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公开(公告)号：US4393434A
公开(公告)日：1983-07-12
申请号：US323586
申请日：1981-11-20
申请人： Yoshio Imai , Yoichi Nabeta , Tadao Inuzuka
发明人： Yoshio Imai , Yoichi Nabeta , Tadao Inuzuka
CPC分类号： G01N27/225 , G01R27/2605
摘要： A capacitance humidity sensor according to the disclosure a non-conductive base plate, electrodes oppositely arranged on the base plate, a metal compound membrane formed by ion-plating independently on the electrodes, the metal compound membrane being roughened on its surface by plasma etching and being active to the humidity, and a moisture permeable metal skin formed on the metal compound membrane. The metal compound is preferably an oxide or nitride of aluminum or magnesium.
摘要翻译： 根据本发明的电容式湿度传感器是非导电基板，在基板上相对布置的电极，通过在电极上独立地进行离子电镀而形成的金属化合物膜，金属化合物膜通过等离子体蚀刻在其表面上粗糙化， 对湿度有影响，并且在金属化合物膜上形成透湿的金属表皮。 金属化合物优选为铝或镁的氧化物或氮化物。
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公开(公告)号：US20060131724A1
公开(公告)日：2006-06-22
申请号：US11314039
申请日：2005-12-20
申请人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Kazunari Kurokawa , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta , Tetsuro Sawai , Toshikazu Imaoka
发明人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Kazunari Kurokawa , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta , Tetsuro Sawai , Toshikazu Imaoka
IPC分类号： H01L23/48
CPC分类号： H01L23/645 , H01F2017/008 , H01F2017/0086 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/07802 , H01L2924/12034 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。
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公开(公告)号：US07432580B2
公开(公告)日：2008-10-07
申请号：US11314039
申请日：2005-12-20
申请人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Kazunari Kurokawa , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta , Tetsuro Sawai , Toshikazu Imaoka
发明人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Kazunari Kurokawa , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta , Tetsuro Sawai , Toshikazu Imaoka
CPC分类号： H01L23/645 , H01F2017/008 , H01F2017/0086 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/07802 , H01L2924/12034 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。
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公开(公告)号：US07365628B2
公开(公告)日：2008-04-29
申请号：US11339438
申请日：2006-01-24
申请人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta
发明人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta
IPC分类号： H01F5/00
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/49822 , H01L23/552 , H01L23/645 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/07802 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H03J2200/10 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.
摘要翻译： 具有半导体芯片的半导体装置，与半导体芯片电连接的第一线圈和与第一线圈电连接的第一电极由能够电连接到第一电极的第二电极构成，并且可以电连接 涉及在半导体装置的外部的第二线圈，其特征在于，通过将第二电极与第一电极和第二线圈电连接来获得由第一线圈和第二线圈组成的电感。
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公开(公告)号：US20060176137A1
公开(公告)日：2006-08-10
申请号：US11339438
申请日：2006-01-24
申请人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta
发明人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta
IPC分类号： H01F5/00
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/49822 , H01L23/552 , H01L23/645 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/07802 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H03J2200/10 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.
摘要翻译： 具有半导体芯片的半导体装置，与半导体芯片电连接的第一线圈和与第一线圈电连接的第一电极由能够电连接到第一电极的第二电极构成，并且可以电连接 涉及在半导体装置的外部的第二线圈，其特征在于，通过将第二电极与第一电极和第二线圈电连接来获得由第一线圈和第二线圈组成的电感。
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