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公开(公告)号：US20230213174A1
公开(公告)日：2023-07-06
申请号：US18178856
申请日：2023-03-06
Applicant: SEOUL SEMICONDUCTOR CO., LTD.
Inventor： Chung Hoon LEE
IPC: F21V8/00
CPC classification number: G02B6/0073 , G02B6/0055
Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.
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公开(公告)号：US20150085225A1
公开(公告)日：2015-03-26
申请号：US14556230
申请日：2014-11-30
Applicant: Seoul Semiconductor Co., Ltd.
Inventor： Chung Hoon LEE
IPC: G02F1/1335
CPC classification number: G02F1/133608 , G02B19/0014 , G02B19/0066 , G02F1/133603
Abstract: A light emitting diode (LED) backlight unit includes: a top cover; a bottom cover connected to the top cover to constitute a housing and spaced apart under a liquid crystal panel; LEDs disposed on a first surface defined by an inner top surface of the bottom cover; and electrode patterns arranged on the first surface.
Abstract translation: 发光二极管（LED）背光单元包括：顶盖; 底盖，连接到顶盖以构成壳体并在液晶面板下方间隔; LED设置在由底盖的内顶表面限定的第一表面上; 以及布置在第一表面上的电极图案。
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公开(公告)号：US20240395980A1
公开(公告)日：2024-11-28
申请号：US18793382
申请日：2024-08-02
Applicant: Seoul Semiconductor Co., Ltd.
Inventor： Hyuck Jun KIM , Chung Hoon LEE , YO CHO
IPC: H01L33/50 , H01L25/075 , H01L33/38 , H01L33/62
Abstract: A light emitting device including at least one main light emitting unit including a light emitting diode chip and a wavelength converter, and configured to emit white light, in which the light emitting diode chip includes at least one of an ultraviolet chip, a violet chip, and a blue chip, and the light emitting device is configured to be adjustable to emit light corresponding to a spectral power distribution of morning sunlight, light corresponding to a spectral power distribution of afternoon sunlight, and light corresponding to a spectral power distribution of evening sunlight.
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公开(公告)号：US20240263762A1
公开(公告)日：2024-08-08
申请号：US18639089
申请日：2024-04-18
Applicant: SEOUL SEMICONDUCTOR CO., LTD.
Inventor： Chung Hoon LEE
IPC: F21V13/08 , F21V3/12 , F21V7/04 , F21V7/24 , F21V9/30 , F21Y105/16 , F21Y115/10 , G02F1/1335 , G02F1/13357 , H01L25/075 , H01L33/06 , H01L33/12 , H01L33/14 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/50 , H01L33/60
CPC classification number: F21V13/08 , F21V3/12 , F21V7/04 , F21V7/24 , F21V9/30 , G02B6/0055 , G02B6/0073 , G02F1/133603 , G02F1/133605 , G02F1/133606 , H01L25/0753 , H01L33/505 , H01L33/60 , F21Y2105/16 , F21Y2115/10 , G02F1/133614 , H01L33/06 , H01L33/12 , H01L33/14 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/502
Abstract: The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.
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公开(公告)号：US20240194656A1
公开(公告)日：2024-06-13
申请号：US18418939
申请日：2024-01-22
Applicant: Seoul Semiconductor Co., Ltd.
Inventor： Chung Hoon LEE
CPC classification number: H01L25/13 , H01L25/50 , H01L27/1259 , H01L33/005 , H01L33/62 , H01L2933/0066
Abstract: A display apparatus including a plurality of display modules each including a module substrate and a plurality of light emitting devices mounted on the module substrate, and a support substrate on which the display modules are disposed and including conductive members, in which the module substrates includes a plurality of recesses depressed from at least one end surface of the module substrate, and connection electrodes formed in the recesses, and the light emitting devices are electrically connected to the conducive members of the support substrate through the connection electrodes.
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Patent Agency Ranking
公开(公告)号：US20230025844A1
公开(公告)日：2023-01-26
申请号：US17788699
申请日：2020-12-22
Applicant: SEOUL SEMICONDUCTOR CO., LTD.
Inventor： Chung Hoon LEE
IPC: F21S41/663 , F21S41/153 , F21S41/176
Abstract: A headlamp device includes a headlamp, an object detector, and a controller. The headlamp is mounted on a vehicle and includes a light emitting unit composed of multiple light emitting cells. The object detector detects an object around the vehicle and generates an object detection signal including object coordinates corresponding to a location of the detected object. The controller controls light of the headlamp based on information on the object coordinates. The controller may control the light emitting unit such that at least some light emitting cells are turned off according to an object detection signal. Each of multiple light emitting units includes a circuit board, the multiple light emitting cells separated from each other on the circuit board, a molding member formed between the light emitting structures, and a protective member formed on the molding member to surround sides of the multiple wavelength conversion members while filling a gap between the multiple wavelength conversion members.
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公开(公告)号：US20210217740A1
公开(公告)日：2021-07-15
申请号：US17143089
申请日：2021-01-06
Applicant: Seoul Semiconductor Co., Ltd.
Inventor： Chung Hoon LEE
Abstract: A display apparatus including a plurality of display modules each including a module substrate and a plurality of light emitting devices mounted on the module substrate, and a support substrate on which the display modules are disposed and including conductive members, in which the module substrates includes a plurality of recesses depressed from at least one end surface of the module substrate, and connection electrodes formed in the recesses, and the light emitting devices are electrically connected to the conducive members of the support substrate through the connection electrodes.
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公开(公告)号：US20180219141A1
公开(公告)日：2018-08-02
申请号：US15940926
申请日：2018-03-29
Applicant: Seoul Semiconductor Co., Ltd. , LITEC-LP GmbH
Inventor： Chung Hoon LEE , Walter TEWS , Gundula ROTH , Detlef STARICK
CPC classification number: H01L33/504 , C09K11/025 , C09K11/7734 , H01L24/32 , H01L24/48 , H01L24/73 , H01L33/501 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/62 , H01L2224/32013 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
Abstract: A light emitting device including a housing, a plurality of heat-sinks adjoined to the housing and insulated from each other, a bottom surface of the heat-sinks being exposed to the outside, a light emitting diode mounted on at least one of the heat-sinks via a conductive adhesive, and a molding member encapsulating the light emitting diode and including thermosetting resin, in which a fluoride luminophore including I and IV group elements with fluorine and other luminophore are dispersed in the molding member, and the luminophores are configured to absorb at least a portion of light emitted from the light emitting diode and emit light having a wavelength different from that of the absorbed light.
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公开(公告)号：US20160240740A1
公开(公告)日：2016-08-18
申请号：US15137688
申请日：2016-04-25
Applicant: Seoul Semiconductor Co., Ltd.
Inventor： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
CPC classification number: H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
Abstract: A light emitting diode (LED) package includes a package body having a recessed portion, a first lead electrode and a second lead electrode spaced apart from each other, and a light emitting device arranged in the recessed portion and electrically connected to the first lead electrode and the second lead electrode. The LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode.
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公开(公告)号：US20150062966A1
公开(公告)日：2015-03-05
申请号：US14472542
申请日：2014-08-29
Applicant: SEOUL SEMICONDUCTOR CO., LTD.
Inventor： Ki Bum Nam , Yu Dae HAN , Chung Hoon LEE
CPC classification number: G02B6/0031 , F21Y2101/00 , F21Y2115/10 , G02B6/0073 , G02B6/0083 , H01L33/20 , H01L33/46 , H01L33/505 , H01L2224/14
Abstract: A light source module includes a circuit board, board pads disposed on the circuit board, and a light emitting diode chip disposed on the board pads. The light emitting diode chip includes a substrate and a semiconductor stacking part disposed between the substrate and the circuit board, and the substrate includes an inclined part disposed at an upper portion thereof and a discharging part disposed at one side surface thereof.
Abstract translation: 光源模块包括电路板，设置在电路板上的板焊盘和设置在板焊盘上的发光二极管芯片。 发光二极管芯片包括基板和布置在基板和电路板之间的半导体堆叠部分，并且基板包括设置在其上部的倾斜部分和设置在其一个侧表面处的排出部分。
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