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公开(公告)号：US20160254441A1
公开(公告)日：2016-09-01
申请号：US15050827
申请日：2016-02-23
Applicant: SII Semiconductor Corporation
Inventor： Takaaki HIOKA , Mika EBIHARA
CPC classification number: H01L43/14 , G01D5/145 , G01R15/202 , G01R15/207 , G01R21/08 , G01R33/0005 , G01R33/0052 , G01R33/0206 , G01R33/07 , G01R33/072 , G01R33/077 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/32 , H01L43/04 , H01L43/065 , H02K11/215 , H03K17/9517 , H03K19/18 , H04Q2213/307
Abstract: Provided are a magnetic sensor and a method of manufacturing the same. In the magnetic sensor and the method of manufacturing the same, a magnetic converging plate holder with a recessed pattern having the same shape and size as those of a magnetic converging plate is formed in a die pad of a package on which a semiconductor substrate having Hall elements, a circuit, and the like is to be arranged, the magnetic converging plate manufactured through processes different from those of the semiconductor substrate on which the Hall elements and the circuit are formed is inserted into the magnetic converging plate holder, and the semiconductor substrate having the Hall elements, the circuit, and the like is arranged on the resultant so that a back surface thereof faces the die pad and the magnetic converging plate.
Abstract translation: 提供一种磁传感器及其制造方法。 在磁传感器及其制造方法中，在具有霍尔的半导体衬底的封装的芯片焊盘中形成具有与磁汇合板的形状和尺寸相同的凹形图案的磁会聚板保持器 元件，电路等，通过与形成有霍尔元件和电路的半导体衬底不同的工艺制造的磁会聚板被插入到磁会聚板固定器中，半导体衬底 具有霍尔元件，电路等布置在其上，使得其后表面面对芯片焊盘和磁会聚板。
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公开(公告)号：US20170294577A1
公开(公告)日：2017-10-12
申请号：US15630034
申请日：2017-06-22
Applicant: SII Semiconductor Corporation
Inventor： Takaaki HIOKA , Mika EBIHARA
CPC classification number: H01L43/14 , G01D5/145 , G01R15/202 , G01R15/207 , G01R21/08 , G01R33/0005 , G01R33/0052 , G01R33/0206 , G01R33/07 , G01R33/072 , G01R33/077 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/32 , H01L43/04 , H01L43/065 , H02K11/215 , H03K17/9517 , H03K19/18 , H04Q2213/307
Abstract: Provided are a magnetic sensor and a method of manufacturing the same. In the magnetic sensor and the method of manufacturing the same, a magnetic converging plate holder with a recessed pattern having the same shape and size as those of a magnetic converging plate is formed in a die pad of a package on which a semiconductor substrate having Hall elements, a circuit, and the like is to be arranged, the magnetic converging plate manufactured through processes different from those of the semiconductor substrate on which the Hall elements and the circuit are formed is inserted into the magnetic converging plate holder, and the semiconductor substrate having the Hall elements, the circuit, and the like is arranged on the resultant so that a back surface thereof faces the die pad and the magnetic converging plate.
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公开(公告)号：US09741924B2
公开(公告)日：2017-08-22
申请号：US15050827
申请日：2016-02-23
Applicant: SII Semiconductor Corporation
Inventor： Takaaki Hioka , Mika Ebihara
CPC classification number: H01L43/14 , G01D5/145 , G01R15/202 , G01R15/207 , G01R21/08 , G01R33/0005 , G01R33/0052 , G01R33/0206 , G01R33/07 , G01R33/072 , G01R33/077 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/32 , H01L43/04 , H01L43/065 , H02K11/215 , H03K17/9517 , H03K19/18 , H04Q2213/307
Abstract: A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the semiconductor substrate and overlaps the Hall elements. The die pad has formed therein a magnetic converging plate holder having a recessed portion, and a magnetic converging plate having the same shape and size as the recessed portion is fitted in the recessed portion of the magnetic converging plate holder.
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