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公开(公告)号：US07579686B2
公开(公告)日：2009-08-25
申请号：US11618593
申请日：2006-12-29
Applicant: Xuejiao Hu , Chia-Pin Chiu
Inventor： Xuejiao Hu , Chia-Pin Chiu
CPC classification number: H01L23/42 , H01L23/367 , H01L23/4275 , H01L2924/0002 , H01L2924/00
Abstract: The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a structure extending a distance outward therefrom. The thermal interface material includes a first region having a first thickness and a second region having a second thickness, the first thickness being smaller than the second thickness. The structure extending a distance outward from the heat spreader is positioned on the first region of the thermal interface material. The total of the first thickness of the thermal interface material and the distance the structure extends outward from the surface of the heat spreader is substantially the same as the second thickness. In one aspect of certain embodiments, the first region of the thermal interface material and the structure on the heat spreader are in alignment with a hot spot on the die. Other embodiments are described and claimed.
Abstract translation: 描述了包括通过热界面材料耦合到管芯的散热器的电子组件的形成。 在一个实施例中，散热器包括具有向外延伸一定距离的结构的表面。 热界面材料包括具有第一厚度的第一区域和具有第二厚度的第二区域，第一厚度小于第二厚度。 从散热器向外延伸一定距离的结构位于热界面材料的第一区域上。 热界面材料的第一厚度和结构从散热器表面向外延伸的距离的总和基本上与第二厚度相同。 在某些实施方案的一个方面，热界面材料的第一区域和散热器上的结构与模具上的热点对准。 描述和要求保护其他实施例。
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公开(公告)号：US07504453B2
公开(公告)日：2009-03-17
申请号：US11015218
申请日：2004-12-17
Applicant: Xuejiao Hu , Linan Jiang , Kenneth E. Goodson
Inventor： Xuejiao Hu , Linan Jiang , Kenneth E. Goodson
IPC: C08K3/04
CPC classification number: B82Y30/00 , C08K7/02 , C08K2201/011 , Y10S977/773 , Y10S977/776 , Y10S977/813
Abstract: A thermal interface material (TIM) including a mechanically compliant matrix material which contains thermally conductive particles and thermally conductive nanofibers is provided. Such a TIM provides enhanced thermal conductivity without excessive viscosity when the nanofiber volume concentration is above a threshold value for enhanced thermal conductivity.
Abstract translation: 提供了包含导热颗粒和导热纳米纤维的机械柔性基质材料的热界面材料（TIM）。 当纳米纤维体积浓度高于阈值以提高导热性时，这种TIM提供增强的导热性而不会过多的粘度。
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3.发明申请公开(公告)号：US20080310111A1
公开(公告)日：2008-12-18
申请号：US11762913
申请日：2007-06-14
Applicant: Xuejiao Hu
Inventor： Xuejiao Hu
IPC: H05K7/20
Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.
Abstract translation: 在一些实施例中，呈现被动冷却超移动个人计算机的蒸腾冷却。 在这方面，引入了具有多个集成电路装置，用于为集成电路装置供电的电源，用于容纳集成电路装置和电源的底盘的装置，以及 皮肤覆盖底盘，所述皮肤包括防水层，所述防水层被构造成防止水与所述集成电路装置接触，所述吸水层被构造成吸收水分。 还公开并要求保护其他实施例。
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公开(公告)号：US07463486B1
公开(公告)日：2008-12-09
申请号：US11762913
申请日：2007-06-14
Applicant: Xuejiao Hu
Inventor： Xuejiao Hu
Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.
Abstract translation: 在一些实施例中，呈现被动冷却超移动个人计算机的蒸腾冷却。 在这方面，引入了具有多个集成电路装置，用于为集成电路装置供电的电源，用于容纳集成电路装置和电源的底盘的装置，以及 皮肤覆盖底盘，所述皮肤包括防水层，所述防水层被构造成防止水与所述集成电路装置接触，所述吸水层被构造成吸收水分。 还公开并要求保护其他实施例。
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公开(公告)号：US20080150112A1
公开(公告)日：2008-06-26
申请号：US11644297
申请日：2006-12-22
Applicant: Xuejiao Hu
Inventor： Xuejiao Hu
IPC: H01L23/02
CPC classification number: H01L25/0657 , H01L24/32 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06589 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated circuit dice, the thermal spacer comprising a heat conducting material and the thermal spacer overhanging and extending parallel with one outside edge of the bottom integrated circuit die. Other embodiments are also disclosed and claimed.
Abstract translation: 在一些实施例中，提出了用于堆叠管芯封装热管理的热隔离件。 在这方面，引入了一种装置，其具有顶部集成电路管芯，底部集成电路管芯和顶部和底部集成电路管芯之间的热隔离件，该热隔离件包括导热材料和热隔离件，其突出并平行延伸 具有底部集成电路裸片的一个外部边缘。 还公开并要求保护其他实施例。
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Patent Agency Ranking
公开(公告)号：US08084856B2
公开(公告)日：2011-12-27
申请号：US12748214
申请日：2010-03-26
Applicant: Xuejiao Hu
Inventor： Xuejiao Hu
CPC classification number: H01L25/0657 , H01L24/32 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06589 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated circuit dice, the thermal spacer comprising a heat conducting material and the thermal spacer overhanging and extending parallel with one outside edge of the bottom integrated circuit die. Other embodiments are also disclosed and claimed.
Abstract translation: 在一些实施例中，提出了用于堆叠管芯封装热管理的热隔离件。 在这方面，引入了一种装置，其具有顶部集成电路管芯，底部集成电路管芯和顶部和底部集成电路管芯之间的热隔离件，该热隔离件包括导热材料和热隔离件，其突出并平行延伸 具有底部集成电路裸片的一个外部边缘。 还公开并要求保护其他实施例。
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公开(公告)号：US08054629B2
公开(公告)日：2011-11-08
申请号：US12286708
申请日：2008-09-30
Applicant: Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
Inventor： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
CPC classification number: H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
Abstract translation: 本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。
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公开(公告)号：US20100079955A1
公开(公告)日：2010-04-01
申请号：US12286708
申请日：2008-09-30
Applicant: Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
Inventor： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC: H05K7/20
CPC classification number: H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
Abstract translation: 本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。
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公开(公告)号：US20080157348A1
公开(公告)日：2008-07-03
申请号：US11618593
申请日：2006-12-29
Applicant: Xuejiao HU , Chia-Pin CHIU
Inventor： Xuejiao HU , Chia-Pin CHIU
CPC classification number: H01L23/42 , H01L23/367 , H01L23/4275 , H01L2924/0002 , H01L2924/00
Abstract: The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a structure extending a distance outward therefrom. The thermal interface material includes a first region having a first thickness and a second region having a second thickness, the first thickness being smaller than the second thickness. The structure extending a distance outward from the heat spreader is positioned on the first region of the thermal interface material. The total of the first thickness of the thermal interface material and the distance the structure extends outward from the surface of the heat spreader is substantially the same as the second thickness. In one aspect of certain embodiments, the first region of the thermal interface material and the structure on the heat spreader are in alignment with a hot spot on the die. Other embodiments are described and claimed.
Abstract translation: 描述了包括通过热界面材料耦合到管芯的散热器的电子组件的形成。 在一个实施例中，散热器包括具有向外延伸一定距离的结构的表面。 热界面材料包括具有第一厚度的第一区域和具有第二厚度的第二区域，第一厚度小于第二厚度。 从散热器向外延伸一定距离的结构位于热界面材料的第一区域上。 热界面材料的第一厚度和结构从散热器表面向外延伸的距离的总和基本上与第二厚度相同。 在某些实施方案的一个方面，热界面材料的第一区域和散热器上的结构与模具上的热点对准。 描述和要求保护其他实施例。
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公开(公告)号：US20110277980A1
公开(公告)日：2011-11-17
申请号：US13189389
申请日：2011-07-22
Applicant: Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
Inventor： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC: F28F7/00
CPC classification number: H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
Abstract translation: 本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。
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