Communication between integrated circuit (IC) dies in wafer-level fan-out package

    公开(公告)号:US11721651B2

    公开(公告)日:2023-08-08

    申请号:US17037363

    申请日:2020-09-29

    Applicant: XILINX, INC.

    CPC classification number: H01L23/66 H01L23/5386 H01L25/16 H01L2224/02379

    Abstract: Examples described herein generally relate to communication between integrated circuit (IC) dies in a wafer-level fan-out package. In an example, an electronic device includes a wafer-level fan-out package. The wafer-level fan-out package includes a first integrated circuit (IC) die, a second IC die, and a redistribution structure. The first IC die includes a transmitter circuit. The second IC die includes a receiver circuit. The redistribution structure includes physical channels electrically connected to and between the transmitter circuit and the receiver circuit. The transmitter circuit is configured to transmit multiple single-ended data signals and a differential clock signal through the physical channels to the receiver circuit. The receiver circuit is configured to capture data from the multiple single-ended data signals using a first single-ended clock signal based on the differential clock signal.

    Circuits for and methods of calibrating a circuit in an integrated circuit device

    公开(公告)号:US11003203B2

    公开(公告)日:2021-05-11

    申请号:US16518365

    申请日:2019-07-22

    Applicant: Xilinx, Inc.

    Abstract: A circuit arrangement for calibrating a circuit in an integrated circuit device is described. The circuit arrangement may comprise a main circuit configured to receive input data at a first input and generate output data at a first output, wherein the output data is based upon the input data and a function of the main circuit; a replica circuit configured to receive calibration data at a second input and generate calibration output data, based upon the calibration data, at a second output, wherein the replica circuit provides a replica function of the function of the main circuit; and a calibration circuit configured to receive the output data from the main circuit during a foreground calibration mode, and the calibration output data from the replica circuit during a background calibration mode; wherein the calibration circuit provides control signals to the main circuit during the background calibration mode. A method of calibrating a circuit in an integrated circuit device is also described.

    CIRCUITS FOR AND METHODS OF CALIBRATING A CIRCUIT IN AN INTEGRATED CIRCUIT DEVICE

    公开(公告)号:US20200293080A1

    公开(公告)日:2020-09-17

    申请号:US16518365

    申请日:2019-07-22

    Applicant: Xilinx, Inc.

    Abstract: A circuit arrangement for calibrating a circuit in an integrated circuit device is described. The circuit arrangement may comprise a main circuit configured to receive input data at a first input and generate output data at a first output, wherein the output data is based upon the input data and a function of the main circuit; a replica circuit configured to receive calibration data at a second input and generate calibration output data, based upon the calibration data, at a second output, wherein the replica circuit provides a replica function of the function of the main circuit; and a calibration circuit configured to receive the output data from the main circuit during a foreground calibration mode, and the calibration output data from the replica circuit during a background calibration mode; wherein the calibration circuit provides control signals to the main circuit during the background calibration mode. A method of calibrating a circuit in an integrated circuit device is also described.

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