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    Method of draining and filling multi-pass heat exchanger
    1.
    发明授权
    Method of draining and filling multi-pass heat exchanger 有权

    公开(公告)号：US12111111B2

    公开(公告)日：2024-10-08

    申请号：US17502231

    申请日：2021-10-15

    申请人： Guntner GmbH & Co. KG

    发明人： Alfred Erhard ,  Hansjorg Brentrop

    IPC分类号： F28D1/00 ,  F28D1/02 ,  F28D1/04 ,  F28D1/053 ,  F28F27/02

    CPC分类号： F28D1/0417 ,  F28D1/0233 ,  F28D1/0426 ,  F28D1/0443 ,  F28D1/05325 ,  F28D1/05333 ,  F28D1/05366 ,  F28F27/02

    摘要： The invention relates to a heat exchanger assembly with at least one multi-pass heat exchanger, comprising a first distributor (1) with a first connection part (1a) for connecting to a fluid line (9), a second distributor (2) with a second connection part (2a) for connecting to a fluid line (9), and at least one first deflection distributor (4), as well as a plurality of tube lines (5) through which a fluid, in particular water, can flow, wherein the first distributor (1) and the second distributor (2) are arranged at one end (A) of the heat exchanger assembly, the deflection distributor (4) is arranged at the opposite end (B) and the tube lines (5) extend from the one end (A) to the opposite end (B), and wherein the first connection part (1a) is arranged at a lowest point (T) or at least near to the lowest point (T) of the first distributor (1) and the second connection piece (2a) is arranged at a lowest point (T) or at least near to the lowest point (T) of the second distributor (2). In order to allow for the heat exchanger assembly to be quickly filled with the fluid and quickly emptied, a third connection part (3) is arranged on the first distributor (1) and/or on the second distributor (2) at a highest point (H) or at least near to the highest point (H) of the respective distributor (1 or 2), and at least one ventilation opening (10) is provided at a highest point (T) or at least near to the highest point (T) of the deflection distributor (4) for pressure equalisation with the environment.

    SYSTEMS FOR PROCESSING ONE OR MORE SEMICONDUCTOR DEVICES, AND RELATED METHODS
    2.
    发明公开
    SYSTEMS FOR PROCESSING ONE OR MORE SEMICONDUCTOR DEVICES, AND RELATED METHODS 审中-公开

    公开(公告)号：US20240321603A1

    公开(公告)日：2024-09-26

    申请号：US18732053

    申请日：2024-06-03

    申请人： Micron Technology, Inc.

    发明人： Michael E. Koltonski

    IPC分类号： H01L21/67 ,  F28D1/02 ,  H01J37/32 ,  H01L21/3065

    CPC分类号： H01L21/67069 ,  F28D1/0213 ,  H01J37/32091 ,  H01J37/32724 ,  H01L21/3065

    摘要： A system for fabricating a semiconductor device structure includes a tool comprising a chamber and a platform within the chamber configured to receive a semiconductor device structure thereon. The tool further includes a heating and cooling system in operable communication with the platform and configured to control a temperature of the platform. The heating and cooling system comprises a cooling system including a cold tank for containing a cold thermal transfer fluid, the cold tank configured to be in fluid communication with the platform, thermal transfer fluid supply piping, and thermal transfer fluid return piping, a heating system including a hot tank for containing a hot thermal transfer fluid having a higher temperature than the cold thermal transfer fluid, the hot tank configured to be in fluid communication with the platform, the thermal transfer fluid supply piping, and the thermal transfer fluid return piping, and at least one temporary storage tank configured to receive at least some of the cold thermal transfer fluid or the hot thermal transfer fluid from at least the thermal transfer fluid return piping after switching a thermal load from the platform from one of the cooling system or the heating system to the other of the cooling system or the heating system. Related methods and tools are disclosed.

    Multi-fluid heat exchanger
    7.
    发明授权
    Multi-fluid heat exchanger 有权

    公开(公告)号：US11965697B2

    公开(公告)日：2024-04-23

    申请号：US17190103

    申请日：2021-03-02

    申请人： General Electric Company

    发明人： Nicholas M. Daggett ,  Steven Douglas Johnson ,  Anand P. Roday ,  Scott Alan Schimmels

    IPC分类号： F28D1/04 ,  F28D1/02 ,  F28D1/047 ,  F28F9/00

    CPC分类号： F28D1/0443 ,  F28D1/0233 ,  F28D1/0475 ,  F28F9/001 ,  F28D2001/0273

    摘要： A heat exchanger is provided. The heat exchanger includes a first wall manifold. The heat exchanger further includes a second wall manifold spaced apart from the first wall manifold. The heat exchanger further includes a plurality of vanes that extend generally circumferentially between the first wall manifold and the second wall manifold. The heat exchanger further includes a plurality of fluid circuits defined within the heat exchanger. Each fluid circuit in the plurality of fluid circuits includes an inlet channel portion and an outlet channel portion defined within the first wall manifold. A return channel portion defined within the second wall manifold. At least one passage portion of a plurality of passage portions defined within each vane of the plurality of vanes. The at least one passage portion extends between the return channel portion and one of the inlet channel portion and the outlet channel portion.

    Heat exchanger and manufacturing method therefor
    8.
    发明授权
    Heat exchanger and manufacturing method therefor 有权

    公开(公告)号：US11779994B2

    公开(公告)日：2023-10-10

    申请号：US17845556

    申请日：2022-06-21

    申请人： NORITZ CORPORATION

    发明人： Naoki Se ,  Hideyuki Fujisawa

    IPC分类号： F28F9/26 ,  B21D53/08 ,  B21D39/08 ,  F28D1/02 ,  F28D1/047 ,  F28F9/18 ,  F24H1/41

    CPC分类号： B21D53/085 ,  B21D39/08 ,  F28D1/0213 ,  F28D1/0477 ,  F28F9/182 ,  F28F9/26 ,  F24H1/41 ,  F28F2275/04

    摘要： A heat exchanger includes a plurality of heat transfer tubes housed in a predetermined case, a connecting tube body for connecting the plurality of heat transfer tubes, a predetermined tube expansion portion provided on each heat transfer tube, a first peripheral wall portion provided on the tube expansion portion, and a second peripheral wall portion that is positioned on an end portion of the connecting tube body and fitted to the tube expansion portion, wherein the first and second peripheral wall portions have different sectional shapes and are fitted together in a partial contact state including predetermined contact and non-contact portions. According to this configuration, the heat transfer tubes can be fixed to a side wall portion of the case and the connecting tube body can be connected to the heat transfer tubes easily and appropriately.

    COMPACT HEAT EXCHANGER
    9.
    发明公开
    COMPACT HEAT EXCHANGER 审中-公开

    公开(公告)号：US20230251042A1

    公开(公告)日：2023-08-10

    申请号：US18012869

    申请日：2021-06-24

    申请人： WATERGEN LTD.

    发明人： Sharon DULBERG

    IPC分类号： F28D9/00 ,  F28D1/02 ,  F28F1/32 ,  F28D1/053

    CPC分类号： F28D9/0068 ,  F28D1/024 ,  F28F1/325 ,  F28D1/053 ,  F28D2021/0038

    摘要： A heat exchanger having a fins and tubes heat exchanger coupled to a plates heat exchanger and an open sided bypass compartment facing one of the edges of the fin and tubes heat exchanger. The plates heat exchanger has an inlet zone and an outlet zone. The heat exchanger is configured to guide a fluid to flow from the inlet zone, through inlet pathways between plates of the plates heat exchanger, and fins of the fins and tubes heat exchanger then toward the bypass compartment, then in between the fins facing outlet pathways, toward in between the surfaces of the plates facing the outlet pathways, and then toward the outlet zone.