公开(公告)号：US11984516B2

公开(公告)日：2024-05-14

申请号：US18110666

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

公开(公告)号：US12224359B2

公开(公告)日：2025-02-11

申请号：US18110637

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

公开(公告)号：US11967652B2

公开(公告)日：2024-04-23

申请号：US18110610

申请日：2023-02-16

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Fu-Chou Liu ,  Jui-Hung Hsu ,  Yu-Chiang Peng ,  Chien-Chen Lee ,  Ya-Han Chang ,  Li-Chun Hung

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L31/0203

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.