Abstract:
An ultrasonic device according to one aspect includes a case, a piezoelectric element, a sound absorbing material, and a vibration-proof material. The case defines a housing space. The piezoelectric element is disposed in the housing space. The sound absorbing material is disposed on a main face of the piezoelectric element and is made of a foaming material. The vibration-proof material is disposed around the sound absorbing material. The sound absorbing material includes a first opposing face opposed to the main face. The first opposing face has an uneven shape in which a plurality of protruding portions and a plurality of depression portions are alternately continued, and is rougher than the main face.
Abstract:
An ultrasonic transducer, including a piezoelectric element with physical characteristics of radial resonant frequencies and thickness resonant frequencies, and with an upper surface and a lower surface opposite to each other through the piezoelectric element and a lateral surface connecting the upper surface and the lower surface, and an acoustic matching layer set on the upper surface of the piezoelectric element and having a first resonant matching part and a second resonant matching part, wherein a thickness of the first resonant matching part in a direction perpendicular to the upper surface is greater than a thickness of the second resonant matching part in the direction, and the thickness of the first resonant matching part matches one radial resonant frequency of the piezoelectric element and the thickness of the second resonant matching part matches another radial resonant frequency or one of the thickness resonant frequency of the piezoelectric element.
Abstract:
An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.
Abstract:
Disclosed herein is a probe including: an acoustic module including a piezoelectric layer configured to generate ultrasonic waves, a matching layer configured to reduce a difference in acoustic impedance between the piezoelectric layer and an object, and a backing layer configured to absorb ultrasonic waves generated by the piezoelectric layer and transmitted backward from the piezoelectric layer; a plurality of attenuation layers provided at both edges of the upper surface of the acoustic module, and configured to attenuate ultrasonic waves generated by the acoustic module; and a lens layer disposed to cover the upper surfaces of the attenuation layers, and configured to focus ultrasonic waves transmitted forward from the piezoelectric layer at a predetermined point.
Abstract:
Disclosed herein is a piezoelectric vibration module that includes a side damper between a vibration plate with a piezoelectric element and an upper case so as to ensure reliability against external shock applied to the side and narrows a spaced distance between the vibration plate and the upper case.
Abstract:
There is provided a vibrator including: a housing having an internal space and having at least one through-hole formed therein; a vibrator disposed in the housing and vibrating; and an impact damping member installed on at least one of outer surfaces of the housing and damping impact, wherein the vibrator has protrusions disposed thereon so as to correspond to the through-hole and contacting the impact damping member while penetrating the through-hole at the time of external impact.
Abstract:
An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.
Abstract:
A physical shield placed on the face of a high intensity focused ultrasound transducer for medical applications is described. The shield may be shaped or angled to match a particular pattern of mechanical or acoustic energy that may damage the transducer during operation. The shield may be ablative, replaceable or modified as needed. Methods of manufacturing a transducer with a shield are also disclosed.
Abstract:
An ultrasonic wave oscillator is configured in a manner that an acoustic matching member is formed on the ultrasonic wave emission side of an electromechanical transducer element, a backing material is fixed with adhesive on the other side thereof, and the electromechanical transducer element is fixed by connection members pressing it respectively from opposite directions.
Abstract:
The present invention provides a microfabricated acoustic transducer with suppressed substrate modes. The modes are suppressed by either thinning the substrate such that a longitudinal ringing mode occurs outside of the frequency band of interest or by applying a judiciously designed damping material on the backside of the transducer substrate.