公开(公告)号：US07102212B2

公开(公告)日：2006-09-05

申请号：US11215763

申请日：2005-08-30

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L23/495 ,  H01L31/203

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US07045755B2

公开(公告)日：2006-05-16

申请号：US10879545

申请日：2004-06-28

申请人： Ming-Chiang Tsai ,  Chun-Yu Lee ,  Tsung-Wei Jiang

发明人： Ming-Chiang Tsai ,  Chun-Yu Lee ,  Tsung-Wei Jiang

IPC分类号： H01L27/00 ,  H01L31/203

CPC分类号： H01L27/14812 ,  H01L27/14627 ,  H01L27/14887 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An image sensor package (10) includes a housing (34) defining a top opening, an image sensor (14) received in the housing, and a converging lens (36) covering the opening to hermetically seal the housing and form a window for light to pass through into the housing. The image sensor has an active area which faces the converging lens and which is responsive to light. The converging lens not only provides hermetic sealing for the housing, but also converges light before the light strikes the active area of the image sensor. Accordingly, a focal length F is reduced, and a size of the image sensor package and the image sensor system can be reduced.

摘要翻译： 图像传感器封装（10）包括限定顶部开口的壳体（34），容纳在壳体中的图像传感器（14）和覆盖开口的会聚透镜（36），以密封壳体并形成用于光的窗口 穿过房屋。 图像传感器具有面向会聚透镜并且响应于光的有效区域。 会聚透镜不仅为外壳提供气密密封，而且在光照射到图像传感器的有效区域之前会聚光。 因此，焦距F被减小，并且可以减小图像传感器封装和图像传感器系统的尺寸。

公开(公告)号：US07115961B2

公开(公告)日：2006-10-03

申请号：US10925502

申请日：2004-08-24

申请人： Charles M. Watkins ,  David R. Hembree ,  Peter A. Benson ,  Salman Akram

发明人： Charles M. Watkins ,  David R. Hembree ,  Peter A. Benson ,  Salman Akram

IPC分类号： H01L31/203

CPC分类号： H01L27/14625 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.

摘要翻译： 本文公开了微电子成像装置和包装微电子成像装置的方法。 在一个实施例中，微电子成像装置包括具有集成电路的微电子管芯，电耦合到集成电路的图像传感器，以及电耦合到集成电路的多个接合焊盘。 所述成像装置还包括覆盖在所述图像传感器上的盖和在所述盖中和/或盖上的多个互连件，其电耦合到所述管芯的相应接合焊盘。 互连件为模具的焊盘提供外部电触头。 互连可以延伸穿过盖或沿着盖的表面。

公开(公告)号：US07084473B2

公开(公告)日：2006-08-01

申请号：US10825077

申请日：2004-04-15

申请人： Julien Vittu

发明人： Julien Vittu

IPC分类号： H01L31/203

CPC分类号： H04N5/2257 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor package includes a package body containing an integrated-circuit chip having an optical sensor. The package can be fitted into an object having two parts suitable for being coupled. A board in the object is provided with electrical connection tracks. The package is placed in a position such that the optical sensor is located facing an opening in the object. The package body carries, on the one hand, resilient rear electrical connection leads that project from a rear face and are electrically connected to the said chip and has, on the other hand, a front bearing surface, such that, when the package body is fitted into the object adjacent the board and when the parts of the object are coupled, the front bearing surface of the body bears on an inner surface of a part of the object and the resilient rear leads bear resiliently on the respective electrical connection tracks of the board.

摘要翻译： 半导体封装包括包含具有光学传感器的集成电路芯片的封装体。 包装可以装配到具有适于联接的两个部分的物体中。 物体中的电路板设有电气连接轨道。 将包装放置在使得光学传感器面向物体中的开口的位置。 包装体一方面携带弹性的后电连接引线，其从后表面突出并且电连接到所述芯片，并且另一方面具有前支撑表面，使得当封装主体是 装配到邻近板的物体中，并且当物体的部分联接时，本体的前支承表面承载在物体的一部分的内表面上，弹性后引线弹性地承载在物体的相应的电连接轨道上 板。

公开(公告)号：US07294897B2

公开(公告)日：2007-11-13

申请号：US10879398

申请日：2004-06-29

申请人： Salman Akram ,  Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  William M. Hiatt

发明人： Salman Akram ,  Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  William M. Hiatt

IPC分类号： H01L31/203

CPC分类号： H01L27/146 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/148 ,  H01L31/02016 ,  H01L2224/48227 ,  H01L2924/01046 ,  H01L2924/01066 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

摘要： Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.

摘要翻译： 本文公开了微电子成像器，用于封装微电子成像器的方法，以及用于在微电子成像器中形成导电晶片间互连的方法。 在一个实施例中，微电子成像管芯可以包括微电子衬底，集成电路和电耦合到集成电路的图像传感器。 接合焊盘由衬底承载并电耦合到集成电路。 导电晶片互连延伸穿过衬底并与接合焊盘接触。 互连可以包括完全延伸穿过衬底和接合焊盘的通道，沉积到通道中并与衬底接触的电介质衬垫，沉积在电介质衬垫的至少一部分上的第一和第二导电层以及导电 在第二导电层的至少一部分上沉积到通道中并且电耦合到接合焊盘的填充材料。

公开(公告)号：US07294827B2

公开(公告)日：2007-11-13

申请号：US10711476

申请日：2004-09-21

申请人： Teck Tiong Tan ,  Binghua Pan ,  Jeffrey H. Burns ,  John R. Troxell

发明人： Teck Tiong Tan ,  Binghua Pan ,  Jeffrey H. Burns ,  John R. Troxell

IPC分类号： H01J5/02 ,  H01L31/203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00

摘要： An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.

摘要翻译： 一种电子模块，适于感测光并被配置为使杂散光进入模块最小化。 模块包括具有开口的壳体，光通过该开口进入壳体，耦合到壳体的第一基板，与壳体相对的第一基板上的第二基板和第二基板上的芯片。 第一基板限定与壳体对准的窗口，使得穿过壳体的光也穿过窗口。 第二基板限定与窗口对准的开口，并且芯片位于第二基板中的开口上方，使得芯片上的感光元件感测穿过开口的光。 该模块配备有防止光通过第二基板，第一基板以及芯片与第二基板之间进入模块的特征。

公开(公告)号：US07812422B2

公开(公告)日：2010-10-12

申请号：US11790827

申请日：2007-04-27

申请人： Ming-Liang Huang ,  Yao-Jung Lee ,  Ming-Hsun Li

发明人： Ming-Liang Huang ,  Yao-Jung Lee ,  Ming-Hsun Li

IPC分类号： H01L31/203

CPC分类号： G06K9/00053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/00014

摘要： A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film, an encapsulant and a metal base to mechanically hold the fingerprint sensor chip. A sensing area is formed on the active surface of the fingerprint sensor chip. The bumps are disposed on the active surface. The wiring film has an opening to expose the sensing area and comprises a plurality of leads bonded to the bumps. The wiring film further has a ground lead electrically connecting the fingerprint sensor chip to the metal base. Therefore, the fingerprint sensor package can provide ESD protection during fingerprint recognition to avoid the damage of the fingerprint sensor chip.

摘要翻译： 薄膜指纹传感器封装主要包括指纹传感器芯片，多个凸块，布线膜，密封剂和金属基座，以机械地保持指纹传感器芯片。 在指纹传感器芯片的有效表面上形成感测区域。 凸块设置在活动表面上。 布线膜具有用于暴露感测区域的开口并且包括结合到凸块的多个引线。 布线膜还具有将指纹传感器芯片电连接到金属基底的接地引线。 因此，指纹传感器封装可以在指纹识别期间提供ESD保护，以避免指纹传感器芯片的损坏。

公开(公告)号：US07307286B2

公开(公告)日：2007-12-11

申请号：US10964733

申请日：2004-10-15

申请人： Hisataka Ito ,  Shinya Ota

发明人： Hisataka Ito ,  Shinya Ota

IPC分类号： H01L31/203

CPC分类号： H01L23/293 ,  C08K3/36 ,  C09D7/61 ,  C09D7/67 ,  H01L2924/0002 ,  C08L63/00 ,  H01L2924/00

摘要： An epoxy resin composition for encapsulating an optical semiconductor element, which has small internal stress and also can obtain good light transmittance within a broad temperature range. An epoxy resin composition for encapsulating an optical semiconductor element comprising the following component (A):(A) an epoxy resin complex which comprises an epoxy resin as the matrix component and silicon dioxide particles (a) dispersed therein:(a) silicon dioxide particles having an average particle size of from 5 to 40 nm measured by the small angle neutron scattering (SANS).

摘要翻译： 一种用于封装光半导体元件的环氧树脂组合物，其具有小的内应力，并且还可以在宽的温度范围内获得良好的透光率。 一种用于封装包含以下组分（A）的光学半导体元件的环氧树脂组合物：（A）包含环氧树脂作为基质组分和分散在其中的二氧化硅颗粒（a）的环氧树脂配合物：（a）二氧化硅颗粒 通过小角度中子散射（SANS）测量的平均粒径为5至40nm。

公开(公告)号：US07167376B2

公开(公告)日：2007-01-23

申请号：US10845570

申请日：2004-05-14

申请人： Mamoru Miyashita ,  Hiroki Ohta

发明人： Mamoru Miyashita ,  Hiroki Ohta

IPC分类号： H01L31/203 ,  H01L31/232

CPC分类号： H04N5/2254 ,  H04N5/2253 ,  H05K1/183 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10515

摘要： A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is mounted; and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.

摘要翻译： 多个组件重叠安装的多层布线板。 多层布线基板包括：第一表面，其中安装有多个部件中的第一部件; 并且所述多层布线基板的厚度方向的高度比所述第一面的厚度小的第二面，在所述第一面和所述第二面之间形成台阶，所述多个部件的第二部件安装在 第二表面以非接触方式部分地与第一部件重叠，第二表面还具有透光窗口，光通过该透光窗口透射。

公开(公告)号：US07321455B2

公开(公告)日：2008-01-22

申请号：US11187105

申请日：2005-07-22

申请人： Larry D. Kinsman

发明人： Larry D. Kinsman

IPC分类号： G02F1/03 ,  H01L31/203 ,  H01L23/34 ,  H01L21/00 ,  H01L27/00 ,  H01L27/15

CPC分类号： H01L27/14683 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： Microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, a method includes placing a plurality of singulated radiation responsive dies on a support member, electrically connecting circuitry of the radiation responsive dies to contacts of the support member, and forming a barrier on the support member between adjacent radiation responsive dies without an adhesive attaching the barrier to the support member. The barrier is formed on the support member after electrically connecting the circuitry of the dies to the contacts of the support member. The barrier can encapsulate at least a portion of the wire-bonds.

摘要翻译： 本文公开了微电子器件和封装微电子器件的方法。 在一个实施例中，一种方法包括将多个单独的辐射响应模具放置在支撑构件上，将辐射响应模具的电路电连接到支撑构件的触点，以及在相邻的辐射响应模具之间的支撑构件上形成屏障， 粘合剂将阻挡件附接到支撑构件。 在将模具的电路电连接到支撑构件的触点之后，在支撑构件上形成屏障。 阻挡层可以封装至少一部分引线键合。