公开(公告)号：US20240288144A1

公开(公告)日：2024-08-29

申请号：US18659050

申请日：2024-05-09

Applicant: HANGZHOU HANGKE OPTOELECTRONICS CO., LTD.

Inventor： Qianjun YAN ,  Zhaozhang ZHENG ,  Jun LI ,  Hai WANG

IPC: F21V3/02 ,  F21S4/26 ,  F21V3/04 ,  F21V3/12 ,  F21V17/12 ,  F21V21/06 ,  F21V23/00 ,  F21V23/04 ,  F21Y113/00 ,  F21Y115/10

CPC classification number: F21V3/02 ,  F21S4/26 ,  F21V3/049 ,  F21V3/12 ,  F21V17/12 ,  F21V21/06 ,  F21V23/002 ,  F21V23/04 ,  F21Y2113/00 ,  F21Y2115/10

Abstract: Disclosed is a light tube, a light fixture, and a light body. The light tube comprises at least one tube member and at least one flexible filament. The tube member includes a light-transmitting tube and one or more inner layers. The at least one flexible filament penetrates into the tube member. The light fixture comprises a light holder and the light tube. The at least one tube member includes a sealed end and a connecting end. The at least one tube member is mounted on the light holder. The light body comprises the light tube and a light cap. The light cap is fixedly connected with the connecting end of the at least one tube member. A drive power board is disposed in the light cap. Positive and negative pins of the drive power board are electrically connected with a top end and a side end of the light cap, respectively.

公开(公告)号：US20240218241A1

公开(公告)日：2024-07-04

申请号：US18603060

申请日：2024-03-12

Applicant: Avantama AG

Inventor： Norman Albert Lüchinger ,  Lin Fangjian ,  Tom Mitchell-Williams ,  Stefan Loher

IPC: C09K11/02 ,  C01D13/00 ,  C01D15/00 ,  C01D17/00 ,  C01G17/00 ,  C01G19/00 ,  C01G21/00 ,  C01G29/00 ,  C01G30/00 ,  C09D5/22 ,  C09K11/06 ,  C09K11/66 ,  F21V3/12 ,  F21V9/38 ,  G02F1/1335 ,  G02F1/13357 ,  H01L33/50 ,  H01L33/56 ,  H10K50/125

CPC classification number: C09K11/02 ,  C01D13/00 ,  C01D15/00 ,  C01D17/003 ,  C01G17/00 ,  C01G19/00 ,  C01G21/00 ,  C01G29/00 ,  C01G30/00 ,  C09D5/22 ,  C09K11/025 ,  C09K11/06 ,  C09K11/664 ,  F21V3/12 ,  F21V9/38 ,  G02F1/133617 ,  H01L33/502 ,  H01L33/56 ,  H10K50/125 ,  G02F1/133614 ,  H01L2933/0041

Abstract: Described are luminescent components with excellent performance and stability. The luminescent components comprise a first element 1 including first luminescent crystals 11 from the class of perovskite crystals, embedded a first polymer P1 and a second element 2 comprising a second solid polymer composition, said second polymer composition optionally comprising second luminescent crystals 12 embedded in a second polymer P2. Polymers P1 and P2 differ and are further specified in the claims. Also described are methods for manufacturing such components and devices comprising such components.

公开(公告)号：US11708528B2

公开(公告)日：2023-07-25

申请号：US17618450

申请日：2020-06-15

Applicant: Avantama AG

Inventor： Norman Albert Lüchinger ,  Fangjian Lin ,  Tom Mitchell-Williams ,  Stefan Loher

IPC: C09K11/02 ,  C09K11/06 ,  G02F1/13357 ,  H01L33/50 ,  C09K11/66 ,  C09D5/22 ,  F21V3/12 ,  F21V9/38 ,  C01D13/00 ,  C01D15/00 ,  C01D17/00 ,  C01G17/00 ,  C01G19/00 ,  C01G21/00 ,  C01G29/00 ,  C01G30/00 ,  H01L33/56 ,  H10K50/125 ,  G02F1/1335

CPC classification number: C09K11/02 ,  C01D13/00 ,  C01D15/00 ,  C01D17/003 ,  C01G17/00 ,  C01G19/00 ,  C01G21/00 ,  C01G29/00 ,  C01G30/00 ,  C09D5/22 ,  C09K11/025 ,  C09K11/06 ,  C09K11/664 ,  F21V3/12 ,  F21V9/38 ,  G02F1/133617 ,  H01L33/502 ,  H01L33/56 ,  H10K50/125 ,  G02F1/133614 ,  H01L2933/0041

Abstract: Described are luminescent components with excellent performance and stability. The luminescent components comprise a first element including first luminescent crystals from the class of perovskite crystals, embedded a first polymer P1 and a second element comprising a second solid polymer composition, said second polymer composition optionally comprising second luminescent crystals embedded in a second polymer P2. Polymers P1 and P2 differ and are further specified in the claims. Also described are methods for manufacturing such components and devices comprising such components.

公开(公告)号：US11365867B2

公开(公告)日：2022-06-21

申请号：US17238711

申请日：2021-04-23

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: F21V13/14 ,  F21V9/08 ,  F21V19/00 ,  F21V7/00 ,  F21V5/04 ,  F21V15/01 ,  F21V3/00 ,  F21V9/30 ,  F21V3/10 ,  F21V3/12 ,  F21V1/17 ,  F21V3/08 ,  F21V7/28 ,  F21Y115/10 ,  F21Y113/13

Abstract: A light emitting device includes a base having a light reflecting surface and having a first side on which the light reflecting surface is provided, light sources mounted on the first side, and a half mirror disposed opposite to the base to reflect a part of incident light and to transmit another part of the incident light. Each of the light sources includes a reflecting layer on an upper surface of each of the light sources. The half mirror has an oblique reflectance with respect to wavelengths of light emitted from the light sources in a case where the light travels obliquely toward the half mirror. The half mirror has a perpendicular reflectance with respect to the wavelengths in a case where the light travels perpendicularly toward the half mirror. The oblique reflectance is smaller than the perpendicular reflectance.

公开(公告)号：US11251164B2

公开(公告)日：2022-02-15

申请号：US14453482

申请日：2014-08-06

Applicant: CreeLED, Inc.

Inventor： Fan Zhang ,  James Ibbetson ,  Bernd Keller ,  Thodore Lowes ,  Antony Van De Ven ,  Deborah Kircher ,  Tao Feng Gilbert ,  Peter Andrews

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50 ,  F21V3/12 ,  F21V3/02 ,  F21K9/64 ,  F21K9/232 ,  F21Y113/13 ,  F21Y115/10 ,  F21Y113/00

Abstract: Light emitting diodes are disclosed that utilize multiple conversion materials in the conversion process in order to achieve the desired emission color point. Different embodiments of the present invention can comprise different phosphor types in separate layers on, above or around one or a plurality of LED chips to achieve the desired light conversion. The LEDs can then emit a desired combination of light from the LED chips and conversion material. In some embodiments, conversion materials can be applied as layers of different phosphor types in order of longest emission wavelength phosphor first, followed by shorter emission phosphors in sequence as opposed to applying in a homogeneously mixed phosphor converter. The conversion material layers can be applied as a blanket over the LED chips and the area surrounding the chip, such as the surface of a submount holding the LED chips.

公开(公告)号：US10546846B2

公开(公告)日：2020-01-28

申请号：US12842639

申请日：2010-07-23

Applicant: Theodore Douglas Lowes

Inventor： Theodore Douglas Lowes

IPC: H01L25/16 ,  F21V3/12

Abstract: A light emitter device, package, or lamp that comprises and light emitter and a light transmission control material to mask the appearance of at least the light emitter. In one embodiment, a light emitting diode (LED) based lamp is disclosed, comprising an LED light source. A phosphor is arranged remote to the light source such that light emitted from the light source passes through this phosphor and is converted by this phosphor. A light transmission control material is applied at least partially outside the LED light source and the phosphor to reversibly mask the appearance of the LED light source and the phosphor. The light transmission control material is less masking when the LED light source is active. A method for masking the appearance of inactive light emitters is also disclosed that comprising providing at least one light emitter. Each of the at least one light emitters is provided with a light transmission control material over the light emitters to reversibly mask the appearance of the light emitters while the light emitters are inactive. The light transmission control material is less masking when the LED light source is active.

公开(公告)号：US12215262B2

公开(公告)日：2025-02-04

申请号：US18603060

申请日：2024-03-12

Applicant: Avantama AG

Inventor： Norman Albert Lüchinger ,  Lin Fangjian ,  Tom Mitchell-Williams ,  Stefan Loher

IPC: H01L51/50 ,  C01D13/00 ,  C01D15/00 ,  C01D17/00 ,  C01G17/00 ,  C01G19/00 ,  C01G21/00 ,  C01G29/00 ,  C01G30/00 ,  C09D5/22 ,  C09K11/02 ,  C09K11/06 ,  C09K11/66 ,  F21V3/12 ,  F21V9/38 ,  G02F1/13357 ,  H01L33/50 ,  H01L33/56 ,  H10K50/125 ,  G02F1/1335

Abstract: Described are luminescent components with excellent performance and stability. The luminescent components comprise a first element 1 including first luminescent crystals 11 from the class of perovskite crystals, embedded a first polymer P1 and a second element 2 comprising a second solid polymer composition, said second polymer composition optionally comprising second luminescent crystals 12 embedded in a second polymer P2. Polymers P1 and P2 differ and are further specified in the claims. Also described are methods for manufacturing such components and devices comprising such components.

公开(公告)号：US20240263762A1

公开(公告)日：2024-08-08

申请号：US18639089

申请日：2024-04-18

Applicant: SEOUL SEMICONDUCTOR CO., LTD.

Inventor： Chung Hoon LEE

IPC: F21V13/08 ,  F21V3/12 ,  F21V7/04 ,  F21V7/24 ,  F21V9/30 ,  F21Y105/16 ,  F21Y115/10 ,  G02F1/1335 ,  G02F1/13357 ,  H01L25/075 ,  H01L33/06 ,  H01L33/12 ,  H01L33/14 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/50 ,  H01L33/60

CPC classification number: F21V13/08 ,  F21V3/12 ,  F21V7/04 ,  F21V7/24 ,  F21V9/30 ,  G02B6/0055 ,  G02B6/0073 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/60 ,  F21Y2105/16 ,  F21Y2115/10 ,  G02F1/133614 ,  H01L33/06 ,  H01L33/12 ,  H01L33/14 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/502

Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

公开(公告)号：US11598509B2

公开(公告)日：2023-03-07

申请号：US17117330

申请日：2020-12-10

Applicant: SEOUL SEMICONDUCTOR CO., LTD.

Inventor： Chung Hoon Lee

IPC: F21V13/00 ,  F21V13/08 ,  F21V7/24 ,  F21V9/30 ,  F21V3/12 ,  H01L33/60 ,  H01L25/075 ,  H01L33/50 ,  F21V7/04 ,  G02F1/13357 ,  F21Y105/16 ,  F21Y115/10 ,  H01L33/32 ,  H01L33/06 ,  H01L33/12 ,  H01L33/14 ,  H01L33/42 ,  H01L33/46 ,  G02F1/1335

Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

公开(公告)号：US20220086975A1

公开(公告)日：2022-03-17

申请号：US17536857

申请日：2021-11-29

Applicant: ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.

Inventor： TAO JIANG ,  Wei-Hong Xu ,  YUKIHIRO SAITO ,  HAYATO UNAGIIKE ,  Ai-Ming Xiong ,  Jun-Feng Xu ,  Yi-Ching Chen

IPC: H05B45/00 ,  F21K9/232 ,  F21V15/04 ,  F21K9/61 ,  F21V3/12 ,  F21V3/08

Abstract: An LED light bulb includes a lamp housing, an LED filament in the lamp housing and a power module. The LED filament includes a first and a second LED sections, a conductive section, a first and a second conductive electrodes and a light conversion layer. Each LED section includes LED chips connected in serial to from a LED string. The conductive section connects one end of the LED string of the first LED section with one end of the LED string of the second sections. The polarities of the ends of the LED strings are the same. The other ends of the LED strings are respectively connected to the first and the second conductive electrodes. The light conversion layer is coated on at least two sides of the LED chips. The power module's terminals are connected to the conductive section and the conductive electrodes.