公开(公告)号：US07014715B2

公开(公告)日：2006-03-21

申请号：US10942128

申请日：2004-09-16

申请人： Yong-Kyung Kim

发明人： Yong-Kyung Kim

IPC分类号： B05C11/10

CPC分类号： H01L21/67253 ,  G03F7/162 ,  H01L21/6715

摘要： A photoresist supply apparatus of semiconductor coating equipment fills a supply pipe with new photoresist when a used photoresist bottle is replaced. The photoresist supply apparatus includes first and second photoresist bottles, first and second gas supply pipes connected to the bottles, first and second solenoid valves disposed along the gas supply pipes, first and second purge start buttons, first and second photoresist supply pipes, first and second trap tanks to which the supply pipes are connected, a third photoresist supply pipe connected to the trap tanks, a nozzle connected to the third photoresist supply pipe, first and second level sensors disposed at an upper level of the trap tanks, third and fourth level sensors disposed at a lower level of the trap tank, first and second discharge pipes connected to the trap tanks, third and fourth solenoid valves disposed along the discharge pipes, first and second drain sensors associated with the discharge pipes, and a controller.

摘要翻译： 当更换用过的光致抗蚀剂瓶时，半导体涂层设备的光致抗蚀剂供应装置用新的光致抗蚀剂填充供应管。 光致抗蚀剂供应装置包括第一和第二光致抗蚀剂瓶，连接到瓶的第一和第二气体供应管，沿着气体供应管设置的第一和第二电磁阀，第一和第二清洗开始按钮，第一和第二光致抗蚀剂供应管， 与供给管连接的第二捕集罐，连接到捕集罐的第三光致抗蚀剂供应管，连接到第三光致抗蚀剂供应管的喷嘴，设置在捕集罐的上层的第一和第二液位传感器，第三和第四 设置在所述捕集罐的下部的液位传感器，连接到所述捕集罐的第一和第二排出管，沿着所述排出管设置的第三和第四电磁阀，与所述排出管相关联的第一和第二排出传感器，以及控制器。

公开(公告)号：US20090194011A1

公开(公告)日：2009-08-06

申请号：US11597858

申请日：2005-04-26

申请人： Yong-Kyung Kim

发明人： Yong-Kyung Kim

IPC分类号： B63B43/04 ,  B63B43/06

CPC分类号： B63B11/04 ,  B63B3/20 ,  B63B13/00

摘要： A double-hulled vessel has a ballast draft line previously set at an empty state thereof. The double-hulled vessel of the present invention comprises an outer shell formed on bottom and side portions of the vessel; an inner shell formed on bottom and side portions of the vessel within the outer shell; an air tube positioned between the inner and outer shells; and a seawater tube positioned between the inner and outer shells, wherein seawater holes are formed in the outer shell to be connected to the seawater tube, the seawater tube is capable of containing seawater to substantially fill a space between the inner and outer shells extending from the bottom portion of the vessel up to the ballast draft line of the side portion of the vessel when the vessel is not loaded with cargo, and the air tube is capable of containing air to substantially fill the space between the inner and outer shells of the bottom and side portions of the vessel when the vessel is loaded with cargo.

摘要翻译： 双壳体容器具有预先设定在空状态的压载线。 本发明的双壳容器包括在容器的底部和侧部形成的外壳; 内壳，形成在外壳内的容器的底部和侧部; 位于内壳和外壳之间的空气管; 以及定位在内壳和外壳之间的海水管，其中在外壳中形成海水孔以连接到海水管，海水管能够容纳海水以基本上填充内壳和外壳之间的空间， 当船只未装载货物时，容器的底部直到容器侧部的压舱引流线，并且空气管能够容纳空气以基本上填充内壳和外壳之间的空间 当船舶装载货物时，船舶的底部和侧部。

公开(公告)号：US07789031B2

公开(公告)日：2010-09-07

申请号：US11597858

申请日：2005-04-26

申请人： Yong-Kyung Kim

发明人： Yong-Kyung Kim

IPC分类号： B63B43/04

CPC分类号： B63B11/04 ,  B63B3/20 ,  B63B13/00

摘要： A double-hulled vessel has a ballast draft line previously set at an empty state thereof. The double-hulled vessel of the present invention comprises an outer shell formed on bottom and side portions of the vessel; an inner shell formed on bottom and side portions of the vessel within the outer shell; an air tube positioned between the inner and outer shells; and a seawater tube positioned between the inner and outer shells, wherein seawater holes are formed in the outer shell to be connected to the seawater tube, the seawater tube is capable of containing seawater to substantially fill a space between the inner and outer shells extending from the bottom portion of the vessel up to the ballast draft line of the side portion of the vessel when the vessel is not loaded with cargo, and the air tube is capable of containing air to substantially fill the space between the inner and outer shells of the bottom and side portions of the vessel when the vessel is loaded with cargo.

摘要翻译： 双壳体容器具有预先设定在空状态的压载线。 本发明的双壳容器包括在容器的底部和侧部形成的外壳; 内壳，形成在外壳内的容器的底部和侧部; 位于内壳和外壳之间的空气管; 以及定位在内壳和外壳之间的海水管，其中在外壳中形成海水孔以连接到海水管，海水管能够容纳海水以基本上填充内壳和外壳之间的空间， 当船只未装载货物时，容器的底部直到容器侧部的压舱引流线，并且空气管能够容纳空气以基本上填充内壳和外壳之间的空间 当船舶装载货物时，船舶的底部和侧部。

公开(公告)号：US07189434B2

公开(公告)日：2007-03-13

申请号：US11328178

申请日：2006-01-10

申请人： Yong-Kyung Kim

发明人： Yong-Kyung Kim

IPC分类号： B05D1/02

CPC分类号： H01L21/67253 ,  G03F7/162 ,  H01L21/6715

摘要： A photoresist supply apparatus of semiconductor coating equipment fills a supply pipe with new photoresist when a used photoresist bottle is replaced. The photoresist supply apparatus includes first and second photoresist bottles, first and second gas supply pipes connected to the bottles, first and second solenoid valves disposed along the gas supply pipes, first and second purge start buttons, first and second photoresist supply pipes, first and second trap tanks to which the supply pipes are connected, a third photoresist supply pipe connected to the trap tanks, a nozzle connected to the third photoresist supply pipe, first and second level sensors disposed at an upper level of the trap tanks, third and fourth level sensors disposed at a lower level of the trap tank, first and second discharge pipes connected to the trap tanks, third and fourth solenoid valves disposed along the discharge pipes, first and second drain sensors associated with the discharge pipes, and a controller.

摘要翻译： 当更换用过的光致抗蚀剂瓶时，半导体涂层设备的光致抗蚀剂供应装置用新的光致抗蚀剂填充供应管。 光致抗蚀剂供应装置包括第一和第二光致抗蚀剂瓶，连接到瓶的第一和第二气体供应管，沿着气体供应管设置的第一和第二电磁阀，第一和第二清洗开始按钮，第一和第二光致抗蚀剂供应管， 与供给管连接的第二捕集罐，连接到捕集罐的第三光致抗蚀剂供应管，连接到第三光致抗蚀剂供应管的喷嘴，设置在捕集罐的上层的第一和第二液位传感器，第三和第四 设置在所述捕集罐的下部的液位传感器，连接到所述捕集罐的第一和第二排出管，沿着所述排出管设置的第三和第四电磁阀，与所述排出管相关联的第一和第二排出传感器，以及控制器。

公开(公告)号：US20060115577A1

公开(公告)日：2006-06-01

申请号：US11328178

申请日：2006-01-10

申请人： Yong-Kyung Kim

发明人： Yong-Kyung Kim

IPC分类号： C23C16/52

CPC分类号： H01L21/67253 ,  G03F7/162 ,  H01L21/6715

摘要： A photoresist supply apparatus of semiconductor coating equipment fills a supply pipe with new photoresist when a used photoresist bottle is replaced. The photoresist supply apparatus includes first and second photoresist bottles, first and second gas supply pipes connected to the bottles, first and second solenoid valves disposed along the gas supply pipes, first and second purge start buttons, first and second photoresist supply pipes, first and second trap tanks to which the supply pipes are connected, a third photoresist supply pipe connected to the trap tanks, a nozzle connected to the third photoresist supply pipe, first and second level sensors disposed at an upper level of the trap tanks, third and fourth level sensors disposed at a lower level of the trap tank, first and second discharge pipes connected to the trap tanks, third and fourth solenoid valves disposed along the discharge pipes, first and second drain sensors associated with the discharge pipes, and a controller.

公开(公告)号：US20050069631A1

公开(公告)日：2005-03-31

申请号：US10942128

申请日：2004-09-16

申请人： Yong-Kyung Kim

发明人： Yong-Kyung Kim

IPC分类号： H01L21/027 ,  B05D1/00 ,  G03F7/16 ,  H01L21/00

CPC分类号： H01L21/67253 ,  G03F7/162 ,  H01L21/6715

摘要： A photoresist supply apparatus of semiconductor coating equipment fills a supply line with new photoresist when a used photoresist bottle is replaced. The photoresist supply apparatus includes first and second photoresist bottles, first and second gas supply pipes connected to the bottles, first and second solenoid valves disposed along the gas supply pipes, first and second purge start buttons, first and second photoresist supply pipes, first and second trap tanks to which the supply pipes are connected, a third photoresist supply pipe connected to the trap tanks, a nozzle connected to the third photoresist supply pipe, first and second level sensors disposed at an upper level of the trap tanks, third and fourth level sensors disposed at a lower level of the trap tank, first and second discharge pipes connected to the trap tanks, third and fourth solenoid valves disposed along the discharge pipes, first and second drain sensors associated with the discharge pipes, and a controller.

摘要翻译： 当更换使用的光致抗蚀剂瓶时，半导体涂层设备的光致抗蚀剂供应装置填充新的光致抗蚀剂的供应线。 光致抗蚀剂供应装置包括第一和第二光致抗蚀剂瓶，连接到瓶的第一和第二气体供应管，沿着气体供应管设置的第一和第二电磁阀，第一和第二清洗开始按钮，第一和第二光致抗蚀剂供应管， 与供给管连接的第二捕集罐，连接到捕集罐的第三光致抗蚀剂供应管，连接到第三光致抗蚀剂供应管的喷嘴，设置在捕集罐的上层的第一和第二液位传感器，第三和第四 设置在所述捕集罐的下部的液位传感器，连接到所述捕集罐的第一和第二排出管，沿着所述排出管设置的第三和第四电磁阀，与所述排出管相关联的第一和第二排出传感器，以及控制器。