公开(公告)号：US12224359B2

公开(公告)日：2025-02-11

申请号：US18110637

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

公开(公告)号：US12189064B2

公开(公告)日：2025-01-07

申请号：US18133299

申请日：2023-04-11

Applicant: STMicroelectronics International N.V.

Inventor： Colin Campbell ,  Marco Antonelli ,  Calum Ritchie ,  Bhagya Prakash Bandusena

IPC: G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/173

Abstract: A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.

公开(公告)号：US12176443B2

公开(公告)日：2024-12-24

申请号：US17889161

申请日：2022-08-16

Applicant: Amkor Technology Singapore Holding Pte. Ltd.

Inventor： Ji Young Chung ,  Sung Hwan Yang ,  Jae Ho Lee

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  G06V40/13

Abstract: In one example, an electronic device includes: an electronic component comprising a sensor and an electrical interconnect; a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. Other examples and related methods are also disclosed herein.

公开(公告)号：US20240405130A1

公开(公告)日：2024-12-05

申请号：US18807112

申请日：2024-08-16

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA

IPC: H01L31/02 ,  H01L31/0203 ,  H01S5/02315

Abstract: A dielectric substrate has a first surface including a first terminal connector and a second terminal connector located along a first side surface. A recess is between the first terminal connector and the second terminal connector. The recess has a first inner surface continuous with the first terminal connector, a second inner surface continuous with the second terminal connector, and a bottom surface between the first inner surface and the second inner surface. The first terminal connector has first wettability with a bond on its surface, and a first region has second wettability with the bond on its surface lower than the first wettability.

公开(公告)号：US12153282B2

公开(公告)日：2024-11-26

申请号：US17419316

申请日：2019-11-29

Applicant: NIPPON ELECTRIC GLASS CO., LTD.

Inventor： Yoshimasa Yamaguchi

IPC: G02B7/18 ,  G02B5/04 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58

Abstract: A prism is provided with which the positional accuracy can be effectively enhanced. The prism includes: a prism body 2 having a bottom surface 2a and an inclined surface 2b connected to the bottom surface 2a; and an adhesive film 3 provided on the bottom surface 2a, the adhesive film 3 including a first layer portion positioned on a side facing the prism body 2 and a second layer portion 6 including at least one of an Au layer or an Sn layer, the first layer portion 5 and the second layer portion 6 directly or indirectly stacked.

公开(公告)号：US20240387756A1

公开(公告)日：2024-11-21

申请号：US18668718

申请日：2024-05-20

Applicant: Alliance for Sustainable Energy, LLC ,  Colorado School of Mines

Inventor： Ann London GREENAWAY ,  Grace Ann ROME ,  Adele Clare TAMBOLI ,  Talysa Renae KLEIN

IPC: H01L31/0203 ,  H01L31/0224 ,  H01L31/18

Abstract: Described herein are devices and methods that provide for the protection of photoelectrodes by encapsulating the surface exposed to the electrolyte with a transparent polymer containing dispersed transition metal coated polymer particles or spheres. Advantageously, these transparent conductive encapsulants (TCEs) provide significant conductivity while providing high transparency, allowing more photons to reach the photoelectrode, resulting in higher efficiency and longer device lifetimes.

公开(公告)号：US20240387755A1

公开(公告)日：2024-11-21

申请号：US18614194

申请日：2024-03-22

Applicant: JCET GROUP CO., LTD.

Inventor： Xianfang YANG ,  Qi ZHU

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/52

Abstract: The present disclosure pertains to a packaging structure for electronic devices, which comprises: a substrate and an optical device fixed to the substrate, an upper surface of the optical device has an optical region for receiving and/or transmitting light signals; an outer cover hermetically connected to the upper surface of the optical device and surrounding the optical region, which has an opening; and a transparent inner cover disposed inside the opening and sealing the opening, the upper surface of the optical device, the outer cover and the transparent inner cover are sealed to form a cavity, and a light signal path between the optical region and the exterior of the packaging structure passes through the opening and the transparent inner cover. The present disclosure provides a small cavity packaging structure, which maintains the sealing integrity of the cavity even when the air inside the cavity expands due to heating.

公开(公告)号：US12140699B2

公开(公告)日：2024-11-12

申请号：US17272718

申请日：2019-09-02

Applicant: ams AG

Inventor： Harald Etschmaier ,  Klaus Schmidegg ,  James Eilertsen

IPC: G01S7/481 ,  G01S17/08 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18

Abstract: A method of manufacturing an optical sensor arrangement including the steps of providing a substrate having a surface and providing an integrated circuit comprising an optical detector arranged for detecting light of a desired wavelength range. The integrated circuit and a light emitter are mounted onto the surface, wherein the light emitter is arranged for emitting light in the desired wavelength range. The integrated circuit and the light emitter are electrically connected to each other and to the substrate. A light barrier is formed between the optical detector and the light emitter by dispensing a first optically opaque material along a profile of the integrated circuit. A mold layer is formed by at least partly encapsulating the substrate, the integrated circuit and the light emitter with an optically transparent material. A casing, made from a second optically opaque material, is mounted on the light barrier and thereby encloses a hollow space between the casing and the mold layer.

公开(公告)号：US20240355939A1

公开(公告)日：2024-10-24

申请号：US18592054

申请日：2024-02-29

Applicant: Artilux, Inc.

Inventor： Chih-Wei Chen ,  Cheng-Te Yu

IPC: H01L31/0216 ,  H01L31/0203 ,  H01L31/028 ,  H01L31/12

CPC classification number: H01L31/02164 ,  H01L31/0203 ,  H01L31/028 ,  H01L31/125

Abstract: An optical sensor device and related methods are presented. For example, an optical sensor device can include a substrate, a light-receiving element including a first absorption region, and disposed on and electrically connected to the substrate, and a first light-emitting element disposed on and electrically connected to the substrate. The optical sensor device can include an encapsulating structure disposed over the substrate, and encapsulating the light-emitting element and the light-receiving element. The optical sensor device can include a shielding structure disposed over the encapsulating structure, including a first opening located over the first light-emitting element, and a second opening located over the light-receiving element. The first absorption region can include a non-shielded portion exposed to an optical signal under the second opening of the shielding structure and a shielded portion shielded from the optical signal by the shielding structure.

公开(公告)号：US12113140B2

公开(公告)日：2024-10-08

申请号：US17668739

申请日：2022-02-10

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Seghizzi ,  Linda Montagna ,  Giuseppe Visalli ,  Mikel Azpeitia Urquia

IPC: H01L31/0232 ,  G02B26/08 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/113 ,  H02N1/00

CPC classification number: H01L31/02325 ,  G02B26/0841 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1136 ,  H02N1/004

Abstract: Disclosed herein is an integrated component formed by a first wafer having first and second trenches defined in a top surface thereof, and a second wafer coupled to the first wafer and formed by a substrate with a structural layer thereon that integrated an electromagnetic radiation detector overlying the second trench. A first cap is coupled to the second wafer, overlies the electromagnetic radiation detector, and serves to define a first air-tight chamber in which the electromagnetic radiation detector is positioned. A stator, a rotor, and a mobile mass are integrated within the substrate and form a drive assembly for driving the mobile mass. The rotor overlies the first trench. A second cap is coupled to the second wafer, overlies the mobile mass, and serving to define a second air-tight chamber in which the mobile mass is positioned.