ELECTRONIC DEVICE
    3.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240055762A1

    公开(公告)日:2024-02-15

    申请号:US18258158

    申请日:2021-12-17

    IPC分类号: H01Q5/10 H01Q5/378 H01Q5/328

    CPC分类号: H01Q5/10 H01Q5/378 H01Q5/328

    摘要: This application provides an electronic device, relates to the field of electronic device technologies, and can improve radiation efficiency of an antenna in the electronic device. The electronic device includes a reference ground layer, a first radiator, and a second radiator, where the reference ground layer has a first edge, and a second edge and a third edge that are respectively connected to two ends of the first edge. The first radiator has a first ground point and a first feed point that are disposed at an interval, and the first ground point is electrically connected to the reference ground layer. The second radiator is electrically connected to the first edge of the reference ground layer, or an end section that is of the second edge and that is connected to the first edge, or an end section that is of the third edge and that is connected to the first edge. An electrical length of the reference ground layer in a first direction is a ½ wavelength of a main resonant band of the first radiator, and a parasitic resonant band generated by the second radiator when a radio frequency signal is fed at the first feed point is lower than the main resonant band generated by the first radiator when the radio frequency signal is fed at the first feed point. The electronic device provided in this application is used for a communication system.

    Electronic devices having wideband antennas

    公开(公告)号:US11862838B2

    公开(公告)日:2024-01-02

    申请号:US16851812

    申请日:2020-04-17

    申请人: Apple Inc.

    IPC分类号: H01Q5/10 H01Q5/328 H01Q7/00

    CPC分类号: H01Q5/10 H01Q5/328 H01Q7/00

    摘要: An electronic device may include a curved cover layer and an antenna. The antenna may include a ground and a resonating element on a curved surface of a substrate. The curved surface may have a curvature that matches that of the cover layer. The resonating element may include first, second, and third arms fed by a feed. The first arm and a portion of the ground may form a loop antenna resonating element. The second arm and the first arm may form an inverted-F antenna resonating element, where a portion of the first arm forms a return path to the antenna ground for the inverted-F antenna resonating element. A gap between the first and second arms may form a distributed capacitance. The third arm may form an L-shaped antenna resonating element. The antenna may have a wide bandwidth from below 2.4 GHz to greater than 9.0 GHz.

    ANTENNA STRUCTURE
    8.
    发明申请

    公开(公告)号:US20230054657A1

    公开(公告)日:2023-02-23

    申请号:US17805866

    申请日:2022-06-08

    申请人: QuantumZ Inc.

    IPC分类号: H01Q5/45 H01Q5/328 H01Q11/14

    摘要: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member and a plurality of conductive vias. The substrate contains liquid crystal polymer and has opposite first and second surfaces. The reflective plates are arranged in an array on the first surface of the substrate. The grounding plate is arranged on the second surface of the substrate and overlaps with the reflective plates in a normal direction of the substrate. The radiating member is on the second surface of the substrate and does not overlap with the reflective plates in the normal direction of the substrate. The radiating member has an open slot which is defined by a first radiating branch and a second radiating branch that generate at least two different operating frequency bands. The conductive vias respectively penetrate the substrate and connect with the reflective plates and the grounding plate.

    Antenna and electronic device including the same

    公开(公告)号:US11570286B2

    公开(公告)日:2023-01-31

    申请号:US17323472

    申请日:2021-05-18

    摘要: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.