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1.发明授权Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device 有权无线IC器件，电子设备及调整无线IC器件谐振频率的方法公开(公告)号：US08360325B2
公开(公告)日：2013-01-29
申请号：US12861945
申请日：2010-08-24
申请人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Koji Shiroki , Yuya Dokai
发明人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Koji Shiroki , Yuya Dokai
CPC分类号： H01Q9/40 , H01L2224/16225 , H01L2224/73204 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H05K1/16 , Y10T29/49016
摘要： A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.
摘要翻译： 获得无线IC器件和电子设备，其可以在不提供专用天线的情况下实现小型化并且提高散热器板（电极）的增益。 提供了一种无线IC器件，其中在设置在印刷布线电路板上的接地电极中设置环形电极，并且其中处理发送/接收信号的无线IC芯片或电磁耦合模块耦合到环路 电极。 接地电极通过环形电极耦合到无线IC芯片或电磁耦合模块，并且发送或接收高频信号。 接地电极形成有用于调节其谐振频率的狭缝。
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公开(公告)号：US08078106B2
公开(公告)日：2011-12-13
申请号：US12543553
申请日：2009-08-19
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译： 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。
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公开(公告)号：US09460376B2
公开(公告)日：2016-10-04
申请号：US12688072
申请日：2010-01-15
申请人： Noboru Kato , Satoshi Ishino , Takeshi Kataya , Ikuhei Kimura , Nobuo Ikemoto , Yuya Dokai
发明人： Noboru Kato , Satoshi Ishino , Takeshi Kataya , Ikuhei Kimura , Nobuo Ikemoto , Yuya Dokai
IPC分类号： H01Q1/22 , H01Q1/24 , G06K19/06 , G06K19/077 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/14 , H05K1/02 , H05K1/16
CPC分类号： G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
摘要： A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
摘要翻译： 无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。 馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。 屏蔽壳或接线电缆用作辐射板。 无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。 金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。
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公开(公告)号：US08725071B2
公开(公告)日：2014-05-13
申请号：US13567109
申请日：2012-08-06
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B5/00
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译： 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。
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公开(公告)号：US08400307B2
公开(公告)日：2013-03-19
申请号：US12959454
申请日：2010-12-03
申请人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Yuya Dokai
发明人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Yuya Dokai
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2225 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H04Q2213/13095 , H05K1/0239 , H05K1/0243 , H05K1/141 , H05K1/16 , H05K2201/10098
摘要： A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.
摘要翻译： 射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极 电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。 电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。 包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。
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公开(公告)号：US07630685B2
公开(公告)日：2009-12-08
申请号：US12359690
申请日：2009-01-26
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
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公开(公告)号：US20090065594A1
公开(公告)日：2009-03-12
申请号：US12276444
申请日：2008-11-24
申请人： Noboru Kato , Yuya Dokai , Satoshi Ishino
发明人： Noboru Kato , Yuya Dokai , Satoshi Ishino
IPC分类号： G06K19/077
CPC分类号： H01Q1/2208 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0006 , H01F38/14 , H01L23/49855 , H01L2224/16225 , H01L2924/09701 , H01L2924/3011 , H01Q1/2283 , H01Q1/242 , H01Q1/50 , H01Q7/00 , H01Q23/00 , H01Q25/02
摘要： A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.
摘要翻译： 无线IC器件包括无线IC芯片，其上安装有无线IC芯片的馈电电路板，并且包括具有电感元件的馈电电路，以及电磁耦合到馈电电路中的电感元件的辐射板。 由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中，并且电感元件的一部分设置在高磁导率磁体中。
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公开(公告)号：US08676117B2
公开(公告)日：2014-03-18
申请号：US13567108
申请日：2012-08-06
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B5/00
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
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公开(公告)号：US07519328B2
公开(公告)日：2009-04-14
申请号：US11624382
申请日：2007-01-18
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译： 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。
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公开(公告)号：US08544754B2
公开(公告)日：2013-10-01
申请号：US12276444
申请日：2008-11-24
申请人： Noboru Kato , Yuya Dokai , Satoshi Ishino
发明人： Noboru Kato , Yuya Dokai , Satoshi Ishino
IPC分类号： G06K19/06
CPC分类号： H01Q1/2208 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0006 , H01F38/14 , H01L23/49855 , H01L2224/16225 , H01L2924/09701 , H01L2924/3011 , H01Q1/2283 , H01Q1/242 , H01Q1/50 , H01Q7/00 , H01Q23/00 , H01Q25/02
摘要： A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.
摘要翻译： 无线IC器件包括无线IC芯片，其上安装有无线IC芯片的馈电电路板，并且包括具有电感元件的馈电电路，以及电磁耦合到馈电电路中的电感元件的辐射板。 由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中，并且电感元件的一部分设置在高磁导率磁体中。
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