公开(公告)号：US20170182621A1

公开(公告)日：2017-06-29

申请号：US15456035

申请日：2017-03-10

申请人： FUJIFILM Corporation

发明人： Yasuhito HIRAKI ,  Kenji ITO ,  Seiichi WATANABE

IPC分类号： B24B13/01 ,  B24B41/06

CPC分类号： B24B13/01 ,  B24B13/005 ,  B24B41/06 ,  B24B49/04 ,  B24B49/06

摘要： A lens manufacturing method including a holding step of holding a lens in a lens holding fixture, and a machining step of machining a surface to be machined in the held lens. A reverse surface of the surface to be machined is machined into a non-planar shape with a first surface shape error. A lens holding surface of the lens holding fixture is machined into the same shape as the non-planar shape with a second surface shape error smaller than the first surface shape error. In the holding step, the reverse surface is brought into surface contact with the holding surface in imitation of the holding surface to correct the shape of the lens such that the reverse surface runs along the holding surface. In the machining step, the surface to be machined is machined in a state where the correction has been made by the holding step.

公开(公告)号：US06354914B1

公开(公告)日：2002-03-12

申请号：US09432268

申请日：1999-11-02

申请人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

发明人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B37/005 ,  B24B49/04 ,  B24B49/06

摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

摘要翻译： 传感器在抛光期间检测到晶片的库存移除，并且CPU根据来自传感器的信息计算库存移除。 CPU比较传感器检测到的实际库存清除量和存储在RAM中的库存清单，并根据实际库存清除与库存清除之间的差异确定修整和更换抛光垫的时间。 确定结果显示在显示屏上。

公开(公告)号：US3157971A

公开(公告)日：1964-11-24

申请号：US25686563

申请日：1963-02-07

申请人： LANDIS TOOL CO

发明人： SNYDER GLENN M

IPC分类号： B24B49/04 ,  B24B49/06 ,  F15B21/08

CPC分类号： F15B21/08 ,  B24B49/04 ,  B24B49/045 ,  B24B49/06

公开(公告)号：US20080031510A1

公开(公告)日：2008-02-07

申请号：US11702574

申请日：2007-02-06

申请人： Young-Seok Jung

发明人： Young-Seok Jung

IPC分类号： G06K9/00 ,  B24B49/12 ,  B24B51/00

CPC分类号： B24B37/042 ,  B24B49/06 ,  B24B49/12 ,  G01N21/9501 ,  G01N2021/1776 ,  G01N2021/8411 ,  H01L21/67219 ,  H01L21/67288

摘要： The surfaces of wafers polished in CMP equipment are monitored in real time to detect a normal/abnormal state of operation of the CMP equipment. A camera is disposed alongside a path along which a wafer is transferred to a cassette stage from a cleaning unit. The camera is oriented to capture an image of the surface of the wafer which has been polished and cleaned. An image processor processes the color image of the surface of the wafer captured by the camera into data of the contrast between and color of areas of the image. A controller receives the data output by the image processor. The controller is connected to a database in which data of at least one color reference image is stored. The reference image(s) is/are correlated to process conditions of the CMP process. The controller (selectively) compares the processed color image with the color reference image that is stored in the database, and based on the comparison determines whether a defect exists in the polishing process.

摘要翻译： 在CMP设备中抛光的晶片的表面被实时监测以检测CMP设备的正常/异常操作状态。 照相机沿着沿着路径被布置，沿着该路径将晶片从清洁单元传送到盒台。 相机被定向以捕获已经被抛光和清洁的晶片表面的图像。 图像处理器将由相机拍摄的晶片的表面的彩色图像处理成图像的区域之间的对比度和颜色的数据。 控制器接收图像处理器输出的数据。 控制器连接到其中存储有至少一个颜色参考图像的数据的数据库。 参考图像与CMP工艺的工艺条件相关。 控制器（选择性地）将经处理的彩色图像与存储在数据库中的颜色参考图像进行比较，并且基于比较来确定在抛光过程中是否存在缺陷。

公开(公告)号：US1872522A

公开(公告)日：1932-08-16

申请号：US48593230

申请日：1930-10-02

申请人： W A RIDDELL COMPANY

发明人： STUCKEY ROBERT B

IPC分类号： B24B49/06 ,  B28D1/00

CPC分类号： B28D1/00 ,  B24B49/06 ,  E04B2002/026 ,  Y10S425/109

公开(公告)号：US1354874A

公开(公告)日：1920-10-05

申请号：US24504118

申请日：1918-07-15

申请人： FREDERIC BECK

发明人： FREDERIC BECK

IPC分类号： B24B49/06

CPC分类号： B24B49/06 ,  Y10T82/16

公开(公告)号：US09919402B2

公开(公告)日：2018-03-20

申请号：US14914747

申请日：2014-06-24

申请人： SUMCO CORPORATION

发明人： Tomonori Kawasaki

IPC分类号： B24B37/005 ,  B24B37/20 ,  B24B37/34 ,  B24B49/06 ,  H01L21/02

CPC分类号： B24B37/005 ,  B24B37/20 ,  B24B37/34 ,  B24B49/06 ,  H01L21/02024

摘要： A practical method of polishing a wafer that can reduce wafer loss due to dummy polishing, and stabilize the LPD count in production wafers at a low level, is provided. In the method of polishing a wafer according to the present disclosure, a wafer 104 is brought into contact with a polishing cloth 112 provided on the surface of a polishing plate 110, and the wafer 104 and the polishing plate 110 are rotated, thereby performing several rounds of a polishing process on the surface of the wafer 104 using the same polishing cloth 112. At this time, the contact angle of the polishing cloth is measured, and based on the measured value thereof, the timing for a switchover from an initial polishing (or a dummy polishing) mode to a production polishing mode is determined.

公开(公告)号：US20080305716A1

公开(公告)日：2008-12-11

申请号：US12133407

申请日：2008-06-05

申请人： Akiharu Tashiro ,  Takayuki Monchujo ,  Kiyohisa Suzuki ,  Jun Inomata ,  Ryuji Fukada ,  Eiji Shiotani ,  Daisuke Terada ,  Kei Fujii

发明人： Akiharu Tashiro ,  Takayuki Monchujo ,  Kiyohisa Suzuki ,  Jun Inomata ,  Ryuji Fukada ,  Eiji Shiotani ,  Daisuke Terada ,  Kei Fujii

IPC分类号： B24B49/00

CPC分类号： B24B49/16 ,  B24B33/02 ,  B24B33/06 ,  B24B33/087 ,  B24B49/06

摘要： A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge.

摘要翻译： 提供了一种适用于具有大加工区域的珩磨的珩磨方法和珩磨控制装置。 珩磨控制装置包括研磨机和用于配置在工件的加工孔中的膨胀构件。 当研磨机经由膨胀部件与规格孔的内表面接触时，膨胀运动的量通过将珩磨头插入到具有与主表的目标加工直径相同的尺寸的量规孔中作为目标膨胀量 。 然后，通过将珩磨头插入到通过安装在珩磨头内的膨胀构件沿着直径方向移动研磨机的工件的加工孔内，将珩磨头插入，来旋转珩磨 头。 当研磨机的膨胀运动量达到由母压力计确定的目标膨胀量时，珩磨完成。

公开(公告)号：US06302762B1

公开(公告)日：2001-10-16

申请号：US09432269

申请日：1999-11-02

申请人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

发明人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B37/005 ,  B24B49/04 ,  B24B49/06

摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

摘要翻译： 传感器在抛光期间检测到晶片的库存移除，并且CPU根据来自传感器的信息计算库存移除。 CPU比较传感器检测到的实际库存清除量和存储在RAM中的库存清单，并根据实际库存清除与库存清除之间的差异确定修整和更换抛光垫的时间。 确定结果显示在显示屏上。

公开(公告)号：US1893205A

公开(公告)日：1933-01-03

申请号：US49114730

申请日：1930-10-25

申请人： NEW DEPARTURE MFG CO

发明人： HUGHES FREDERICK G

IPC分类号： B24B49/06

CPC分类号： B24B49/06 ,  Y10S33/17 ,  Y10S451/916