摘要:
The present invention provides a radio frequency identification (RFID) package structure for improving a low data reading rate of the conventional RFID transponder structure to overcome the disadvantage of the prior art, and packages a RFID die by an adhesive according to a package technology. The RFID package structure provides different ways of improving the data reading capability, such as adding a capacitor. The capacitance of the capacity can be adjusted to provide a RFID package structure applicable for different frequencies, or the RFID package structure formed by the structure of a single substrate together with the use of an adhesive can be used for producing the RFID package structure to lower the manufacturing cost.
摘要:
This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
摘要:
This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead. In another arrangement, the anodic and cathodic leads are bent by about 90 degree so that they point to the two sides of the packaging. External terminals are placed on the two sides of the packaging on the surfaces of the insulating material. In still another arrangement, the packaging structure uses only one protective substrate.
摘要:
This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
摘要:
This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal. For quantity production, the basic concept includes sandwiching hundreds of capacitor elements in between large thin protective substrates and bonding them to the conductor pads on the protective substrates; then filling in the insulating material by a capillary filling process; then curing the assembly into a first intermediate assembly. A second intermediate assembly is then made by cutting slots over the first intermediate assembly to expose the anodic and cathodic ends of each capacitor device for subsequent metal depositions to make the external terminals.
摘要:
This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal. For quantity production, the basic concept includes sandwiching hundreds of capacitor elements in between large thin protective substrates and bonding them to the conductor pads on the protective substrates; then filling in the insulating material by a capillary filling process; then curing the assembly into a first intermediate assembly. A second intermediate assembly is then made by cutting slots over the first intermediate assembly to expose the anodic and cathodic ends of each capacitor device for subsequent metal depositions to make the external terminals.
摘要:
An improved electrolytic method for fabricating transparent conductive multi-component metal oxide powders is disclosed. By adjusting pH-value, the metal compositions that a transparent conductive oxide film requires are electrolyzed to form individual metal ion precursory solutions under the condition not to precipitate the solution. Then, the individual metal ion precursory solutions with the required composition ratio are mixed and the precipitate reaction is performed. Finally, transparent conductive multi-component oxide powders with the controlled composition ratio and composition homogeneity are obtained by calcining the washed, filtered, and dried co-precipitates.
摘要:
The present invention relates to a composition for preserving plants, which comprises 5 carbon alcohol, at least one alcohol selected from the group consisting of 3 carbon alcohol and 4 carbon alcohol, a thiourea and at least one acid selected from the group consisting of tartaric acid and boric acid. The composition is used to preserve colors, patterns and DNA of plants. The composition can also be used to change colors of flowers. The present invention also relates to a method for preserving plants, which comprises soaking the plants in the composition of the present invention.