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公开(公告)号：US20240318842A1
公开(公告)日：2024-09-26
申请号：US18732376
申请日：2024-06-03
申请人： WTS LLC
IPC分类号： F24F5/00 , F24D3/00 , F24D11/00 , F24D17/00 , F24S20/40 , F24S23/70 , F24S23/74 , F24S30/452 , F24S90/00 , F25B27/00 , F28D20/00
CPC分类号： F24F5/0046 , F24D3/005 , F24D11/003 , F24D17/0021 , F24D17/0063 , F24S20/40 , F24S23/70 , F24S23/74 , F24S30/452 , F24S90/00 , F25B27/002 , F25B27/007 , F28D20/0034 , F24D2200/02 , F24D2200/126 , F24D2200/14 , F24F2005/0064 , F24F2005/0067 , F28D2020/0078 , Y02A30/27 , Y02A30/272 , Y02B10/20 , Y02B10/70 , Y02B30/62 , Y02E10/40 , Y02E10/47 , Y02E60/14 , Y02E70/30
摘要： A fluid-based system for use in heating and/or cooling. In particular, the system may have a fluid heating device, which may be a solar fluid heating device, configured to heat a fluid. Heat from the heated fluid may be transferred to one or more cooling subsystems or heating subsystems. A cooling subsystem may be an absorption cooling subsystem, for example, wherein heat may cause phase change of a refrigerant. A heating subsystem may include a storage tank through which heated fluid may be circulated to heat the storage tank. A system of the present disclosure may include multiple cooling and/or heating subsystems for cooling and or heating a variety of different environments, objects, or materials.
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2.发明授权公开(公告)号：US11994319B2
公开(公告)日：2024-05-28
申请号：US17827923
申请日：2022-05-30
申请人： FFI IONIX IP, INC.
发明人： Bamdad Bahar , William P. Parmelee
CPC分类号： F25B17/12 , F17C11/005 , F25B25/02 , F25B35/04 , F25B2500/18 , Y02A30/27 , Y02B30/52 , Y02E60/32
摘要： An electrochemical heat transfer device utilizes an electrochemical hydrogen compressor to pump hydrogen into and out of a reservoir having a metal hydride forming alloy therein. The absorption of hydrogen by the metal hydride forming alloy is exothermic, produces heat, and the desorption of the hydrogen from the metal hydride forming alloy is endothermic and draws heat in. An electrochemical hydrogen compressor may be configured between to reservoirs and pump hydrogen back and forth to form a heat transfer device. A heat exchange device may be coupled with the reservoir or may comprise the outer surface of the reservoir to transfer heat to an object or to the surroundings. A closed loop may be configured having two reservoirs and one or two electrochemical hydrogen compressors to pump the hydrogen in a loop around the system.
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公开(公告)号：US11859877B2
公开(公告)日：2024-01-02
申请号：US15110809
申请日：2015-01-09
申请人： Deepak Pahwa , Bidyut Baran Saha , Anil Kumar Choudhary , Rajan Sachdev , Kuldeep Singh Malik , Kyaw Thu
发明人： Deepak Pahwa , Bidyut Baran Saha , Anil Kumar Choudhary , Rajan Sachdev , Kuldeep Singh Malik , Kyaw Thu
摘要： The present invention provides a hybrid adsorption heat exchanging device comprising: at least one tubular or micro channel structure for carrying a heat transfer fluid; the external surface of said structure being provided with extensions in at least two locations; said extensions forming a bed therebetween for providing one or more adsorbent materials; a coating of adsorbent material being provided on at least a part of said extensions.
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公开(公告)号：US11828496B2
公开(公告)日：2023-11-28
申请号：US18064834
申请日：2022-12-12
申请人： Rocky Research
发明人： Uwe Rockenfeller , Kaveh Khalili
摘要： Disclosed are systems and methods of intelligently cooling thermal loads by providing a burst mode cooling system for rapid cooling, and an auxiliary cooling system that controls the temperature of the thermal load and surrounding environment between burst mode cooling cycles. The system may be used to provide pulses of cooling to directed energy systems, such as lasers and other systems that generate bursts of heat in operation.
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