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37 条记录 (耗时 0.028 秒)

    Aqueous preparation and method of preparation thereof
    4.
    发明授权
    Aqueous preparation and method of preparation thereof 失效
    水性制剂及其制备方法

    公开(公告)号：US4822823A

    公开(公告)日：1989-04-18

    申请号：US10534

    申请日：1987-02-03

    申请人： Yujiro Yamamoto ,  Hideo Terayama ,  Yasushi Morita

    发明人： Yujiro Yamamoto ,  Hideo Terayama ,  Yasushi Morita

    IPC分类号： A61K9/00 ,  A61K9/08 ,  A61K9/70 ,  A61K31/12 ,  A61K45/00 ,  A61K47/00 ,  A61K47/40 ,  A61P11/00 ,  A61P27/02 ,  A61P27/14 ,  A61P27/16 ,  A61P37/08 ,  A61P43/00 ,  C07C50/28

    CPC分类号： A61K47/40 ,  A61K31/12 ,  A61K9/0043 ,  A61K9/0048 ,  A61K9/703 ,  A61K9/7084

    摘要： This invention relates to an aqueous preparation comprising a compound (A) represented by the formula: ##STR1## and at least one of cyclodextrins selected from .alpha.-cyclodextrin and dimethyl-.beta.-cyclodextrin; and a method of preparation thereof.According to the aqueous preparation of this invention, coexistence with at least one medicament selected from .alpha.-cyclodextrin and dimethyl-.beta.-cyclodextrin allows to enhance the solubility to water of compound (A) essential in this invention to such a concentration that makes an expected curative effect available and to inpart a desired stability to it. As a consequence, the aforesaid compound (A) can be utilized as a medicament for an aqueous preparation having anti-allergy action.

    摘要翻译： 本发明涉及含有由下式表示的化合物（A）的水性制剂和至少一种选自α-环糊精和二甲基-β-环糊精的环糊精; 及其制备方法。 根据本发明的水性制剂，与至少一种选自α-环糊精和二甲基-β-环糊精的药物共存允许增强本发明中必需的化合物（A）对水的溶解度，使其达到预期的浓度 可用的治疗效果和对其的期望的稳定性。 因此，上述化合物（A）可以用作具有抗过敏作用的水性制剂的药物。

    ORGANIC SEMICONDUCTOR DEVICE
    5.
    发明申请
    ORGANIC SEMICONDUCTOR DEVICE 有权
    有机半导体器件

    公开(公告)号：US20120126206A1

    公开(公告)日：2012-05-24

    申请号：US13131003

    申请日：2009-11-25

    申请人： Yasushi Morita ,  Masaaki Yokoyama ,  Shozo Yanagida ,  Yoshihisa Tawada ,  Kenji Yamamoto ,  Ryotaro Tsuji

    发明人： Yasushi Morita ,  Masaaki Yokoyama ,  Shozo Yanagida ,  Yoshihisa Tawada ,  Kenji Yamamoto ,  Ryotaro Tsuji

    IPC分类号： H01L51/30

    CPC分类号： H01L51/0056 ,  H01L51/424 ,  H01L51/5012 ,  H01L51/5048 ,  H01L51/5088 ,  Y02E10/549 ,  Y10S428/917

    摘要： An organic semiconductor device according to the present invention includes a semiconductor layer 14 interposed between two electrodes 12 and 15, and the semiconductor layer 14 contains a trioxotriangulene (TOT) derivative, which is a neutral radical compound, as a semiconductor material. The semiconductor layer 14 acts as an n-type semiconductor and coacts with a p-type semiconductor layer 13 to exhibit a photoelectric conversion effect. The organic semiconductor device is characterized as including a semiconductor layer that has a narrow band gap, has light absorption performance in an infrared region, and is high in carrier mobility.

    摘要翻译： 根据本发明的有机半导体器件包括插入在两个电极12和15之间的半导体层14，并且半导体层14包含作为半导体材料的作为中性自由基化合物的三氧化三三烯（TOT）衍生物。 半导体层14用作n型半导体并与p型半导体层13共同显示光电转换效果。 有机半导体器件的特征在于包括具有窄带隙的半导体层，在红外区域具有光吸收性能，并且载流子迁移率高。

    Semiconductor device, its manufacturing method and electronic apparatus thereof
    6.
    发明授权
    Semiconductor device, its manufacturing method and electronic apparatus thereof 有权
    半导体装置及其制造方法及其电子装置

    公开(公告)号：US07683414B2

    公开(公告)日：2010-03-23

    申请号：US11705349

    申请日：2007-02-12

    申请人： Takashi Nagano ,  Yasushi Morita

    发明人： Takashi Nagano ,  Yasushi Morita

    IPC分类号： H01L27/146

    CPC分类号： H01L27/14609 ,  H01L21/82385 ,  H01L21/823864 ,  H01L27/092 ,  H01L27/10873 ,  H01L27/10894 ,  H01L27/14689

    摘要： The present invention proposes a semiconductor device, its manufacturing method and to an electronic apparatus thereof equipped with the semiconductor device where it becomes possible to make a CMOS type solid-state imaging device, an imager area formed with a MOS transistor of an LDD structure without having a metal silicide layer of a refractory metal, an area of DRAM cells and the like into a single semiconductor chip. According to the present invention, a semiconductor device is constituted such that an insulating film having a plurality of layers is used, sidewalls at the gate electrodes are formed by etchingback the insulating film of the plurality of layers or a single layer film in the region where metal silicide layers are formed and in the region where the metal silicide layers are not formed, sidewalls composed of an upper layer insulating film is formed on a lower layer insulating film whose surface is coated or the insulating film of the plurality of layers remain unchanged.

    摘要翻译： 本发明提出一种半导体器件及其制造方法及其电子设备，其中可以制造CMOS型固态成像器件，形成有LDD结构的MOS晶体管的成像器区域的半导体器件没有 具有难熔金属的金属硅化物层，DRAM单元的面积等形成单个半导体芯片。 根据本发明，半导体器件被构成为使用具有多个层的绝缘膜，在栅电极处的侧壁通过蚀刻多层绝缘膜或在单层膜的区域中形成单层膜来形成 形成金属硅化物层，并且在不形成金属硅化物层的区域中，在其表面被涂覆的下层绝缘膜上或多层的绝缘膜保持不变的情况下，形成由上层绝缘膜构成的侧壁。

    Semiconductor device and its manufacturing method, and electronic device
    7.
    发明授权
    Semiconductor device and its manufacturing method, and electronic device 有权
    半导体器件及其制造方法和电子器件

    公开(公告)号：US07235835B2

    公开(公告)日：2007-06-26

    申请号：US10483882

    申请日：2003-05-14

    申请人： Takashi Nagano ,  Yasushi Morita

    发明人： Takashi Nagano ,  Yasushi Morita

    IPC分类号： H01L21/8238

    CPC分类号： H01L27/14609 ,  H01L21/82385 ,  H01L21/823864 ,  H01L27/092 ,  H01L27/10873 ,  H01L27/10894 ,  H01L27/14689

    摘要： The present invention proposes a semiconductor device, its manufacturing method and to an electronic apparatus thereof equipped with the semiconductor device where it becomes possible to make a CMOS type solid-state imaging device, an imager area formed with a MOS transistor of an LDD structure without having a metal silicide layer of a refractory metal, an area of DRAM cells and the like into a single semiconductor chip. According to the present invention, a semiconductor device is constituted such that an insulating film having a plurality of layers is used, sidewalls at the gate electrodes are formed by etching back the insulating film of the plurality of layers or a single layer film in the region where metal silicide layers are formed and in the region where the metal silicide layers are not formed, sidewalls composed of an upper layer insulating film is formed on a lower layer insulating film whose surface is coated or the insulating film of the plurality of layers remain unchanged.

    摘要翻译： 本发明提出一种半导体器件及其制造方法及其电子设备，其中可以制造CMOS型固态成像器件，形成有LDD结构的MOS晶体管的成像器区域的半导体器件没有 具有难熔金属的金属硅化物层，DRAM单元的面积等形成单个半导体芯片。 根据本发明，半导体器件被构成为使用具有多个层的绝缘膜，通过蚀刻多个层的绝缘膜或在该区域中的单层膜来形成栅电极的侧壁 在形成金属硅化物层的地方，并且在未形成金属硅化物层的区域中，由上层绝缘膜构成的侧壁形成在其表面被涂覆的下层绝缘膜上，或者多层绝缘膜保持不变 。

    Bearing unit
    8.
    发明授权
    Bearing unit 有权
    轴承单元

    公开(公告)号：US06739757B2

    公开(公告)日：2004-05-25

    申请号：US10045614

    申请日：2001-10-25

    申请人： Kengo Kai ,  Yasushi Morita

    发明人： Kengo Kai ,  Yasushi Morita

    IPC分类号： F16C3378

    CPC分类号： B23Q11/0883 ,  F16C33/7886 ,  F16C33/80 ,  F16C2322/39

    摘要： A bearing unit comprising a bearing having an inner ring, an outer ring and a plurality of rolling elements arranged so as to be freely rotatable between the inner ring and the outer ring, and a sealing device arranged on axially opposite sides of the bearing, wherein the sealing device has a fixed ring spacer, a rotating ring spacer, and a non-contact seal section attached to the rotating ring spacer and extending towards the fixed ring spacer to be maintained in a non-contact condition with respect to the fixed ring spacer.

    摘要翻译： 一种轴承单元，包括轴承，所述轴承具有内圈，外圈和多个滚动元件，所述滚动元件布置成在所述内圈和所述外圈之间可自由转动;以及密封装置，其布置在所述轴承的轴向相对侧上，其中 该密封装置具有固定的环形间隔件，旋转环形间隔件和非接触式密封部分，该非接触式密封部分附接到旋转环形间隔件并且朝向固定环形间隔件延伸以相对于固定环间隔件保持在非接触状态 。

    Flattening method for interlayer insulating film
    9.
    发明授权
    Flattening method for interlayer insulating film 失效
    层间绝缘膜的平整方法

    公开(公告)号：US5264074A

    公开(公告)日：1993-11-23

    申请号：US883778

    申请日：1992-05-15

    申请人： Masakazu Muroyama ,  Yasushi Morita

    发明人： Masakazu Muroyama ,  Yasushi Morita

    IPC分类号： H01L21/302 ,  H01L21/3065 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/768 ,  B44C1/22 ,  H01L21/467

    CPC分类号： H01L21/76819 ,  H01L21/31055 ,  H01L21/31116

    摘要： Disclosed herein is a flattening method for an interlayer insulating film in a semiconductor device. A substance for forming a solid flattening film is prepared in a liquid-phase state, and a film (e.g., water film) of the substance in the liquid-phase state having a substantially flat upper surface is formed on an uneven upper surface of the interlayer insulating film. Subsequently, the liquid film thus formed is solidified to be formed into the solid flattening film. Then, the solid flattening film and a part of the interlayer insulating film are etched back to obtain a flat upper surface of the interlayer insulating film. Accordingly, the upper surface of the interlayer insulating film can be flattened at low temperatures.

    摘要翻译： 这里公开了一种用于半导体器件中的层间绝缘膜的平坦化方法。 在液相状态下制备用于形成固体压平膜的物质，并且在所述液相状态下具有基本上平坦的上表面的物质的膜（例如水膜）形成在 层间绝缘膜。 随后，将如此形成的液膜固化，形成固体压平膜。 然后，将固体压平膜和层间绝缘膜的一部分进行回蚀以获得层间绝缘膜的平坦的上表面。 因此，层间绝缘膜的上表面可以在低温下变平。