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    DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME
    1.
    发明申请
    DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME 审中-公开
    透明的太阳能电池和包括它的移动装置

    公开(公告)号：US20110061707A1

    公开(公告)日：2011-03-17

    申请号：US12650198

    申请日：2009-12-30

    申请人： Woon-Chun KIM ,  Hyun-Seop Shim ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Hyun-Seop Shim ,  Soon-Gyu Yim

    IPC分类号： H01L31/042

    CPC分类号： H01G9/2068 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/0028 ,  Y02E10/542 ,  Y02E10/549 ,  Y02P70/521

    摘要： A dye-sensitized solar cell and a mobile device including the same are disclosed. The dye-sensitized solar cell includes a first transparent substrate, which allows sunlight incident to pass through, a second substrate, which is formed apart from the first substrate, and a plurality of cells, which includes a first electrode, a second electrode, a light absorption layer and an electrolyte. Here, the first electrode and the second electrode are interposed between the first substrate and the second substrate, the first electrode is disposed on a rear surface of the first substrate, the second electrode is disposed on a front surface of the second substrate, the light absorption layer is interposed between the first electrode and the second electrode and includes metal oxide and a dye absorbed in the metal oxide, and the electrolyte is interposed between the first electrode and the second electrode.

    摘要翻译： 公开了一种染料敏化太阳能电池及其制造方法。 染料敏化太阳能电池包括允许阳光入射通过的第一透明基板，与第一基板分开形成的第二基板，以及多个单元，其包括第一电极，第二电极， 光吸收层和电解质。 这里，第一电极和第二电极介于第一基板和第二基板之间，第一电极设置在第一基板的后表面上，第二电极设置在第二基板的前表面上，光 吸收层插入在第一电极和第二电极之间，并且包括金属氧化物和吸收在金属氧化物中的染料，并且电解质介于第一电极和第二电极之间。

    DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME
    2.
    发明申请
    DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME 审中-公开
    透明的太阳能电池和包括它的移动装置

    公开(公告)号：US20110061727A1

    公开(公告)日：2011-03-17

    申请号：US12650236

    申请日：2009-12-30

    申请人： Woon-Chun KIM ,  Hyun-Seop Shim ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Hyun-Seop Shim ,  Soon-Gyu Yim

    IPC分类号： H01L31/00

    CPC分类号： H01G9/2068 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/0028 ,  Y02E10/542 ,  Y02E10/549 ,  Y02P70/521

    摘要： A dye-sensitized solar cell is disclosed. The dye-sensitized solar cell includes a first substrate, being transparent, a first electrode, formed on a rear surface of the first substrate, a second electrode, formed apart from the first electrode, a catalytic layer, formed on a rear surface of the first electrode, a light absorption layer, which is formed on a front surface of the second electrode and includes a dye absorbed into metal oxide such that the dye forms a specific pattern with the metal oxide, an electrolyte, interposed between the first electrode and the second electrode, a base layer, which is formed on a rear surface of the second electrode and forms a background against the pattern formed by the dye such that the pattern can be identified when viewed from the outside, and a second substrate, formed on a rear surface of the base layer.

    摘要翻译： 公开了一种染料敏化太阳能电池。 染料敏化太阳能电池包括：第一基板，其是透明的，形成在第一基板的后表面上的第一电极，与第一电极分开形成的第二电极，形成在第一基板的后表面上的催化剂层 第一电极，光吸收层，其形成在第二电极的前表面上，并且包括吸收到金属氧化物中的染料，使得染料与金属氧化物形成特定图案，介于第一电极和第二电极之间的电解质 第二电极，基底层，其形成在第二电极的后表面上并且形成与由染料形成的图案相对的背景，使得可以从外部观察图案;以及第二基底，形成在第二电极上 底层的后表面。

    ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
    电子元件嵌入式印刷电路板及其制造方法

    公开(公告)号：US20100101847A1

    公开(公告)日：2010-04-29

    申请号：US12416472

    申请日：2009-04-01

    申请人： Woon-Chun KIM ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Soon-Gyu Yim

    IPC分类号： H05K1/02 ,  H05K3/30

    CPC分类号： H05K1/186 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K3/061 ,  H05K3/323 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

    摘要翻译： 公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。 根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案 金属层 将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。 因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

    CAPACITOR
    4.
    发明申请
    CAPACITOR 审中-公开
    电容器

    公开(公告)号：US20100142116A1

    公开(公告)日：2010-06-10

    申请号：US12482104

    申请日：2009-06-10

    申请人： Woon-Chun KIM ,  Sung Yi ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Sung Yi ,  Soon-Gyu Yim

    IPC分类号： H01G4/255 ,  H01G4/06

    CPC分类号： H01G4/206 ,  H01G4/255

    摘要： A capacitor is disclosed. The capacitor in accordance with an embodiment of the present invention includes a first electrode, a dielectric substance, which is formed on the first electrode, a second electrode, which is formed on the dielectric substance, and a magnetic layer, which is interposed between the dielectric substance and at least one of the first electrode and the second electrode. In accordance with the present embodiment, dielectric loss can be reduced while minimizing the reduction of capacitance of the capacitor.

    摘要翻译： 公开了一种电容器。 根据本发明的实施例的电容器包括形成在第一电极上的第一电极，电介质，形成在电介质上的第二电极和介于物质之间的磁性层， 电介质物质和第一电极和第二电极中的至少一个。 根据本实施例，可以减小电容器的电容的减小同时减小介质损耗。

    MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
    5.
    发明申请
    MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板的制造方法

    公开(公告)号：US20100140100A1

    公开(公告)日：2010-06-10

    申请号：US12482122

    申请日：2009-06-10

    申请人： Woon-Chun KIM ,  Soon-Gyu Yim ,  Young-Ju Kim ,  Hwa-Jan Jung

    发明人： Woon-Chun KIM ,  Soon-Gyu Yim ,  Young-Ju Kim ,  Hwa-Jan Jung

    IPC分类号： H05K3/10 ,  C25D5/02

    CPC分类号： H05K3/205 ,  H05K3/108 ,  H05K2201/0376 ,  H05K2203/1152 ,  H05K2203/1536

    摘要： Disclosed is a method of manufacturing a printed circuit board. The method can include providing a carrier formed with a release layer, performing a roughening treatment on the release layer such that the release layer has surface roughness, forming a circuit pattern on the release layer, stacking the carrier on an insulating layer such that the circuit pattern is buried in the insulating layer, and separating the release layer and the carrier from the insulating layer and the circuit pattern.

    摘要翻译： 公开了印刷电路板的制造方法。 该方法可以包括提供形成有释放层的载体，对剥离层进行粗糙化处理，使得剥离层具有表面粗糙度，在剥离层上形成电路图案，将载体堆叠在绝缘层上，使得电路 将图案掩埋在绝缘层中，并且将隔离层和载体与绝缘层和电路图案分离。

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD 审中-公开
    印刷电路板和制造方法

    公开(公告)号：US20100051322A1

    公开(公告)日：2010-03-04

    申请号：US12367910

    申请日：2009-02-09

    申请人： Woon-Chun KIM ,  Soon-Gyu YIM

    发明人： Woon-Chun KIM ,  Soon-Gyu YIM

    IPC分类号： H05K1/00 ,  B32B38/00 ,  C25D7/00 ,  C23F1/00

    CPC分类号： B32B38/06 ,  B32B37/02 ,  B32B38/0036 ,  B32B2038/0092 ,  B32B2457/08 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4602 ,  H05K2201/0179 ,  H05K2201/0376 ,  H05K2203/1536

    摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes forming a relievo pattern corresponding to a first circuit pattern on a thin-film insulating layer stacked on a carrier; stacking and compressing the carrier with the insulator such that one surface of the carrier on which the relievo pattern is formed faces the insulator; transcribing the thin-film insulating layer and the relievo pattern in the insulator; exposing a part of the relievo pattern by opening a part of the thin-film insulating layer; and forming a second circuit pattern by selectively depositing a conductive metal on the thin-film insulating layer, can manufacture a printed circuit board having high-density circuit patterns by forming a double layer circuit patterns, one circuit pattern buried in the insulator and the other circuit pattern formed on the outer layer, without stacking the insulator for forming a multi-layered printed circuit board.

    摘要翻译： 公开了一种印刷电路板及其制造方法。 该方法包括在层叠在载体上的薄膜绝缘层上形成对应于第一电路图案的缓冲图案; 用绝缘体堆叠和压缩载体，使得形成有释放图案的载体的一个表面面向绝缘体; 转录绝缘体中的薄膜绝缘层和释放图案; 通过打开薄膜绝缘层的一部分来暴露一部分释放图案; 并且通过在薄膜绝缘层上选择性地沉积导电金属来形成第二电路图案，可以通过形成双层电路图案，埋在绝缘体中的一个电路图案和另一个电路图案来制造具有高密度电路图案的印刷电路板 电路图案形成在外层上，而不堆叠用于形成多层印刷电路板的绝缘体。

    ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
    电子元件嵌入式印刷电路板及其制造方法

    公开(公告)号：US20120124828A1

    公开(公告)日：2012-05-24

    申请号：US13362619

    申请日：2012-01-31

    申请人： Woon-Chun KIM ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Soon-Gyu Yim

    IPC分类号： H05K3/30 ,  H05K3/06 ,  H05K3/46 ,  H05K3/20

    CPC分类号： H05K1/186 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K3/061 ,  H05K3/323 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

    摘要翻译： 公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。 根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案 金属层 将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。 因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。