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公开(公告)号：US20010027922A1
公开(公告)日：2001-10-11
申请号：US09842454
申请日：2001-04-26
发明人： Szuchain Chen , Julius Fister , Andrew Vacco , Nina Yukov , A. James Brock
IPC分类号： C25D005/00 , C25D001/00 , C25D005/10 , C25D005/12 , C25D011/02 , C23C028/00
CPC分类号： H05K3/025 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12583 , Y10T428/1259 , Y10T428/12611 , Y10T428/12667 , Y10T428/12875 , Y10T428/12882 , Y10T428/1291 , Y10T428/12917 , Y10T428/12931 , Y10T428/12944 , Y10T428/265
摘要： A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.
摘要翻译： 复合材料包括结构载体层和由剥离层分离的相对薄的金属箔层。 可以是诸如镍或铬的金属和非金属如氧化铬，氧化镍，磷酸铬或磷酸镍的混合物的释放层提供了金属箔层与载体带的剥离强度， 通常为0.1磅/英寸至2磅/英寸。 这提供了足够的粘合力以防止金属箔层从载体层过早分离，但是当需要时容易除去载体层。 通常，金属箔层随后结合到电介质上，然后移除载体层。 然后将金属箔层成像为印刷电路板和柔性电路的制造中的电路特征。
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公开(公告)号：US20040129571A1
公开(公告)日：2004-07-08
申请号：US10734242
申请日：2003-12-15
发明人： Yoichi Onosato
IPC分类号： C25D005/12
CPC分类号： G02B6/241 , C25D5/12 , C25D5/34 , G02B6/3833 , G02B6/424 , G02B6/4251
摘要： The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, a subbing layer consisting of an electroless Ni plating layer and an electrolytic Au plating layer; subjecting the bare fiber on which the subbing layer has been formed, to end face treatment by means of an optical-fiber cleaver to expose an end face portion of the bare fiber; and subjecting the bare fiber on which the end face treatment has been carried out, to electrolytic plating to form a metallic coating as a surface layer, consisting of an electrolytic Ni plating layer and an electrolytic Au plating layer.
摘要翻译： 根据本发明的光纤制造方法的特征在于包括以下步骤：在裸露的光纤的外周表面上形成一个底层，该裸层由已除去树脂盖而没有被提供金属涂层所形成， 的无电Ni镀层和电解Au镀层; 对其上形成有底层的裸光纤进行光纤切割器的端面处理，露出裸光纤的端面部分; 对进行了端面处理的裸露纤维进行电解电镀，以形成由电解Ni镀层和电解Au镀层组成的表面层的金属涂层。
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公开(公告)号：US20020100694A1
公开(公告)日：2002-08-01
申请号：US09927090
申请日：2001-08-09
IPC分类号： B32B015/10 , C25D005/12 , C25D003/58 , C25D005/00 , C25D003/56
CPC分类号： C25D5/44 , Y10S428/935 , Y10T428/12243 , Y10T428/12736 , Y10T428/1275 , Y10T428/12792
摘要： The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the substrate. The aluminum part or strip, such as an aluminum coin blank or strip for coin blanks, is pretreated with an improved zincate solution which provides hydroxide ions in an amount in the range of 75-175 gpl, zinc ions in an amount in the range of 15-40 gpl, nickel ions in an amount in the range of 2-10 gpl and copper ions in an amount in the range of 1.5-5 gpl. The pretreatment process preferably includes a copper strike applied from a copper cyanide strike bath at a pH in the range of 8.5-11.0, using a current density in the range of 0.1-10 A/dm2. The pretreatment and electroplating steps arc preferably conducted by barrel plating, in accordance with another aspect of the invention. The invention also provides electroplated aluminum parts or strip, such as electroplated coin blanks, including a substrate formed from aluminum or an aluminum alloy and having multiple surfaces, a layer of zincate on at least one of the surfaces of the substrate and preferably completely encasing the substrate, a strike layer of a strike metal covering the layer of zincate, and one or more electroplated layers of one or more metals covering the strike layer, said one or more electroplated layers adhering to the substrate to withstand a deformation process without delamination from the substrate.
摘要翻译： 本发明提供了一种用于电镀铝部件或带材的预处理方法，其中锌化溶液被改性以改善随后的电镀板对基材的粘合性。 铝部件或条，例如用于硬币坯料的铝硬币坯料或条带，用改进的锌酸盐溶液预处理，所述改善的锌酸盐溶液的量为75-175gp1，锌离子的量为在 15-40gp1，镍离子的量为2-10gp1，铜离子的量为1.5-5gpl。 预处理方法优选包括使用0.1-10A / dm 2范围内的电流密度的铜氰化铜冲洗浴，其pH在8.5-11.0的范围内进行铜冲击。 根据本发明的另一方面，预处理和电镀步骤优选地通过滚镀进行。 本发明还提供电镀铝部件或带材，例如电镀硬币坯料，其包括由铝或铝合金形成并具有多个表面的基底，在基底的至少一个表面上的锌酸盐层，并且优选完全包围 衬底，覆盖锌酸盐层的冲击金属的冲击层和覆盖触击层的一个或多个金属的一个或多个电镀层，所述一个或多个电镀层粘附到基底以承受变形过程，而不会从 基质。
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公开(公告)号：US20040069643A1
公开(公告)日：2004-04-15
申请号：US10256786
申请日：2002-09-27
发明人： Vern Coley , Patrick Ramnarine
IPC分类号： C25D005/12
摘要： A process for chrome plating a non-ferrous object includes copper plating the non-ferrous object which has had burrs and surface irregularities removed. The surface of the copper plated object is smoothed, and copper plate irregularities removed, by moving dry abrasive media over the object for a pre-determined period of time. Typically, this is done by placing the copper plated object into a finishing machine having dry abrasive media therein. The object is then chrome plated.
摘要翻译： 用于对有色金属物体进行镀铬的方法包括具有去除毛刺和表面不规则的有色金属物体的镀铜。 通过将干磨料介质移动到物体上预定的时间段，镀铜物体的表面被平滑，并且铜板不规则物被去除。 通常，这通过将镀铜对象放置在其中具有干磨料介质的精整机中来完成。 然后对象镀铬。
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公开(公告)号：US20040040859A1
公开(公告)日：2004-03-04
申请号：US10433834
申请日：2003-06-09
IPC分类号： B32B015/04 , C25D005/12
CPC分类号： C25D5/12 , C25D3/06 , C25D5/48 , Y10S428/935 , Y10T428/12569 , Y10T428/12847 , Y10T428/12896
摘要： A method of forming a surface finish of trivalent chromium on metal or plastics substrates by electrodeposition from an aqueous plating solution of trivalent chromium ions in which the trivalent chromium is deposited on a layer of silver or silver alloy whereby the color and/or corrosion resistance of the trivalent chromium is comparable to surface finishes of hexavalent chromium. The invention avoids the health and safety risks associated with the electrodeposition of hexavalent chromium surface finishes.
摘要翻译： 通过从其中三价铬沉积在银或银合金层上的三价铬离子的电镀溶液电沉积，在金属或塑料基材上形成三价铬的表面光洁度的方法，由此使颜色和/或耐腐蚀性 三价铬与六价铬的表面光洁度相当。 本发明避免了与六价铬表面处理电沉积相关的健康和安全隐患。
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公开(公告)号：US20020070118A1
公开(公告)日：2002-06-13
申请号：US09733735
申请日：2000-12-08
发明人： Chris M. Schreiber , Mordechay Schlesinger , Robert Martinez , Haim Feigenbaum , William Robert Crumly
IPC分类号： C25D005/00 , C25D005/12 , C25D005/10 , C25D005/48
摘要： A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.
摘要翻译： 提供了一种用于形成纳米层状结构的方法，其包括使用电解电镀工艺对具有基本上第一金属和基本上第二金属的层进行电镀，并控制电镀电流以在阴极处获得期望的电流密度，其保持在 一个预定义的范围。
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7.发明申请Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil 失效表面处理铜箔，表面处理铜箔的制造方法以及使用表面处理铜箔的覆铜层压板公开(公告)号：US20010014406A1
公开(公告)日：2001-08-16
申请号：US09769244
申请日：2001-01-26
IPC分类号： C25D005/12 , C25D005/34 , C25D005/50 , C25D007/00 , B21C037/00
CPC分类号： C23C28/00 , C23C2222/20 , C25D1/04 , C25D3/565 , C25D5/16 , C25D5/48 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1105 , Y10T428/12431
摘要： An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in copper foil coated with an anti-corrosive layer formed of a zinc-copper-nickel ternary alloy. Another object is to impart excellent moisture resistance to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105null C.-200null C.
摘要翻译： 本发明的目的是提供一种表面处理铜箔，其能够一致地获得耐盐酸降解的百分比损失为10％以下，由铜箔制成的铜线图案测定，线宽为0.2 通过提出涂覆有由锌 - 铜 - 镍三元合金形成的防腐蚀层的铜箔中使用的硅烷偶联剂的最大效果。 另一个目的是赋予表面处理铜箔优异的耐湿性。 为了达到上述目的，本发明提供了一种表面经处理和防腐蚀处理的印刷线路板的表面处理铜箔，其中防腐处理包括形成锌 - 铜 - 镍三元 铜箔表面的合金防腐蚀镀层; 在所述防腐镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成硅烷偶联剂吸附层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。
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公开(公告)号：US20040188267A1
公开(公告)日：2004-09-30
申请号：US10788464
申请日：2004-05-24
申请人： TDK CORPORATION
IPC分类号： C25D005/12
CPC分类号： C25D7/001 , C25D3/12 , C25D5/14 , H01F41/026
摘要： Provided are a method of manufacturing a rare-earth magnet with superior corrosion resistance, and a plating bath used for the method. A first protective film including nickel and a second protective film including nickel and sulfur are laminated in order on a magnet body including a rare-earth element. The first protective film is formed through electroplating with a first plating bath including a nickel source, a conductive salt and a pH stabilizer, and having a concentration of the nickel source of 0.3 mol/l to 0.7 mol/l on a nickel atom basis and a conductivity of 80 mS/cm or over. Thereby, a rare-earth-rich phase can be prevented from being leached out, and the production of pinholes can be reduced. Therefore, the corrosion resistance of the rare-earth magnet can be improved.
摘要翻译： 提供了具有优异的耐腐蚀性的稀土类磁体的制造方法以及该方法所用的电镀液。 包括镍的第一保护膜和包括镍和硫的第二保护膜依次层叠在包括稀土元素的磁体上。 第一保护膜通过电镀形成，其中包括镍源，导电盐和pH稳定剂的第一电镀浴，镍原子的浓度为镍原子为0.3mol / l至0.7mol / l， 电导率为80mS / cm以上。 由此，可以防止稀土相析出，能够减少针孔的产生。 因此，能够提高稀土类磁铁的耐腐蚀性。
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公开(公告)号：US20040031691A1
公开(公告)日：2004-02-19
申请号：US10222534
申请日：2002-08-15
IPC分类号： C25D005/10 , C25D005/12
CPC分类号： C23C28/023 , C25D5/14 , C25D5/18 , Y10S428/935 , Y10T428/12229 , Y10T428/12361 , Y10T428/12632 , Y10T428/12944
摘要： A process for electrodepositing a low stress nickel-manganese multilayer alloy on an electrically conductive substrate is provided. The process includes the steps of immersing the substrate in an electrodeposition solution containing a nickel salt and a manganese salt and repeatedly passing an electric current through an immersed surface of the substrate. The electric current is alternately pulsed for predetermined durations between a first electrical current that is effective to electrodeposit nickel and a second electrical current that is effective to electrodeposit nickel and manganese. A multilayered alloy having adjacent layers of nickel and a nickel-manganese alloy on the immersed surface of the substrate is thereby produced. The resulting multilayered alloy exhibits low internal stress, high strength and ductility, and high strength retention upon exposure to heat.
摘要翻译： 提供了一种在导电性基板上电沉积低应力镍锰多层合金的方法。 该方法包括以下步骤：将基底浸入含有镍盐和锰盐的电沉积溶液中并重复地使电流通过基底的浸入表面。 在有效电沉积镍的第一电流和有效电沉积镍和锰的第二电流之间，电流交替地脉冲预定的持续时间。 由此制造了在基板的浸渍表面上具有相邻的镍层和镍 - 锰合金的多层合金。 所得到的多层合金表现出低的内应力，高强度和延展性，以及暴露在高温下的高强度保持性。
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公开(公告)号：US20020053517A1
公开(公告)日：2002-05-09
申请号：US09953911
申请日：2001-09-18
发明人： Yasuhiro Endo , Hiroki Hara , Nobuchika Yagihashi
IPC分类号： C25D005/10 , C25D005/12 , C25D005/00
CPC分类号： H05K3/384 , C25D5/10 , C25D5/16 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723
摘要： A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out electrolysis in a plating bath (A) containing ions of these metals and chloronium ions, and then forming a roughened layer comprising copper on the composite metal layer by carrying out electrolysis in a plating bath (B) containing copper ions at a current density not lower than a limiting current density of the plating bath to form a dendritic copper electrodeposition layer and then carrying out subsequent electrolysis at a current density lower than the limiting current density of plating bath to form nodular copper.
摘要翻译： 通过在铜箔的接合面上形成包含（I）铜，（II）钨和钼中的至少一种的复合金属层和（III）至少一种镍，钴， 通过在含有这些金属和锍离子的离子的电镀浴（A）中进行电解，然后通过在含有铜离子的电镀浴（B）中进行电解，在复合金属层上形成包含铜的粗糙层 以不低于电镀液的极限电流密度的电流密度形成树枝状铜电沉积层，然后以比电镀液的极限电流密度低的电流密度进行随后的电解以形成结节铜。
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