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    CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    CAPACITOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电容器及其制造方法

    公开(公告)号：US20100214719A1

    公开(公告)日：2010-08-26

    申请号：US12414030

    申请日：2009-03-30

    申请人： Woon Chun Kim ,  Sung Yi ,  Soon Gyu Yim

    发明人： Woon Chun Kim ,  Sung Yi ,  Soon Gyu Yim

    IPC分类号： H01G4/06 ,  B05D5/12 ,  H01G4/10

    CPC分类号： H01G4/33 ,  H01G4/10 ,  H01G4/18 ,  H01G4/206

    摘要： The present invention provides a capacitor including: a bottom electrode; a first dielectric layer formed on the bottom electrode; a conductive polymer layer formed on the first dielectric layer; a second dielectric layer formed on the conductive polymer layer; and a top electrode formed on the second dielectric layer, and a method of manufacturing the same.

    摘要翻译： 本发明提供一种电容器，包括：底部电极; 形成在所述底部电极上的第一电介质层; 形成在所述第一电介质层上的导电聚合物层; 形成在导电聚合物层上的第二电介质层; 以及形成在第二介电层上的顶电极及其制造方法。

    CAPACITOR
    2.
    发明申请
    CAPACITOR 审中-公开
    电容器

    公开(公告)号：US20100142116A1

    公开(公告)日：2010-06-10

    申请号：US12482104

    申请日：2009-06-10

    申请人： Woon-Chun KIM ,  Sung Yi ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Sung Yi ,  Soon-Gyu Yim

    IPC分类号： H01G4/255 ,  H01G4/06

    CPC分类号： H01G4/206 ,  H01G4/255

    摘要： A capacitor is disclosed. The capacitor in accordance with an embodiment of the present invention includes a first electrode, a dielectric substance, which is formed on the first electrode, a second electrode, which is formed on the dielectric substance, and a magnetic layer, which is interposed between the dielectric substance and at least one of the first electrode and the second electrode. In accordance with the present embodiment, dielectric loss can be reduced while minimizing the reduction of capacitance of the capacitor.

    摘要翻译： 公开了一种电容器。 根据本发明的实施例的电容器包括形成在第一电极上的第一电极，电介质，形成在电介质上的第二电极和介于物质之间的磁性层， 电介质物质和第一电极和第二电极中的至少一个。 根据本实施例，可以减小电容器的电容的减小同时减小介质损耗。

    LASER PROCESSING DEVICE
    4.
    发明申请
    LASER PROCESSING DEVICE 审中-公开
    激光加工设备

    公开(公告)号：US20100288739A1

    公开(公告)日：2010-11-18

    申请号：US12579755

    申请日：2009-10-15

    申请人： Jae-Kwang Lee ,  Sung Yi ,  Soon-Gyu Yim

    发明人： Jae-Kwang Lee ,  Sung Yi ,  Soon-Gyu Yim

    IPC分类号： B23K26/38

    CPC分类号： B23K26/032 ,  G01B9/02081 ,  G01B11/02 ,  H05K3/0035 ,  H05K2203/0207 ,  H05K2203/108 ,  H05K2203/163

    摘要： Disclosed is a laser processing device, which includes a processing beam source configured to irradiate a processing laser towards an object, a measuring beam source configured to irradiate a modulated measuring laser, an irradiator configured to align a path of the measuring laser with a path of the processing laser directed towards the object, a beam receiver configured to receive the measuring laser reflected from the object, an I/Q demodulator configured to calculate a phase difference between the measuring laser irradiated from the measuring beam source and the measuring laser received at the beam receiver, and a data processor configured to calculate a processed length of the object by using the phase difference. The invention can be used to measure the length of a laser-processed portion at the same time as the laser processing itself, so that the laser processing may be performed with improved precision.

    摘要翻译： 公开了一种激光处理装置，其包括被配置为朝向物体照射处理激光的处理光束源，被配置为照射调制测量激光的测量光束源，配置成将测量激光的路径与 所述处理激光器被引导到所述物体，被配置为接收从所述物体反射的所述测量激光器的光束接收器; I / Q解调器，被配置为计算从所述测量光束源照射的所述测量激光器与在所述测量激光器处接收的所述测量激光器之间的相位差 以及数据处理器，被配置为通过使用所述相位差来计算所述对象的处理长度。 本发明可以用于与激光加工本身同时测量激光加工部分的长度，使得可以以更高的精度执行激光加工。

    Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
    7.
    发明申请
    Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof 审中-公开
    用于电容器嵌入式印刷电路板的基板，电容器嵌入式印刷电路板及其制造方法

    公开(公告)号：US20090244864A1

    公开(公告)日：2009-10-01

    申请号：US12320794

    申请日：2009-02-04

    申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

    发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

    IPC分类号： H05K1/18 ,  B32B7/00 ,  B32B37/02

    CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/387 ,  H05K3/4602 ,  H05K3/4626 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672 ,  Y10T428/24355

    摘要： Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).

    摘要翻译： 公开了用于电容器嵌入式印刷电路板的基板，电容器嵌入式印刷电路板及其制造方法。 电容器嵌入式印刷电路板可以包括堆叠在芯板上的芯板，绝缘树脂层，埋在绝缘树脂层中的第一电极和第一电路图案，介电层，其是 堆叠在绝缘树脂层的表面上，堆叠在电介质层上的第一粘合树脂层和形成在第一粘合树脂层的表面上的第二电极和第二电路图案，以对应于 第一电极。 利用本发明，可以简化制造工艺，并且可以通过减小电容器（C）的变化来提高产品的可靠性。

    PCB AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    PCB AND MANUFACTURING METHOD THEREOF 有权
    PCB及其制造方法

    公开(公告)号：US20090178840A1

    公开(公告)日：2009-07-16

    申请号：US12351333

    申请日：2009-01-09

    申请人： Woon-Chun Kim ,  Sung Yi

    发明人： Woon-Chun Kim ,  Sung Yi

    IPC分类号： H05K1/11 ,  H05K3/02 ,  H05K3/06

    CPC分类号： H05K3/387 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4661 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

    摘要翻译： 公开了印刷电路板及其制造方法。 根据本发明的实施例的方法包括：提供其上依次层叠有第一绝缘层，第一电路图案，第二绝缘层和树脂层的基板; 镗孔穿透基底的通孔; 通过去污工艺在树脂层上形成粗糙度; 形成通过所述通孔在层之间形成电连接的通孔; 并在其上形成粗糙度的树脂层上形成第二电路图案。