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    LASER PROCESSING MACHINE AND PROCESSING STATE DETERMINATION METHOD
    2.
    发明申请
    LASER PROCESSING MACHINE AND PROCESSING STATE DETERMINATION METHOD 有权

    公开(公告)号：US20220331900A1

    公开(公告)日：2022-10-20

    申请号：US17760735

    申请日：2020-09-08

    申请人： AMADA CO., LTD.

    发明人： Fujinari ITOSHIRO ,  Hironobu MIYOSHI ,  Jun IWASAKI

    IPC分类号： B23K26/03 ,  B23K26/38 ,  B23K31/10

    摘要： A reflected beam detector detects a reflected beam reflected from a sheet metal when the sheet metal is irradiated with a laser beam so that the sheet metal is cut. A processing state determination unit is provided with a standard deviation value calculation unit and a quality determination unit. The standard deviation value calculation unit calculates, in a predetermined calculation cycle, a standard deviation value of a reflected beam detection value at a monitoring wavelength from among reflected beam detection values in a predetermined wavelength band output from the reflected beam detector. The quality determination unit determines whether or not a burning defect has occurred in which a cut surface of the sheet metal is excessively melted based on a comparison result of comparing, with a first threshold value, the standard deviation value calculated by the standard deviation value calculation unit.

    METHOD FOR ELIMINATING WELD GAPS AND POSITIONAL VARIATION IN WELD ASSEMBLIES
    3.
    发明申请
    METHOD FOR ELIMINATING WELD GAPS AND POSITIONAL VARIATION IN WELD ASSEMBLIES 有权

    公开(公告)号：US20220297240A1

    公开(公告)日：2022-09-22

    申请号：US17603698

    申请日：2020-04-13

    申请人： John Richard POTOCKI ,  MAGNA INTERNATIONAL INC.

    发明人： John Richard POTOCKI

    IPC分类号： B23K31/02 ,  B23K31/10 ,  B23K31/12 ,  B25J11/00

    摘要： A component having a first part and a second part. The first part has a first interface surface and the second part has a second interface surface that is connected to the first interface surface via a bond. A digital profile of the first interface surface is used to shape the second interface surface to fit against the first interface surface with minimal to no gap therebetween before forming the bond. The digital profile is developed by scanning the first part with a scanner and the second part is shape by cutting or milling with a robotic arm that acts in accordance with a digital profile data read by a controller. The two parts are bonded via a weld that is automatically guided by the digital profile.

    METHOD FOR PROCESSING A STRIP
    4.
    发明申请
    METHOD FOR PROCESSING A STRIP 有权

    公开(公告)号：US20220080533A1

    公开(公告)日：2022-03-17

    申请号：US17295064

    申请日：2019-11-20

    申请人： Berndorf Innovations und Technologie GmbH

    发明人： Markus HAYDN ,  Ataollah JAVIDI ,  Stephanie LEGRAS

    IPC分类号： B23K33/00 ,  B23K31/10 ,  B05D1/02

    摘要： A method processes a belt with a belt body that has a first surface and a second surface connected to each other by side surfaces. Each side surface is smaller than each surface. At least one of the surfaces of the belt is coated with a coating having at least one layer. In a step i) the coating is interrupted or left out in a region of the belt to be processed, and a recess, in particular a gap-shaped or hole-shaped recess, interrupting the coating is produced in the region to be processed, which recess is at least partially delimited by opposite sections of the at least one coating. In a step ii) directly thereafter or after further intermediate steps, the recess is at least partially filled up with at least one material of the same type as that of the at least one layer of the coating.

    METHODS AND APPARATUSES FOR CONTROLLING CUTTING PROCESSES
    7.
    发明申请
    METHODS AND APPARATUSES FOR CONTROLLING CUTTING PROCESSES 审中-公开

    公开(公告)号：US20190084092A1

    公开(公告)日：2019-03-21

    申请号：US16189100

    申请日：2018-11-13

    申请人： TRUMPF Werkzeugmaschinen GmbH + Co. KG

    发明人： Oliver Bocksrocker ,  Stefanie Epple ,  Tim Hesse

    IPC分类号： B23K31/10 ,  B23K15/08 ,  B23K26/03 ,  B23K26/38

    摘要： The disclosure relates to methods and apparatuses for controlling a cutting process in which a workpiece is cut by a high-energy beam. A process light signal is detected emanating from an interaction region of the high-energy beam with the workpiece in a first wavelength range (Δλ1), in which at least one metallic constituent (Fe, Cr) of the workpiece has at least one emission line, and in a second wavelength range (Δλ2), which differs from the first wavelength range, in which continuum radiation of the workpiece without emission lines is detectable. Vaporization of the at least one metallic constituent (Fe, Cr) is monitored on the basis of an intensity of the process light signal detected in the first wavelength range (Δλ1) and on the basis of an intensity of the process light signal detected in the second wavelength range (Δλ2).

    Floating chuck assembly for a rotary cutting machine
    8.
    发明授权
    Floating chuck assembly for a rotary cutting machine 有权
    用于旋转切割机的浮动卡盘组件

    公开(公告)号：US09168622B2

    公开(公告)日：2015-10-27

    申请号：US13937526

    申请日：2013-07-09

    申请人： Anton Buholzer

    发明人： Anton Buholzer

    IPC分类号： B23Q1/52 ,  B23Q5/20 ,  B23K31/10 ,  B23Q7/04 ,  B23Q1/76

    CPC分类号： B23Q5/20 ,  B23B2231/00 ,  B23K31/10 ,  B23Q1/527 ,  B23Q1/76 ,  Y10T279/34

    摘要： A floating chuck assembly used in connection with a workpiece support carrying a workpiece, the floating chuck assembly comprising a chuck assembly; a linkage assembly adapted to support the chuck assembly, the linkage assembly including a mounting link attachable to the chuck assembly, a first link having a first end pivotally attached to a support about a first support axis and having a second end pivotally attached to the mounting link about a first mounting axis, a second link having a first end pivotally attached to the support about a second support axis and a second end pivotally attached to the mounting link about a second mounting axis; and, an extendable support having a first portion attached to the support and a second portion attached to one of the mounting link, first link, and second link, wherein the first portion moves relative to the second portion.

    摘要翻译： 一种浮动卡盘组件，其与承载工件的工件支架结合使用，该浮动卡盘组件包括卡盘组件; 连接组件，其适于支撑所述卡盘组件，所述连杆组件包括可附接到所述卡盘组件的安装连杆，第一连杆，所述第一连杆具有第一端部，所述第一端部以第一支撑轴线可枢转地附接到支撑件，并且具有枢转地附接到所述安装件 连接关于第一安装轴线，第二连杆具有第一端部，其第一端部围绕第二支撑轴线枢转地附接到支撑件;以及第二端部，其围绕第二安装轴线可枢转地附接到安装连杆; 以及具有附接到所述支撑件的第一部分和附接到所述安装连杆，第一连杆和第二连杆中的一个的第二部分的可延伸支撑件，其中所述第一部分相对于所述第二部分移动。

    METHOD FOR MANUFACTURING ELECTRIC CONNECTIONS IN WAFER
    9.
    发明申请
    METHOD FOR MANUFACTURING ELECTRIC CONNECTIONS IN WAFER 有权
    在WAFER中制造电气连接的方法

    公开(公告)号：US20080230587A1

    公开(公告)日：2008-09-25

    申请号：US12046097

    申请日：2008-03-11

    申请人： Hsueh An Yang

    发明人： Hsueh An Yang

    IPC分类号： B23K31/10

    CPC分类号： B23K1/0016 ,  B23K2101/36 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing electrical connections in wafer is provided. A plurality of openings is formed on the upper surface of a wafer by dry etching or laser drilling and then solder paste is applied to the openings. Next, the wafer is positioned in a vacuum environment and is heated to soften the solder paste. Subsequently, the vacuum is suddenly broken to have the pressure upon the upper surface of the wafer greater than that in the openings thereby pressing the molten solder paste into the openings.

    摘要翻译： 提供了一种用于制造晶片中的电连接的方法。 通过干蚀刻或激光钻孔在晶片的上表面上形成多个开口，然后将焊膏施加到开口。 接下来，将晶片定位在真空环境中并被加热以软化焊膏。 随后，真空突然破裂，使得晶片上表面的压力大于开口中的压力，从而将熔融的焊膏压入开口。