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公开(公告)号：US20240304394A1
公开(公告)日：2024-09-12
申请号：US18445743
申请日：2024-01-12
申请人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
CPC分类号： H01G9/0029 , H01G9/008 , H01G9/08
摘要： This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead. In another arrangement, the anodic and cathodic leads are bent by about 90 degree so that they point to the two sides of the packaging. External terminals are placed on the two sides of the packaging on the surfaces of the insulating material. In still another arrangement, the packaging structure uses only one protective substrate.
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公开(公告)号：US12057274B2
公开(公告)日：2024-08-06
申请号：US17667568
申请日：2022-02-09
申请人： Yu-Peng Chung , Chia-Wei Li , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Che-Chih Tsao
摘要： This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal. For quantity production, the basic concept includes sandwiching hundreds of capacitor elements in between large thin protective substrates and bonding them to the conductor pads on the protective substrates; then filling in the insulating material by a capillary filling process; then curing the assembly into a first intermediate assembly. A second intermediate assembly is then made by cutting slots over the first intermediate assembly to expose the anodic and cathodic ends of each capacitor device for subsequent metal depositions to make the external terminals.
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公开(公告)号：US20240170225A1
公开(公告)日：2024-05-23
申请号：US17992882
申请日：2022-11-22
申请人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
CPC分类号： H01G9/151 , H01G9/0029 , H01G9/012 , H01G9/0425
摘要： This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
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4.发明申请ELECTROLYTIC METHOD FOR FABRICATING TRANSPARENT CONDUCTIVE MULTI-COMPONENT METAL OXIDE POWDERS 审中-公开用于制造透明导电多组分金属氧化物粉末的电解方法公开(公告)号：US20130180864A1
公开(公告)日：2013-07-18
申请号：US13350939
申请日：2012-01-16
申请人： Hsin-Chun LU , Chia-Wei Li , Chen-Sung Chang , Ying-Yung Li , Jhih-Wei Mao , Ying-Chia Huang
发明人： Hsin-Chun LU , Chia-Wei Li , Chen-Sung Chang , Ying-Yung Li , Jhih-Wei Mao , Ying-Chia Huang
IPC分类号： C25B1/00
CPC分类号： C25B1/00 , C01G9/02 , C01G15/00 , C01G19/00 , C01P2002/54 , C01P2002/72 , C01P2004/03
摘要： An improved electrolytic method for fabricating transparent conductive multi-component metal oxide powders is disclosed. By adjusting pH-value, the metal compositions that a transparent conductive oxide film requires are electrolyzed to form individual metal ion precursory solutions under the condition not to precipitate the solution. Then, the individual metal ion precursory solutions with the required composition ratio are mixed and the precipitate reaction is performed. Finally, transparent conductive multi-component oxide powders with the controlled composition ratio and composition homogeneity are obtained by calcining the washed, filtered, and dried co-precipitates.
摘要翻译： 公开了一种用于制造透明导电多组分金属氧化物粉末的改进的电解方法。 通过调节pH值，透明导电氧化膜需要的金属组合物在不使溶液沉淀的条件下被电解以形成单独的金属离子前体溶液。 然后，将具有所需组成比的各金属离子前体溶液混合并进行沉淀反应。 最后，通过煅烧洗涤的，过滤的和干燥的共沉淀物获得具有受控组成比和组成均匀性的透明导电多组分氧化物粉末。
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公开(公告)号：US12057275B2
公开(公告)日：2024-08-06
申请号：US17992882
申请日：2022-11-22
申请人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Wen Cheng Hsu , En-Ming Chen , Che-Chih Tsao
CPC分类号： H01G9/012 , H01G9/0029 , H01G9/0425 , H01G9/08 , H01G9/151
摘要： This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
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6.发明公开公开(公告)号：US20230253162A1
公开(公告)日：2023-08-10
申请号：US17667568
申请日：2022-02-09
申请人： Yu-Peng Chung , Chia-Wei Li , Che-Chih Tsao
发明人： Yu-Peng Chung , Chia-Wei Li , Che-Chih Tsao
摘要： This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal. For quantity production, the basic concept includes sandwiching hundreds of capacitor elements in between large thin protective substrates and bonding them to the conductor pads on the protective substrates; then filling in the insulating material by a capillary filling process; then curing the assembly into a first intermediate assembly. A second intermediate assembly is then made by cutting slots over the first intermediate assembly to expose the anodic and cathodic ends of each capacitor device for subsequent metal depositions to make the external terminals.
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7.发明申请公开(公告)号：US20110071112A1
公开(公告)日：2011-03-24
申请号：US12889324
申请日：2010-09-23
申请人： Chia-Wei Li , Zi-Shun Hung , Chi-Chang Lin
发明人： Chia-Wei Li , Zi-Shun Hung , Chi-Chang Lin
CPC分类号： A01N3/00
摘要： The present invention relates to a composition for preserving plants, which comprises 5 carbon alcohol, at least one alcohol selected from the group consisting of 3 carbon alcohol and 4 carbon alcohol, a thiourea and at least one acid selected from the group consisting of tartaric acid and boric acid. The composition is used to preserve colors, patterns and DNA of plants. The composition can also be used to change colors of flowers. The present invention also relates to a method for preserving plants, which comprises soaking the plants in the composition of the present invention.
摘要翻译： 本发明涉及一种用于保存植物的组合物，其包含5个碳醇，至少一种选自3个碳醇和4个碳醇的醇，一种硫脲和至少一种选自酒石酸 和硼酸。 该组合物用于保护植物的颜色，图案和DNA。 该组合物也可用于改变花朵的颜色。 本发明还涉及一种保存植物的方法，其包括将植物浸泡在本发明的组合物中。
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公开(公告)号：US20070241439A1
公开(公告)日：2007-10-18
申请号：US11783760
申请日：2007-04-12
申请人： Yu-Peng Chung , Kuo-Tung Chang , En-Ming Chen , Chia-Wei Li
发明人： Yu-Peng Chung , Kuo-Tung Chang , En-Ming Chen , Chia-Wei Li
CPC分类号： G06K19/07749 , H01L23/3121 , H01L23/49833 , H01L23/49855 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/19041 , H01L2224/05599
摘要： The present invention provides a radio frequency identification (RFID) package structure for improving a low data reading rate of the conventional RFID transponder structure to overcome the disadvantage of the prior art, and packages a RFID die by an adhesive according to a package technology. The RFID package structure provides different ways of improving the data reading capability, such as adding a capacitor. The capacitance of the capacity can be adjusted to provide a RFID package structure applicable for different frequencies, or the RFID package structure formed by the structure of a single substrate together with the use of an adhesive can be used for producing the RFID package structure to lower the manufacturing cost.
摘要翻译： 本发明提供了一种射频识别（RFID）封装结构，用于提高传统的RFID应答器结构的低数据读取速率以克服现有技术的缺点，并根据封装技术通过粘合剂封装RFID芯片。 RFID封装结构提供了改善数据读取能力的不同方法，例如添加电容器。 可以调节容量的电容以提供适用于不同频率的RFID封装结构，或者通过使用粘合剂由单个衬底的结构形成的RFID封装结构可用于制造RFID封装结构以降低 制造成本。
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