公开(公告)号：US20240243055A1

公开(公告)日：2024-07-18

申请号：US18557765

申请日：2022-04-26

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA

IPC: H01L23/498 ,  H01L23/057

CPC classification number: H01L23/49838 ,  H01L23/057

Abstract: An electronic-component mounting package includes: an insulating wiring laminate including an upper surface; differential lines located on the wiring laminate; differential lines located on the upper surface and alongside the differential lines and having shorter line lengths than the differential lines; and a wall covering part of each of the differential lines and being in contact with the upper surface of the wiring laminate. The wall includes a protruding portion in plan view from above the upper surface, and portions of the differential lines, the portions being covered with the protruding portion, are longer than portions of the differential lines, the portions being covered with the protruding portion.

公开(公告)号：US20240405130A1

公开(公告)日：2024-12-05

申请号：US18807112

申请日：2024-08-16

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA

IPC: H01L31/02 ,  H01L31/0203 ,  H01S5/02315

Abstract: A dielectric substrate has a first surface including a first terminal connector and a second terminal connector located along a first side surface. A recess is between the first terminal connector and the second terminal connector. The recess has a first inner surface continuous with the first terminal connector, a second inner surface continuous with the second terminal connector, and a bottom surface between the first inner surface and the second inner surface. The first terminal connector has first wettability with a bond on its surface, and a first region has second wettability with the bond on its surface lower than the first wettability.

公开(公告)号：US20220165889A1

公开(公告)日：2022-05-26

申请号：US17436111

申请日：2020-03-09

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA

IPC: H01L31/02 ,  H01L31/0203 ,  H01S5/02315

Abstract: A dielectric substrate has a first surface including a first terminal connector and a second terminal connector located along a first side surface. A recess is between the first terminal connector and the second terminal connector. The recess has a first inner surface continuous with the first terminal connector, a second inner surface continuous with the second terminal connector, and a bottom surface between the first inner surface and the second inner surface. The first terminal connector has first wettability with a bond on its surface, and a first region has second wettability with the bond on its surface lower than the first wettability.

公开(公告)号：US20230057427A1

公开(公告)日：2023-02-23

申请号：US17799372

申请日：2021-01-14

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA ,  Takeo SATAKE

IPC: H01L23/528 ,  H01L23/04 ,  H01L23/08 ,  H01S5/022 ,  H01L23/498

Abstract: In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.

公开(公告)号：US20220217834A1

公开(公告)日：2022-07-07

申请号：US17605162

申请日：2020-04-27

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA

IPC: H05K1/02

Abstract: A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.

公开(公告)号：US20180352648A1

公开(公告)日：2018-12-06

申请号：US15768059

申请日：2017-01-26

Applicant: KYOCERA Corporation

Inventor： Toshihiko KITAMURA

IPC: H05K1/02 ,  H01S5/022

Abstract: A wiring board includes a signal conductor wiring positioned on a first face of a first dielectric layer, and a ground conductor wiring positioned on a second face thereof. A region of the ground conductor wiring where a first end portion of the signal conductor wiring is positioned in plan view is cut away inwardly from a first side of the second face opposing a first side of the first face.