Abstract:
A thin-film transistor is formed on a transparent substrate and has a gate electrode film layer and a source and drain regions, and further has an alignment mark made of one and the same constituent material as a constituent material of at least one of the gate electrode film layer and source and drain regions and formed at one and the same position as the gate electrode film layer or source and drain region.
Abstract:
A thin-film transistor is formed on a transparent substrate and has a gate electrode film layer and a source and drain regions, and further has an alignment mark made of one and the same constituent material as a constituent material of at least one of the gate electrode film layer and source and drain regions and formed at one and the same position as the gate electrode film layer or source and drain region.
Abstract:
A thin-film transistor is formed on a transparent substrate and has a gate electrode film layer and a source and drain regions, and further has an alignment mark made of one and the same constituent material as a constituent material of at least one of the gate electrode film layer and source and drain regions and formed at one and the same position as the gate electrode film layer or source and drain region.
Abstract:
A thin-film transistor is formed on a transparent substrate and has a gate electrode film layer and a source and drain regions, and further has an alignment mark made of one and the same constituent material as a constituent material of at least one of the gate electrode film layer and source and drain regions and formed at one and the same position as the gate electrode film layer or source and drain region.
Abstract:
A thin-film transistor is formed on a transparent substrate and has a gate electrode film layer and a source and drain regions, and further has an alignment mark made of one and the same constituent material as a constituent material of at least one of the gate electrode film layer and source and drain regions and formed at one and the same position as the gate electrode film layer or source and drain region.
Abstract:
The present invention mainly provides an ESD protective element which can be built in high voltage semiconductor integrated circuit devices without increasing the chip area. An ESD protective element according to one embodiment has a construction comprising a semiconductor layer, a first region of a first conduction type formed in the semiconductor layer, a first region of a second conduction type formed in the semiconductor layer away from the first region of the first conduction type, a second region of the second conduction type formed in the first region of the second conduction type and has a higher impurity concentration than it, and a second region of the first conduction type formed in the second region of the second conduction type and has a high impurity concentration. The first and second regions of the second conduction type are in an electrically floating state.
Abstract:
The present invention mainly provides an ESD protective element which can be built in high voltage semiconductor integrated circuit devices without increasing the chip area. An ESD protective element according to one embodiment has a construction comprising a semiconductor layer, a first region of a first conduction type formed in the semiconductor layer, a first region of a second conduction type formed in the semiconductor layer away from the first region of the first conduction type, a second region of the second conduction type formed in the first region of the second conduction type and has a higher impurity concentration than it, and a second region of the first conduction type formed in the second region of the second conduction type and has a high impurity concentration. The first and second regions of the second conduction type are in an electrically floating state.