公开(公告)号：US07363102B2

公开(公告)日：2008-04-22

申请号：US11074720

申请日：2005-03-09

申请人： Slew Heng Yong ,  Piau Yew Foo

发明人： Slew Heng Yong ,  Piau Yew Foo

IPC分类号： G06F19/00

CPC分类号： B41J3/407

摘要： The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport system for transporting the object handlers during a marking process; a vision inspection unit for capturing and/or processing the image of the object; a marking system for marking the object; and a control unit for receiving information from and sending instructions to other components of the precise marking apparatus. The present invention also provides a precise placement apparatus for precise marking and/or precise packaging an object and methods of using the same. The present invention further provides a precise marking and placement apparatus for performing precise marking on an object and precise placement of the object for final packaging and methods of using the same.

摘要翻译： 本发明提供一种用于对物体进行精确标记的精确标记装置及其使用方法。 精确的标记装置包括对象输入处理程序和用于处理对象的对象输出处理程序; 用于在标记过程中运送对象处理程序的传送系统; 用于捕获和/或处理对象的图像的视觉检查单元; 用于标记物体的标记系统; 以及用于从精确标记装置的其他部件接收信息并向其发送指令的控制单元。 本发明还提供一种用于精确标记和/或精确包装物体的精确放置装置及其使用方法。 本发明还提供了一种精确的标记和放置装置，用于在物体上进行精确标记并精确地放置物体以进行最终包装以及使用它们的方法。

公开(公告)号：US07155299B2

公开(公告)日：2006-12-26

申请号：US10856765

申请日：2004-06-01

申请人： Siew Heng Yong ,  Piau Yew Foo

发明人： Siew Heng Yong ,  Piau Yew Foo

IPC分类号： G06F19/00

CPC分类号： B41J3/407

摘要： The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport system for transporting the object handlers during a marking process; a vision inspection unit for capturing and/or processing the image of the object; a marking system for marking the object; and a control unit for receiving information from and sending instructions to other components of the precise marking apparatus.

摘要翻译： 本发明提供一种用于对物体进行精确标记的精确标记装置及其使用方法。 精确的标记装置包括对象输入处理程序和用于处理对象的对象输出处理程序; 用于在标记过程中运送对象处理程序的传送系统; 用于捕获和/或处理对象的图像的视觉检查单元; 用于标记物体的标记系统; 以及用于从精确标记装置的其他部件接收信息并向其发送指令的控制单元。

公开(公告)号：US10403782B2

公开(公告)日：2019-09-03

申请号：US15431782

申请日：2017-02-14

申请人： Manufacturing Integration Technology Ltd

发明人： Kim Mone Kwong ,  Teck Keong Boh ,  Kok Yeow Lim ,  Han Yong Lam

IPC分类号： B23K26/00 ,  B23K26/02 ,  H01L21/00 ,  G02B26/10 ,  H01L31/18 ,  B23K26/08 ,  B23K26/40 ,  H01L31/04 ,  B23K103/00

摘要： A method for laser scribing of thin-films for the manufacture of solar cell panels comprises loading a workpiece with the transparent substrate facing downwards in an input station of a first machine; biasing a reference edge of the workpiece against a front and rear stopper associated with a linear drive; translating the workpiece back and forth between the input station and output station and firing two or more laser beams at a first frequency substantially vertically through a space between the input and output stations to pass through the transparent substrate of the workpiece to scribe parallel lines on the front electrodes with reference to the edge of the workpiece in contact with the front and rear stoppers; and indexing the two or more laser sources and repeating the back and forth translation of the work piece between the input and output stations.

公开(公告)号：US09929036B2

公开(公告)日：2018-03-27

申请号：US15319259

申请日：2015-05-13

申请人： Manufacturing Integration Technology Ltd

发明人： Kim Mone Kwong ,  Kok Yeow Lim ,  Zhiqiang Mao

IPC分类号： H01L21/683

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/6838 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68386 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

公开(公告)号：US08727693B2

公开(公告)日：2014-05-20

申请号：US12596145

申请日：2008-05-06

申请人： Francis Medel P. Tundag ,  Han Yong Lam ,  Kam Yee Fong

发明人： Francis Medel P. Tundag ,  Han Yong Lam ,  Kam Yee Fong

IPC分类号： B29C31/00

CPC分类号： H01L21/67144

摘要： The present invention provides apparatuses for processing an object just as semiconductor chips and dies. The first embodiment comprises two or more pick and place heads (FIG. 1) which operate sequentially (ie leap frog) to pick components from a first location to a second. The second embodiment (FIG. 8) comprises a flipping head combined with a pick and place heads where an object is picked up by the flipping head, turned over and then presented to a pick and place head for relocation to an output.

摘要翻译： 本发明提供了像半导体芯片和芯片一样处理对象的装置。 第一实施例包括两个或更多个拾取和放置头（图1），其顺序地操作（即，跳跃），以从第一位置到第二位置拾取部件。 第二实施例（图8）包括与拾取头和放置头组合的翻转头，其中物体被翻转头拾取，翻转并且然后呈现到拾取头并将头放置到输出端。

公开(公告)号：US20120181259A1

公开(公告)日：2012-07-19

申请号：US13122963

申请日：2009-10-07

申请人： Kim Mone Kwong ,  Teck Keong Boh ,  Kok Yeow Lim ,  Han Yong Lam

发明人： Kim Mone Kwong ,  Teck Keong Boh ,  Kok Yeow Lim ,  Han Yong Lam

IPC分类号： H05B7/18

CPC分类号： H01L31/1876 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  G02B26/10 ,  H01L31/04 ,  H01L31/18

摘要： The present invention describes an apparatus (100) for a first laser scribing (P1) on the front electrode of a thin film solar cell panel and a similar apparatus (100a) for subsequent laser scribing (P2, P3) on the semiconductor layer and semiconductor layer/rear electrode. Before starting scribing process P1, the left hand edge or reference line on the left hand edge on a workpiece is aligned substantively parallel to the linear drive (140) before translating the workpiece on the apparatus (100). Similarly, the first and second scribed lines (Lp1, Lp2) formed during the P1 and P2 processes are separately aligned parallel to the linear drive (140) before starting the relevant process (P2, P3). Alternatively, parallelism of the workpiece is carried out for each batch of the workpiece. In both apparatuses (100, 100a), the laser sources (150) are mounted on independently motorized axes.

摘要翻译： 本发明描述了一种用于在薄膜太阳能电池板的前电极上的第一激光刻划（P1）的装置（100）和用于随后在半导体层和半导体上的激光刻划（P2，P3）的类似装置（100a） 层/后电极。 在开始划线过程P1之前，在将工件平移在设备（100）上之前，工件上的左手边缘上的左手边缘或参考线基本平行于线性驱动器（140）进行对准。 类似地，在开始相关处理（P2，P3）之前，在P1和P2处理期间形成的第一和第二划线（Lp1，Lp2）被平行于线性驱动器（140）分开排列。 或者，对于每批工件进行工件的平行度。 在这两个装置（100,100a）中，激光源（150）安装在独立的电动轴上。

公开(公告)号：US08864121B2

公开(公告)日：2014-10-21

申请号：US12999311

申请日：2009-06-18

申请人： Xiang Bao Zhang ,  Siew Hua Ng ,  Teck Keong Boh ,  Kim Mone Kwong

发明人： Xiang Bao Zhang ,  Siew Hua Ng ,  Teck Keong Boh ,  Kim Mone Kwong

IPC分类号： B25B1/06 ,  H01L21/687 ,  H01L23/544

CPC分类号： H01L21/687 ,  H01L23/544 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention describes an adaptive clamp width adjusting device (200) for use in an integrated circuit package process machine. The device (200) includes a travel component (210) and a fixed component (310). The travel component (210) carries a clamp (220a,220b) with an adjustable width and a rotary screw (230a) operable for such adjustment by a driven wheel (232). The fixed component (310), mounted on a base plate (312), includes a motor (320) and a drive wheel (324) attached to the motor shaft. When the device (200) is in a clamp width conversion station (40a), the travel component (210) is aligned above the fixed component (310) so that when the base plate (312) is raised and the drive wheel (324) engages the driven wheel (232), the clamp width is operable to be adjusted by the motor (320) according to a width of a workpiece (W).

摘要翻译： 本发明描述了一种用于集成电路封装处理机器的自适应钳位宽度调节装置（200）。 装置（200）包括行驶部件（210）和固定部件（310）。 行驶部件（210）承载具有可调节宽度的夹具（220a，220b）和可由从动轮（232）进行这种调节的旋转螺杆（230a）。 安装在基板（312）上的固定部件（310）包括安装在马达轴上的马达（320）和驱动轮（324）。 当装置（200）处于夹紧宽度转换站（40a）中时，行进部件（210）在固定部件（310）上方对准，使得当基板（312）升高并且驱动轮（324） 与从动轮（232）接合，夹具的宽度可根据工件（W）的宽度由电动机（320）进行调节。

公开(公告)号：US20110095467A1

公开(公告)日：2011-04-28

申请号：US12999311

申请日：2009-06-18

申请人： Xiang Bao Zhang ,  Siew Hua Ng ,  Teck Keong Boh ,  Kim Mone Kwong

发明人： Xiang Bao Zhang ,  Siew Hua Ng ,  Teck Keong Boh ,  Kim Mone Kwong

IPC分类号： B25B1/06

CPC分类号： H01L21/687 ,  H01L23/544 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention describes an adaptive clamp width adjusting device (200) for use in an integrated circuit package process machine. The device (200) includes a travel component (210) and a fixed component (310). The travel component (210) carries a clamp (220a,220b) with an adjustable width and a rotary screw (230a) operable for such adjustment by a driven wheel (232). The fixed component (310), mounted on a base plate (312), includes a motor (320) and a drive wheel (324) attacked to the motor shaft. When the device (200) is in a clamp width conversion station (40a), the travel component (210) is aligned above the fixed component (310) so that when the base plate (312) is raised and the drive wheel (324) engages the driven wheel (232), the clamp width is operable to be adjusted by the motor (320) according to a width of a workpiece (W).

摘要翻译： 本发明描述了一种用于集成电路封装处理机器的自适应钳位宽度调节装置（200）。 装置（200）包括行驶部件（210）和固定部件（310）。 行驶部件（210）承载具有可调节宽度的夹具（220a，220b）和可由从动轮（232）进行这种调节的旋转螺杆（230a）。 安装在基板（312）上的固定部件（310）包括电机（320）和驱动轮（324），该驱动轮侵入电机轴。 当装置（200）处于夹紧宽度转换站（40a）中时，行进部件（210）在固定部件（310）上方对准，使得当基板（312）升高并且驱动轮（324） 与从动轮（232）接合，夹具的宽度可根据工件（W）的宽度由电动机（320）进行调节。

公开(公告)号：US20050264590A1

公开(公告)日：2005-12-01

申请号：US11074720

申请日：2005-03-09

申请人： Slew Yong ,  Piau Foo

发明人： Slew Yong ,  Piau Foo

IPC分类号： B41J3/00 ,  B41J3/407

CPC分类号： B41J3/407

摘要： The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport system for transporting the object handlers during a marking process; a vision inspection unit for capturing and/or processing the image of the object; a marking system for marking the object; and a control unit for receiving information from and sending instructions to other components of the precise marking apparatus. The present invention also provides a precise placement apparatus for precise marking and/or precise packaging an object and methods of using the same. The present invention further provides a precise marking and placement apparatus for performing precise marking on an object and precise placement of the object for final packaging and methods of using the same.

摘要翻译： 本发明提供一种用于对物体进行精确标记的精确标记装置及其使用方法。 精确的标记装置包括对象输入处理程序和用于处理对象的对象输出处理程序; 用于在标记过程中运送对象处理程序的传送系统; 用于捕获和/或处理对象的图像的视觉检查单元; 用于标记物体的标记系统; 以及用于从精确标记装置的其他部件接收信息并向其发送指令的控制单元。 本发明还提供一种用于精确标记和/或精确包装物体的精确放置装置及其使用方法。 本发明还提供了一种精确的标记和放置装置，用于在物体上进行精确标记并精确地放置物体以进行最终包装以及使用它们的方法。