公开(公告)号：US11967652B2

公开(公告)日：2024-04-23

申请号：US18110610

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

公开(公告)号：US20240204018A1

公开(公告)日：2024-06-20

申请号：US18118572

申请日：2023-03-07

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Jui-Hung Hsu ,  Li-Chun Hung ,  Chien-Chen Lee

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L24/48 ,  H01L2224/48227

Abstract: A chip packaging structure is provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, a grating film, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate and has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The second substrate is disposed on an upper surface of the supporting member. The grating film is disposed on a peripheral region of the second substrate and includes a plurality of grating units. The encapsulant is attached to the upper surface of the first substrate, a side surface of the supporting member, and a side surface of the second substrate.

公开(公告)号：US11984516B2

公开(公告)日：2024-05-14

申请号：US18110666

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

公开(公告)号：US12224359B2

公开(公告)日：2025-02-11

申请号：US18110637

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

公开(公告)号：US12189152B2

公开(公告)日：2025-01-07

申请号：US18166446

申请日：2023-02-08

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Li-Chun Hung

IPC: G02B5/02 ,  H04N23/54 ,  H04N23/55

Abstract: A sensor lens assembly includes a circuit board, an optical module assembled onto the circuit board, and a sensing module that is surrounded by the optical module. The sensing module includes a sensor chip disposed on and electrically coupled to the circuit board, a supporting layer having a ring shape and disposed on the sensor chip, and a light-permeable layer. The light-permeable layer is disposed on the supporting layer through a ring-shaped segment thereof, so that the light-permeable layer, the supporting layer, and the sensor chip jointly define an enclosed space. The ring-shaped segment has a ring-shaped roughened region. A projection space defined by orthogonally projecting the ring-shaped roughened region toward the sensor chip is located outside of a sensing region of the sensor chip and overlaps an entirety of the supporting layer and a part of the enclosed space.

公开(公告)号：US12177996B2

公开(公告)日：2024-12-24

申请号：US18113723

申请日：2023-02-24

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Li-Chun Hung ,  Chien-Chen Lee ,  Chia-Shuai Chang

IPC: H05K5/02 ,  H01L27/146 ,  H05K5/00 ,  H05K7/14

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically coupling the substrate and the sensor chip, a frame fixed on the substrate, and a light-permeable layer that is disposed on the frame. The light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment. The ring-shaped segment is disposed on a top end surface of the frame, so that the light-permeable layer, the frame, and the substrate jointly define an enclosed space that accommodates the sensor chip and the metal wires therein. The ring-shaped segment has an inner ring-shaped roughened region that is arranged on an inner surface thereof and that is fixed onto the top end surface of the frame. Moreover, an inner edge of the inner ring-shaped roughened region is arranged in the enclosed space.

公开(公告)号：US20240088179A1

公开(公告)日：2024-03-14

申请号：US17968112

申请日：2022-10-18

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： You-Wei Chang ,  Chien-Chen Lee ,  Li-Chun Hung

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.