公开(公告)号：US20040188261A1

公开(公告)日：2004-09-30

申请号：US10400762

申请日：2003-03-27

申请人： SCIMED LIFE SYSTEMS, INC.

发明人： Vittorino Monni ,  Verivada Chandrasekaran ,  Outhay Voraphet

IPC分类号： C25D005/18 ,  C25D005/38

CPC分类号： C25D5/36 ,  C25D5/18 ,  C25D5/38

摘要： Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxes. Medical devices can be assembled by soldering together plated materials. Oxidizable materials can be plated with radiopaque materials to yield medical devices that are more visible to fluoroscopy.

摘要翻译： 包括可氧化部分的医疗装置可以在两步活化过程之后进行电镀，其包括连续使用两种二氟化铵水溶液。 一旦镀覆，这些材料可以使用常规的焊料和焊剂进行焊接。 可以通过将电镀材料焊接在一起来组装医疗器械。 可氧化材料可以用不透射线的材料进行电镀，以产生对荧光透视更为可见的医疗器械。

公开(公告)号：US20040140219A1

公开(公告)日：2004-07-22

申请号：US10680969

申请日：2003-10-08

申请人： Texas Instruments Incorporated

发明人： Christo P. Bojkov ,  Kurt M. Davis ,  Michael L. Krumnow

IPC分类号： C25D005/18

CPC分类号： C25D3/56 ,  C25D5/18

摘要： According to one embodiment of the present invention, a method for electroplating electronic devices is disclosed which includes placing the outer surface of a substrate in contact with a solution comprising a conductive material. An electrical current is passed through the solution and the substrate so as to cause the conductive material to deposit on the substrate under the electromotive force caused by the electrical current. The level of the electrical current is varied from a first current level to a second current level to provide for differing rates of deposition of the conductive material on the substrate. The second current level provides a relaxation period to allow the conductive material deposited on the substrate to come to equilibrium.

摘要翻译： 根据本发明的一个实施例，公开了一种电镀电子器件的方法，其包括将衬底的外表面与包含导电材料的溶液接触。 电流通过溶液和衬底，以使导电材料在由电流引起的电动势下沉积在衬底上。 电流的电平从第一电流电平变化到第二电流电平，以提供导电材料在衬底上的不同沉积速率。 第二电流水平提供弛豫周期，以使沉积在基板上的导电材料达到平衡。

公开(公告)号：US20040020783A1

公开(公告)日：2004-02-05

申请号：US10398635

申请日：2003-04-07

发明人： Gonzalo Urrutia Desmaison ,  Stefan Kretschmer ,  Gerd Senge ,  Thorsten Ross ,  Torsten Kussner

IPC分类号： C25D005/18

CPC分类号： C25D3/38

摘要： In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.

摘要翻译： 在印刷电路板的生产中，要求有机保护涂层紧密地粘附在铜表面上。 因此，铜的无光泽层优于有光泽的涂层。 根据本发明的浴用于沉积无光泽的铜层，并且具有额外的有利特性，即，在平均阴极电流密度下，这些层也可以以非常窄的孔中的足够的涂层厚度沉积。 为此，该浴含有至少一种选自聚（1,2,3-丙三醇），聚（2,3-环氧-1-丙醇）及其衍生物的聚甘油化合物。

公开(公告)号：US20030034250A1

公开(公告)日：2003-02-20

申请号：US09766060

申请日：2001-01-18

申请人： Applied Materials, Inc.

发明人： H. Peter W. Hey ,  Yezdi N. Dordi

IPC分类号： C25D005/18 ,  C25D005/00 ,  C25D017/16 ,  C25D017/00 ,  C25D021/12

CPC分类号： H01L21/6723 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H05K3/241

摘要： A method of immersing a substrate into electrolyte solution for electroplating, the method comprising connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate. A first voltage level of the seed layer is biased to be equal to, or more positive than, a second voltage level of the anode. The substrate is then immersed into the electrolyte solution.

摘要翻译： 一种将基板浸入用于电镀的电解液中的方法，所述方法包括将浸入电解质溶液中的阳极和形成在基板上的种子层之间的电源连接起来。 种子层的第一电压电平被偏置成与阳极的第二电压电平相等或更正。 然后将衬底浸入电解质溶液中。

公开(公告)号：US20030010642A1

公开(公告)日：2003-01-16

申请号：US10132399

申请日：2002-04-26

发明人： E. Jennings Taylor ,  Jenny J. Sun ,  Maria E. Inman

IPC分类号： C25D005/18 ,  C25D005/02 ,  H05K003/00

CPC分类号： C25D5/18 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

公开(公告)号：US20020084190A1

公开(公告)日：2002-07-04

申请号：US10011269

申请日：2001-12-07

发明人： Rudiger Ewald ,  Peter Filke ,  Michael Heckmann ,  Wolflgang Keinath ,  Gunter Langel ,  Anton Schmidt

IPC分类号： C25D005/18 ,  C25D003/56 ,  C25D003/12 ,  C25C007/00 ,  C25D017/00

CPC分类号： C25D17/00 ,  C25D3/12 ,  C25D3/562 ,  C25D5/18 ,  C25D17/008 ,  C25D17/12

摘要： A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one anode and at least one cathode of the bath are subject to periodic current pulses. The IA/IC ratio of the anode current density IA to the cathode current density IC is selected to be greater than 1 and smaller than 1.5. The charge ratio QA/QCnullTAIA/TCIC of the charge QA, transported during an anode pulse of duration TA, to the charge QC transported during a cathode pulse of duration TC , is between 30 and 45. A bath for carrying out the method may have contoured anodes, current restrictors, a cleaning device for the electrolyte, and a circulating device with recycling of the electrolyte through nozzles.

摘要翻译： 在电镀浴中电镀镍，钴，镍合金或钴合金的方法包括使用含镍化合物或钴化合物的电解质。 浴中的至少一个阳极和至少一个阴极经受周期性电流脉冲。 阳极电流密度IA与阴极电流密度IC的IA / IC比选择为大于1且小于1.5。 在持续时间TA的阳极脉冲期间运输的电荷QA的电荷比QA / QC = TAIA / TCIC到在持续时间TC的阴极脉冲期间输送的电荷QC在30和45之间。用于执行该方法的浴 可以具有异型阳极，电流限制器，用于电解质的清洁装置，以及循环装置，其通过喷嘴再循环电解质。

公开(公告)号：US20020056644A1

公开(公告)日：2002-05-16

申请号：US09940823

申请日：2001-08-27

发明人： Yasuo Sakura ,  Itoyo Tsuchiya ,  Keiko Mano

IPC分类号： C25D005/18

CPC分类号： C25D5/18 ,  C25D3/04 ,  C25D5/08

摘要： To provide a method of metal plating to give a metal plating coating with excellent luster and high corrosion resistance and wear resistance. This metal plating method includes pulse plating by pulsed electrolysis by periodically applying electric current. The pulsed electrolysis is carried out in condition that the pulse frequency and the current density are controlled so that the ratio of the quantity of deposited lattice per pulse to the height of the lattice is 0.28 or lower, that the duty ratio of the pulse frequency is controlled to be 0.5 or lower, and that the duration of complete pause caused by distortion of pulse waveform is controlled to be one half or longer of the duration of current interruption. The foregoing plating is carried out while fluidizing plating solution to be brought into contact with the object body 5 at a flow rate of 0.04 (m/s) or higher and making the solution evenly flow along the face to be plated.

摘要翻译： 提供一种金属电镀方法，以提供优异的光泽和高耐蚀性和耐磨性的金属镀覆涂层。 该金属电镀方法包括通过周期性地施加电流的脉冲电解进行脉冲电镀。 在脉冲频率和电流密度被控制的情况下进行脉冲电解，使得每个脉冲的沉积格子的数量与晶格的高度的比值为0.28或更低，脉冲频率的占空比为 控制为0.5以下，将由脉搏波形失真引起的完全暂停的持续时间控制在电流中断持续时间的一半以上。 在以0.04（m / s）以上的流量与物体5接触的流化镀液的同时进行上述电镀，使溶液均匀地沿着被镀面流动。

公开(公告)号：US20020011415A1

公开(公告)日：2002-01-31

申请号：US09853962

申请日：2001-05-10

申请人： Applied Materials, Inc.

发明人： Peter Hey ,  Byung-Sung Leo Kwak

IPC分类号： C25D005/18 ,  C25D005/10 ,  C25D005/48 ,  C25D005/50

CPC分类号： H01L21/76843 ,  C25D5/10 ,  C25D5/18 ,  C25D7/123 ,  H01L21/76868 ,  H01L21/76873 ,  H01L2221/1089 ,  H05K3/423

摘要： A method and apparatus for electrochemically depositing a metal into a high aspect ratio structure on a substrate are provided. In one aspect, a method is provided for processing a substrate including positioning a substrate having a first conductive material disposed thereon in a processing chamber containing an electrochemical bath, depositing a second conductive material on the first conductive material as the conductive material is contacted with the electrochemical bath by applying a plating bias to the substrate while immersing the substrate into the electrochemical bath, and depositing a third conductive material in situ on the second conductive material by an electrochemical deposition technique to fill the feature. The bias may include a charge density between about 20 mA*sec/cm2 and about 160 mA*sec/cm2. The electrochemical deposition technique may include a pulse modulation technique.

摘要翻译： 提供了一种在基板上将金属电化学沉积成高纵横比结构的方法和装置。 在一个方面，提供了一种用于处理衬底的方法，包括在包含电化学浴的处理室中定位其上具有第一导电材料的衬底，当第一导电材料与第一导电材料接触时，将第二导电材料沉积在第一导电材料上 通过在将基板浸入电化学浴中的同时将衬底施加电镀偏压并通过电化学沉积技术在第二导电材料上原位沉积第三导电材料来填充该特征，从而进行电化学浴。 该偏压可以包括约20mA * sec / cm 2和约160mA * sec / cm 2之间的电荷密度。 电化学沉积技术可以包括脉冲调制技术。

公开(公告)号：US20010045360A1

公开(公告)日：2001-11-29

申请号：US09864650

申请日：2001-05-23

发明人： Ryushin Omasa

IPC分类号： C25D005/18

CPC分类号： C25D5/08 ,  B01F11/0082 ,  C25D5/18 ,  C25D7/12 ,  C25D21/10

摘要： In an electroplating method, a plating target article (X) disposed so as to be in contact with plating bath (14) is set as a cathode while a metal member disposed so as to be in contact with the plating bath (14) is set as an anode, and a voltage is applied between the cathode and the anode while vibrational flow is induced by vibrating vibrational vanes (16f) which are fixed in multi-stage style to a vibrating rod (16e) vibrating in the plating bath (14) interlockingly with vibration generating means (16d). Plating current flowing from the anode through the plating bath (14) to the cathode is pulsed and alternately set to one of a first state where the plating current keeps a first value I1 for a first time T1 and a second state where the plating current keeps a second value I2 having the same polarity as the first value I1 for a second time T2, the first value I1 being five or more times larger than the second value I2, and the first time T1 being three or more times longer than the second time T2.

摘要翻译： 在电镀方法中，将设置为与镀浴（14）接触的电镀对象物品（X）设定为阴极，同时设定配置为与镀浴（14）接触的金属构件 作为阳极，在阴极和阳极之间施加电压，同时通过振动振动叶片（16f）将振动叶片（16f）以多级风格固定到在电镀槽（14）中振动的振动杆（16e）而产生电压， 与振动产生装置（16d）互锁。 从阳极流过电镀槽（14）流向阴极的电流脉冲并交替地设定为第一状态，其中电镀电流保持第一值I1第一时间T1和电镀电流保持的第二状态 第二值I2与第二时间T2具有与第一值I1相同的极性，第一值I1比第二值I2大五倍或更多倍，第一时间T1比第二时间长三倍或更多倍 T2。

公开(公告)号：US20030183527A1

公开(公告)日：2003-10-02

申请号：US10396341

申请日：2003-03-26

发明人： Dale W. Collins

IPC分类号： C25D005/18

CPC分类号： H01L21/2885 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D17/001 ,  H01L21/76877 ,  Y10S205/92 ,  Y10T428/12528 ,  Y10T428/12819 ,  Y10T428/12882 ,  Y10T428/31678

摘要： A method of electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse and continuously decreasing the amplitude of both the cathodic and anodic portions of the waveform across the surface of the low conductivity layer as the deposition zone moves from the center of the surface of the low conductivity layer to the outside edge. By virtue of the ability to vary the amplitude and duration of the pulse, the method facilitates the filling of structures in the center of the low conductivity layer without overdepositing on the outside edge, thus ensuring a controlled deposition of material across the surface of the low conductivity layer.

摘要翻译： 将金属电镀到低电导率层上的方法将电势或电流反转波形与所施加的电势或电流脉冲的幅度和持续时间的变化相结合。 该方法包括随着时间的推移，随着沉积区从低表面的中心移动，改变脉冲的持续时间并且连续地降低波导的阴极和阳极部分在低电导率层的表面上的幅度 导电层到外边缘。 由于能够改变脉冲的幅度和持续时间，该方法有助于在低电导率层的中心处填充结构，而不会过度沉积在外边缘上，从而确保材料受控地沉积在低电平的表面上 导电层。