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公开(公告)号：US20230072579A1
公开(公告)日：2023-03-09
申请号：US17759501
申请日：2021-01-28
申请人： NIPPON DENKAI, LTD.
摘要： A metal foil has a cathode surface on which no linear indentations exist when viewed microscopically, a production method for the same, and a processing method for an electrodeposition drum used for the same. A surface of the electrodeposition drum for producing the metal foil is irradiated with a laser to process this surface into a pattern of repeated curved shapes including a plurality of dot-shaped dents or the like. With this, the pattern of repeated curved shapes is formed on the surface of the electrodeposition drum. The electrodeposition drum thus processed is used as a cathode, supply of electricity is provided between the electrodeposition drum and an anode plate that are soaked in an electrolytic solution to electrodeposit metal on the surface of the drum with an electrolytic reaction, and thereafter, the metal is peeled off from the electrodeposition drum, thereby yielding the metal foil. The metal foil thus obtained has a pattern corresponding to the pattern of repeated curved shapes including a plurality of dot-shaped bumps or the like on the cathode surface thereof.
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公开(公告)号：US07816015B2
公开(公告)日：2010-10-19
申请号：US11573059
申请日：2005-07-22
申请人： Yuushi Sato
发明人： Yuushi Sato
CPC分类号： C25D7/06 , C23C28/023 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455 , C25D1/04 , C25D3/38 , C25D3/562 , C25D5/10 , C25D5/18 , H05K3/025 , Y10T428/12438 , Y10T428/12458 , Y10T428/1259 , Y10T428/12611 , Y10T428/12833 , Y10T428/12903
摘要： A composite copper foil having three layers of a supporting metal layer, an exfoliating layer and a thin copper layer, wherein one surface of the exfoliating layer comprises, as a main component, an alloy of tungsten or an alloy of molybdenum and the other surface thereof comprises, as a main component, a metal oxide containing tungsten or a metal oxide containing molybdenum. The composite copper foil is free from undesired swelling, separation or falling of the supporting metal layer during heating and working at a high temperature, and the supporting metal layer can be exfoliated from the thin copper layer with case, after the heating and the working.
摘要翻译： 具有三层支撑金属层，剥离层和薄铜层的复合铜箔，其中剥离层的一个表面作为主要成分包含钨或钼的合金与其另一表面的合金 作为主要成分，含有含有钨或含有钼的金属氧化物的金属氧化物。 复合铜箔在加热和高温加工期间不会有不希望的支撑金属层的膨胀，分离或掉落，并且在加热和加工之后，支撑金属层可以从薄的铜层剥离。
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公开(公告)号：US6117566A
公开(公告)日：2000-09-12
申请号：US341950
申请日：1999-07-21
IPC分类号： H01L23/495 , B32B15/20
CPC分类号： H01L23/49579 , H01L2924/0002 , Y10S428/926 , Y10S428/929 , Y10S428/935 , Y10T428/1291 , Y10T428/12944 , Y10T428/12993
摘要： A lead frame material, which can be provided with an etching stop layer without requiring a troublesome process such as vapor deposition and has an excellent heat-resistance, is obtained by forming a nickel-phosphorus alloy layer (B) of 1.6 to 10 .mu.m thickness containing 0.3 to 1.0 wt % of phosphorus on a copper or copper alloy layer (A) of 35 to 300 .mu.m thickness, and forming an optional copper layer (C) of 0.2 to 30 .mu.m thickness on the nickel-phosphorus alloy layer (B).
摘要翻译： PCT No.PCT / JP98 / 00210 Sec。 371日期：1999年7月21日 102（e）日期1999年7月21日PCT提交1998年1月21日PCT公布。 第WO98 / 34278号公报 日期1998年8月6日提供一种引线框架材料，其可以设置有不需要诸如气相沉积等麻烦的工艺，具有优异的耐热性的蚀刻停止层， 在厚度为35〜300μm的铜或铜合金层（A）上含有0.3〜1.0重量％的磷的1.6〜10μm厚度，在该厚度上形成厚度为0.2〜30μm的铜层（C） 镍 - 磷合金层（B）。
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公开(公告)号：US20240308183A1
公开(公告)日：2024-09-19
申请号：US18546748
申请日：2022-02-04
申请人： NIPPON DENKAI, LTD.
发明人： Yasuhiro ENDO , Shota MOROE , Sayaka KINOSHITA
CPC分类号： B32B15/20 , B32B15/043 , B32B15/08 , B32B2307/20 , B32B2311/12
摘要： A surface-treated copper foil which maintains peel strength against the resin substrate of the surface-treated copper foil and achieves desired low transmission loss even at high frequencies is provided. The surface-treated copper foil of the present invention includes an electrolytic copper foil, at least one roughened layer that covers one surface of the electrolytic copper foil, an anti-rust layer that covers the at least one roughened layer, and a silane coupling agent-treated layer that covers the anti-rust layer, in which a surface of the surface-treated copper foil on a side of the layers (the surface to be bonded to the resin substrate) has a developed interfacial area ratio Sdr of 40% or less, an arithmetic mean peak curvature Spc of 200 mm−1 or less and a root mean square gradient Sdq of 0.30 to 0.90, or particles on the surface to be bonded of the surface-treated copper foil have an average particle size of 0.50 μm or less and an average particle length of 0.40 to 0.70 μm.
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公开(公告)号：US12091766B2
公开(公告)日：2024-09-17
申请号：US17311231
申请日：2019-12-03
申请人： NIPPON DENKAI, LTD.
发明人： Toshio Kawasaki , Tsuyoshi Onuma , Yasuhiro Endo
CPC分类号： C25D1/04 , B32B15/00 , B32B15/01 , B32B15/20 , C22C9/00 , C25D3/38 , C25D5/60 , C25D5/605 , H01M4/661 , Y02E60/10 , Y10T428/12431 , Y10T428/12903
摘要： An electrolytic copper foil having higher electrical conductivity, and a method for producing the same are provided. The electrolytic copper foil has a carbon content of 5 ppm or less, a sulfur content of 3 ppm or less, an oxygen content of 5 ppm or less, and a nitrogen content of 0.5 ppm or less; has a total content of carbon, sulfur, oxygen, nitrogen, and hydrogen of 15 ppm or less; and has a number of grains of 8.0 to 12.0/μm2, the number of grains changing to 0.6 to 1.0/μm2 by heating the electrolytic copper foil at 150° C. for 1 hour. A method for producing this electrolytic copper foil includes cleaning a copper raw material; dissolving the copper raw material after the cleaning to obtain an electrolytic solution having a total organic carbon of 10 ppm or less; and electrolyzing the electrolytic solution to obtain the electrolytic copper foil.
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公开(公告)号：US11952675B2
公开(公告)日：2024-04-09
申请号：US17787847
申请日：2020-11-10
申请人： NIPPON DENKAI, LTD.
发明人： Toshio Kawasaki , Yasuhiro Endo
CPC分类号： C25D5/12 , C23C28/30 , C25D5/16 , C25D5/48 , C25D5/605 , C25D7/0614 , H05K1/09 , H05K3/384 , Y10T428/12438
摘要： Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.
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7.发明授权Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board 失效非氰化铜锌电镀浴，使用其的印刷电路板用铜箔的表面处理方法以及印刷电路板用铜箔
公开(公告)号：US5534128A
公开(公告)日：1996-07-09
申请号：US393496
申请日：1995-02-24
CPC分类号： H05K3/384 , C25D3/58 , H05K2201/0323 , H05K2201/0355 , H05K2201/2063 , H05K2203/0307 , H05K2203/0723 , Y10S428/935 , Y10T428/12438 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/1291
摘要： A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.
摘要翻译： 通过将铜箔浸渍在铜箔中，制成具有包含铜含量为40〜90原子％，铜5〜50原子％，碳0.1〜20原子％的含碳铜 - 锌涂层的印刷电路板用铜箔 含有铜盐，锌盐，羟基羧酸或其盐，脂族二羧酸或其盐和硫氰酸或其盐的非氰化铜 - 锌电镀浴，并在非水溶液中进行电解， - 氰化铜铜锌电镀浴，使用铜箔作为阴极，在铜箔的至少一个表面上形成含碳铜锌涂层。
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公开(公告)号：US20230043755A1
公开(公告)日：2023-02-09
申请号：US17787847
申请日：2020-11-10
申请人： NIPPON DENKAI, LTD.
发明人： Toshio KAWASAKI , Yasuhiro ENDO
摘要： Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.
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公开(公告)号：US20220112618A1
公开(公告)日：2022-04-14
申请号：US17311231
申请日：2019-12-03
申请人： NIPPON DENKAI, LTD.
发明人： Toshio KAWASAKI , Tsuyoshi ONUMA , Yasuhiro ENDO
摘要： An electrolytic copper foil having higher electrical conductivity, and a method for producing the same are provided. The electrolytic copper foil according the present invention has a carbon content of 5 ppm or less, a sulfur content of 3 ppm or less, an oxygen content of 5 ppm or less, and a nitrogen content of 0.5 ppm or less; has a total content of carbon, sulfur, oxygen, nitrogen, and hydrogen of 15 ppm or less; and has a number of grains of 8.0 to 12.0/μm2, the number of grains changing to 0.6 to 1.0/μm2 by heating the electrolytic copper foil at 150° C. for 1 hour. A method for producing this electrolytic copper foil includes cleaning a copper raw material; dissolving the copper raw material after the cleaning to obtain an electrolytic solution having a total organic carbon (TOC) of 10 ppm or less; and electrolyzing the electrolytic solution to obtain the electrolytic copper foil.
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公开(公告)号：US5712047A
公开(公告)日：1998-01-27
申请号：US613624
申请日：1996-03-11
CPC分类号： H05K3/384 , C25D3/58 , H05K2201/0323 , H05K2201/0355 , H05K2201/2063 , H05K2203/0307 , H05K2203/0723 , Y10S428/935 , Y10T428/12438 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/1291
摘要： A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.
摘要翻译： 通过将铜箔浸渍在铜箔中，制成具有包含铜含量为40〜90原子％，铜5〜50原子％，碳0.1〜20原子％的含碳铜 - 锌涂层的印刷电路板用铜箔 含有铜盐，锌盐，羟基羧酸或其盐，脂族二羧酸或其盐和硫氰酸或其盐的非氰化铜 - 锌电镀浴，并在非水溶液中进行电解， - 氰化铜铜锌电镀浴，使用铜箔作为阴极，在铜箔的至少一个表面上形成含碳铜锌涂层。
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