摘要:
The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a par of light sources is used in conjunction with an optical receiving device, such as a camera having a CCD, to illuminate and inspect a substrate for various optical signatures. The substrate signatures are then used to generate images of obstructions in three dimensions (3-D) for further analysis. In one embodiment, the substrate is scanned in two or more directions with a first light source and then scanned in two or more directions with a second light source. A receiver captures the reflected and/or scatted signals from sources comprising two or more different images. The light illumination from the first and second light sources impinges on substrate surface obstructions from two differing angles (i.e. perspectives). Therefore, the image from the first light source obtains information pertaining to one side of obstructions while the image from the second light source offers information pertaining to the opposite side of the obstruction. Differentiation between the images is provided by either different perspective angles and/or different optical filtering configurations.
摘要:
A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtered. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer to aid in statistical process control, particularly for manufacturing equipment.
摘要:
When performing a defect inspection of a wafer W, defect observation equipment 3 first inputs defect position data from defect detection equipment 2. After a plurality of measurement points are set, the amount of position shift between the detection coordinate system and the observation coordinate system is measured for each measurement point. Then, the defect observation equipment 3 creates a first-order defect position correction formula in order to make reasonable the defect position in the detection coordinate system, based on the position shift amounts of the measurement points. This first-order defect position correction formula has three terms, for the offset component, the magnification component, and the rotation component of the observation coordinate system with respect to the detection coordinate system. Next, using the defect position correction formula, a defect position detected by the defect detection equipment 2 is corrected. By this means, the resolution of the defect observation equipment is raised, and the precision of substrate defect inspection is improved.
摘要:
The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. More specifically, optical signal routing methods and apparatus provide multiple inspection collection points on a semiconductor processing system. In one aspect, an optical inspection system comprises a light source and an optical receiving device, such as a CCD camera, to illuminate and inspect a substrate for various optical signatures. A plurality of optical inspection systems are connected to a signal switching device, such as a multiplexer, which operates to route a particular signal to a detector.
摘要:
The present invention generally provides an apparatus and a method for scanning a substrate in a processing system. A transmitter unit and a receiver unit are disposed on a processing system and cooperate to transmit and detect energy, respectively. The transmitter unit is positioned to transmit a signal onto the substrate surface moving between vacuum chambers, one of which is preferably a transfer chamber of a cluster tool. Features disposed on the substrate surface, which may include particles, devices, alphanumeric characters, the substrate edges, notches, etc., cause a scattering or reflection of a portion of the signal. The receiver unit is disposed to collect the scattered/reflected portion of the signal and direct the same to a processing unit. Preferably, the transmitter unit comprises a laser source and the receiver unit comprises a charged-coupled device (CCD). Preferably, the invention is integrally positioned in a processing system to allow substrate inspection during normal operation and provide real-time information.
摘要:
A laser inspection apparatus has a light source 13 for outputting laser beam, application means 5, 33, 34 for irradiating the laser beam 7 output from the light source 13 to any desired position of a detected body 21, first detection means 2 for detecting fluorescence 8 generated from the detected body 21 to which the laser beam 7 is applied, and second detection means 3 for detecting reflected light 8 scattered on a surface of the detected body 21 to which the laser beam 7 is applied.
摘要:
Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 &OHgr; per square. The PSF provides selective filtering in two directions. In other words, the PSF provides two dimensional filtering.
摘要:
Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 &OHgr; per square.
摘要:
A method and an apparatus for detecting a necking error during semiconductor manufacturing. At least one semiconductor wafer is processed. Metrology data from the processed semiconductor wafer is acquired. Data from a reference library comprising optical data relating to a poly-silicon formation on a semiconductor wafer is accessed. The metrology data is compared to data from the reference library. A fault-detection analysis is performed in response to the comparison of the metrology data and the reference library data.
摘要:
The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. One embodiment provides a substrate inspection apparatus, comprising a vacuum chamber lid, the lid comprising a body defining at least three ports located to provide a field of view to a common area on a substrate transfer plane and light management system.