摘要:
A mechanical scanning stage for high speed image acquisition in a focused beam system. The mechanical scanning stage preferably is a combination of four stages. A first stage provides linear motion. A second stage, above the first stage, provides rotational positioning. A third stage above the rotational stage is moveable in a first linear direction, and the fourth stage above the third stage is positionable in a second linear direction orthogonal to the first direction. The four stages are responsive to input from a controller programmed with a polar coordinate pixel addressing method, for positioning a specimen mounted on the mechanical stage to allow an applied static focus beam to irradiate selected areas of interest, thereby imaged by collecting signals from the specimen using a polar coordinate pixel addressing method.
摘要:
A mechanical scanning stage for high speed image acquisition in a focused beam system. The mechanical scanning stage preferably is a combination of four stages. A first stage provides linear motion. A second stage, above the first stage, provides rotational positioning. A third stage above the rotational stage is moveable in a first linear direction, and the fourth stage above the third stage is positionable in a second linear direction orthogonal to the first direction. The four stages are responsive to input from a controller programmed with a polar coordinate pixel addressing method, for positioning a specimen mounted on the mechanical stage to allow an applied static focus beam to irradiate selected areas of interest, thereby imaged by collecting signals from the specimen using a polar coordinate pixel addressing method.
摘要:
A mechanical scanning stage for high speed image acquisition in a focused beam system. The mechanical scanning stage preferably is a combination of four stages. A first stage provides linear motion. A second stage, above the first stage, provides rotational positioning. A third stage above the rotational stage is moveable in a first linear direction, and the fourth stage above the third stage is positionable in a second linear direction orthogonal to the first direction. The four stages are responsive to input from a controller programmed with a polar coordinate pixel addressing method, for positioning a specimen mounted on the mechanical stage to allow an applied static focus beam to irradiate selected areas of interest, thereby imaged by collecting signals from the specimen using a polar coordinate pixel addressing method.
摘要:
One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.
摘要:
A probing apparatus for semiconductor devices includes a housing configured to define a testing chamber, a device holder positioned in the housing and configured to receive at least one device under test, and at least one probe stage positioned in the housing. In one embodiment of the present disclosure, the probe stage includes a base, a retaining arm pivotally coupled with the base and having a retaining portion configured to retain at least one probe, and a stepper positioned on the base. In one embodiment of the present disclosure, the stepper is configured in response to an electric signal to move the probe downward through the retaining arm to contact a device under test and to move the probe upward through the retaining arm to separate from the device under test such that the up-and-down movement of the probe can be performed at relatively high frequency of typically greater than six cycles per second. In one embodiment of the present disclosure, the stepper further equipped with a contact sensor configured to sense the contact of the probe to the device under test.
摘要:
One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.
摘要:
A microscope comprises an object splitter and a plurality of image-outputting devices configured to receive object images. The object splitter includes a first beam splitter configured to direct an illumination light to an object, a positive lens configured to collect a reflected light from the object and focus the reflected light on the first beam splitter, a second beam splitter configured to split the reflected light into a plurality of optical paths and a plurality of negative lenses positioned on the optical paths to render object images. A probing apparatus for an integrated circuit device comprises at least one probe pin configured to contact a pad of the integrated circuit device and a microscope including an object splitter and a plurality of image-outputting devices configured to receive images from the object splitter.
摘要:
An integrated emission microscope with an emitted radiation detection system for collecting and analyzing radiation from a device under test. A semi-ellipsoidal mirror of high ellipticity directs emitted radiation from the device under test through an aperture to a radiation guide, Which transmits the radiation to spectral analyzer. The device under test may be mounted on a scanning stage. The system permits high spatial resolution selected area spectroscopic analysis, panchromatic imaging, and spectroscopic mapping of the emitted radiation from the device under test.