,  H02M3/00 ,  H02M7/00 ,  H05K3/30

Abstract: A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.

公开(公告)号：US20240365464A1

公开(公告)日：2024-10-31

申请号：US18642395

申请日：2024-04-22

Applicant: CANON KABUSHIKI KAISHA

Inventor： HIROYUKI YAMAGUCHI ,  NOBUAKI YAMASHITA ,  YOSHITOMO FUJISAWA

IPC: H05K1/02 ,  H01G4/12 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0231 ,  H01G4/12 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10515

Abstract: A circuit board includes a wiring board, a first capacitor, a second capacitor, and a semiconductor device. The first capacitor and the second capacitor are stacked to each other on the wiring board. The semiconductor device is mounted on the wiring board. The first capacitor is provided between the second capacitor and the wiring board. A second capacitance of the second capacitor is larger than a first capacitance of the first capacitor.