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    Analytical Equipment Enclosure Incorporating Phase Changing Materials
    5.
    发明申请
    Analytical Equipment Enclosure Incorporating Phase Changing Materials 有权
    分析设备外壳并入相变材料

    公开(公告)号：US20100169027A1

    公开(公告)日：2010-07-01

    申请号：US12347368

    申请日：2008-12-31

    Applicant: Xuejiao Hu ,  Alfred Feitisch

    Inventor： Xuejiao Hu ,  Alfred Feitisch

    IPC: G01N21/59 ,  G01K11/30

    CPC classification number: G01N21/39 ,  G01N2201/022 ,  G01N2201/023 ,  G01N2201/0231

    Abstract: Thermally controlled enclosures that can be used with gas analyzers are described. The enclosures incorporate one or more phase changing materials that buffer ambient and internal heat loads to reduce the power consumption demand of mechanical or electronic heating apparatus. Maintenance of gas analyzer equipment at a consistent temperature can be important to achieving stable and reproducible results. Related systems, apparatus, methods, and/or articles are also described.

    Abstract translation: 描述了可用于气体分析仪的热控制外壳。 外壳采用缓冲环境和内部热负荷的一种或多种相变材料，以减少机械或电子加热设备的功耗需求。 在一致的温度下维护气体分析仪设备对于获得稳定和可重现的结果是重要的。 还描述了相关系统，装置，方法和/或制品。

    Thermal interface material with hotspot heat remover
    7.
    发明授权
    Thermal interface material with hotspot heat remover 有权
    热界面材料与热点除热器

    公开(公告)号：US07579686B2

    公开(公告)日：2009-08-25

    申请号：US11618593

    申请日：2006-12-29

    Applicant: Xuejiao Hu ,  Chia-Pin Chiu

    Inventor： Xuejiao Hu ,  Chia-Pin Chiu

    IPC: H01L23/10 ,  H01L23/34

    CPC classification number: H01L23/42 ,  H01L23/367 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a structure extending a distance outward therefrom. The thermal interface material includes a first region having a first thickness and a second region having a second thickness, the first thickness being smaller than the second thickness. The structure extending a distance outward from the heat spreader is positioned on the first region of the thermal interface material. The total of the first thickness of the thermal interface material and the distance the structure extends outward from the surface of the heat spreader is substantially the same as the second thickness. In one aspect of certain embodiments, the first region of the thermal interface material and the structure on the heat spreader are in alignment with a hot spot on the die. Other embodiments are described and claimed.

    Abstract translation: 描述了包括通过热界面材料耦合到管芯的散热器的电子组件的形成。 在一个实施例中，散热器包括具有向外延伸一定距离的结构的表面。 热界面材料包括具有第一厚度的第一区域和具有第二厚度的第二区域，第一厚度小于第二厚度。 从散热器向外延伸一定距离的结构位于热界面材料的第一区域上。 热界面材料的第一厚度和结构从散热器表面向外延伸的距离的总和基本上与第二厚度相同。 在某些实施方案的一个方面，热界面材料的第一区域和散热器上的结构与模具上的热点对准。 描述和要求保护其他实施例。

    TRANSPIRATION COOLING FOR PASSIVE COOLED ULTRA MOBILE PERSONAL COMPUTER
    9.
    发明申请
    TRANSPIRATION COOLING FOR PASSIVE COOLED ULTRA MOBILE PERSONAL COMPUTER 有权
    被动冷却超声波移动个人计算机的蒸发冷却

    公开(公告)号：US20080310111A1

    公开(公告)日：2008-12-18

    申请号：US11762913

    申请日：2007-06-14

    Applicant: Xuejiao Hu

    Inventor： Xuejiao Hu

    IPC: H05K7/20

    CPC classification number: G06F1/20 ,  F28D5/00 ,  G06F1/203

    Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.

    Abstract translation: 在一些实施例中，呈现被动冷却超移动个人计算机的蒸腾冷却。 在这方面，引入了具有多个集成电路装置，用于为集成电路装置供电的电源，用于容纳集成电路装置和电源的底盘的装置，以及 皮肤覆盖底盘，所述皮肤包括防水层，所述防水层被构造成防止水与所述集成电路装置接触，所述吸水层被构造成吸收水分。 还公开并要求保护其他实施例。

    Transpiration cooling for passive cooled ultra mobile personal computer
    10.
    发明授权
    Transpiration cooling for passive cooled ultra mobile personal computer 有权
    被动冷却超移动个人电脑的蒸腾冷却

    公开(公告)号：US07463486B1

    公开(公告)日：2008-12-09

    申请号：US11762913

    申请日：2007-06-14

    Applicant: Xuejiao Hu

    Inventor： Xuejiao Hu

    IPC: H05K7/20 ,  F28F7/00

    CPC classification number: G06F1/20 ,  F28D5/00 ,  G06F1/203

    Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.

    Abstract translation: 在一些实施例中，呈现被动冷却超移动个人计算机的蒸腾冷却。 在这方面，引入了具有多个集成电路装置，用于为集成电路装置供电的电源，用于容纳集成电路装置和电源的底盘的装置，以及 皮肤覆盖底盘，所述皮肤包括防水层，所述防水层被构造成防止水与所述集成电路装置接触，所述吸水层被构造成吸收水分。 还公开并要求保护其他实施例。

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